Package Information; P-Dip Package - Siemens C500 User Manual

5

Package Information

This chapter shows typical package outlines of the packages which are actually used for the
microcontrollers of the C500 family. The appropriate data sheet should always be regarded when
the package of a specific C500 microcontroller has to be referenced.
5.1

P-DIP Package

P-DIP-40-3
(Plastic Dual In-line Package)
SMD = Surface Mounted Device
Figure 5-1
P-DIP-40-3 Package Outlines
Semiconductor Group 5-1
Package Information
C500 Family
GPD05883
Dimensions in mm
1998-04-01