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6. REPAIR GUIDE
6.1 Disassemble Main Board
Main Board (with camera Module)
Main Board
(disassembled parts that vulnerable to heat)
Description
1. Disassemble the main board from the Phone.
. Disassemble parts that vulnerable to heat around the camera module.
ex)Electric wire, Dome Key and so on.
LGE Internal Use Only
Disassemble Electric wire and some part that
vulnerable to heat.
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6. REPAIR GUIDE
Only for training and service purposes
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