Off-Chip Rf Components - LG -E510 Service Manual

3.6 OFF-CHIP RF COMPONENTS

3.6.2. UMTS PAM (U1002, SKY77195)
The SKY77195 Power Amplifier Module (PAM) is a fully matched, 14-pad, surface mount module developed for
Wideband Code Division Multiple Access (WCDMA) applications. This small and efficient module packs full WCDMA
Band I and Band VIII coverage into a single compact package. The SKY77195 meets the stringent spectral linearity
requirements of WCDMA transmission, with high power added efficiency for power output to 7.5 dBm (Band I) and
8 dBm (Band VIII). The SKY77195 meets the stringent spectral linearity requirements of High Speed Downlink Packet
Access (HSDPA)
data transmission with high power added efficiency. A directional coupler is integrated into the module thus
eliminating the need for any external coupler.
The single Gallium Arsenide (GaAs) Microwave Monolithic Integrated Circuit (MMIC) contains all active circuitry in the
module. The MMIC contains on-board bias circuitry, as well as input and interstage matching circuits. Output match
into a 50-ohm load is realized off-chip within the module package to optimize efficiency and power performance
LGE Internal Use Only
SKY77195 (W2100,W900)
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3. TECHNICAL BRIEF
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