Table Of Contents - Sony SCD-XB770 Service Manual

SCD-XB770

TABLE OF CONTENTS

1. SERVICING NOTES
2. GENERAL
................................................................... 5
3. DISASSEMBLY
3-1. Disassembly Flow ........................................................... 8
3-2. Cover ............................................................................... 9
3-3. Front Panel Section ......................................................... 9
3-4. AUDIO Board, MAIN Board .......................................... 10
3-5. Mechanism Deck (CDM66B-DVBU6) .......................... 10
3-6. Base Unit (DVBU-6) ....................................................... 11
4. DIAGRAMS
4-1. Notes for Printed Wiring Boards and
Schematic Diagrams ....................................................... 13
4-2. Schematic Diagram - RF Board - ................................. 14
4-3. Printed Wiring Boards
- RF/LOADING Boards - .............................................. 15
4-4. Printed Wiring Board
- MAIN Board (Component Side) - .............................. 16
4-5. Printed Wiring Board
- MAIN Board (Conductor Side) - ................................ 17
4-6. Schematic Diagram
- MAIN (1/5)/ LOADING Boards - ............................. 18
4-7. Schematic Diagram - MAIN Board (2/5) - .................. 19
4-8. Schematic Diagram - MAIN Board (3/5) - .................. 20
4-9. Schematic Diagram - MAIN Board (4/5) - .................. 21
4-10. Schematic Diagram - MAIN Board (5/5) - .................. 22
4-11. Schematic Diagram - AUDIO/HP Boards - ................. 23
4-12. Printed Wiring Board
- AUDIO Board (Component Side) - ............................ 24
4-13. Printed Wiring Boards
- AUDIO (Conductor Side)/HP Boards - ..................... 25
4-14. Printed Wiring Boards - DISPLAY/KEY Boards - ...... 26
4-15. Schematic Diagram - DISPLAY/KEY Boards - .......... 27
4-16. Printed Wiring Boards
- POWER/TRANS Boards - .......................................... 28
4-17. Schematic Diagram - POWER/TRANS Boards - ........ 29
4-18. IC Pin Function Description ........................................... 37
5. EXPLODED VIEWS
5-1. Cover Section .................................................................. 52
5-2. Front Panel Section ......................................................... 53
5-3. Chassis Section ............................................................... 54
5-4. Mechanism Deck Section (CDM66B-DVBU6) ............. 55
5-5. Base Unit Section (DVBU-6) ......................................... 56
6. ELECTRICAL PARTS LIST
2
............................................... 3
............................... 57
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
This appliance is classified as a CLASS 1
LASER product.
The CLASS 1 LASER PRODUCT
MARKING is located on the rear exterior.
The following caution label is located
inside the unit.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED
LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.