LG lg530g Service Manual page 177

Level LocationNo.
6 X700 Crystal
Capacitor
6 C352
TA,Conformal
C308
Capacitor
6 C725
Ceramic,Chip
C732
R213
6 Resistor,Chip
R214
C332
C333
C343
Capacitor
6 C351
Ceramic,Chip
C371
C372
C373
6 X301 Crystal
Connector,Terminal
6 CN300
Block
VA604
6 Varistor
VA605
6 U700 IC,Bluetooth
L303
Inductor
6 L304
Multilayer,Chip
L305
L300
Inductor,Wire
6 L301
Wound,Chip
L302
Capacitor
6 C200
Ceramic,Chip
6 R1127 Resistor,Chip
LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
Description PartNumber
EXXY0026401
ECTH0002002
ECZH0000830
ERHZ0000428
ECCH0007802
EAW61703601
EAG63251001
SEVY0005202
EUSY0418701
ELCH0004715
ELCP0008014
ECCH0042201
ERHZ0000443
Spec
FA-20H FA-20H,26 MHz,10 PPM,8.0 pF,40
ohm,SMD,25*20*0.45,CL=8.0pF,C0=1.0pF,C1=3.6p
F EPSON TOYOCOM CORP
F981A336MSA 33uF 20% 10V 3.3UA -55TO+125C
6OHM 2.0X1.25X0.8MM NONE SMD R/TP 0.9T
max. NICHICON CORPORATION, EAST JAPAN
SALES OFFICE
C1005C0G1H330JT000F 33pF 5% 50V NP0 -
55TO+125C 1005 R/TP - TDK KOREA
COOPERATION
MCR01MZP5J180 18OHM 5% 1/16W 1005 R/TP -
ROHM.
CL10A475KP8NNNC 4.7uF 10% 10V X5R -
55TO+85C 1608 R/TP - SAMSUNG ELECTRO-
MECHANICS CO., LTD.
1ZCB19200AB0E 19.2MHZ 10PPM 7F , SMD R/TP
DAISHINKU CORPORATION.
KQ03LX1-3R 3P 2.50MM ANGLE DIP R/TP -
HIROSE KOREA CO.,LTD
EVLC5S02100 5.5V 0% 100F 1.0*0.5*0.6 UL SMD
R/TP AMOTECH CO., LTD.
BCM2070B2KUBXG 2.3VTO5.5V 158.4mW 42P -
WLBGA R/TP 42P BROADCOM ASIA
DISTRIBUTION PTE LTD
1005GC2T27NJLF 27NH 5% - 200mA 0.9OHM
1.4GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
PILKOR ELECTRONICS LTD.
MIPSZ2012D4R7 4.7UH 30% - 280mA 0.28 0.7
0.23OHM - - SHIELD 2.0X1.2X0.9 NONE R/TP
FDK CORPORATION.
CL03C020CA3GNNH 2pF 0.25PF 25V C0G -
55TO+125C 0603 R/TP 0.3+-0.03 SAMSUNG
ELECTRO-MECHANICS CO., LTD.
MCR01MZP5J222 2.2KOHM 5% 1/16W 1005 R/TP
- ROHM.
- 177 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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Only for training and service purposes