Nokia N72 Service Manual page 245

RM-180
System Module
Application processor
OMAP3.3
Helen3 (OMAP1710) MPU subsystem
System DMA component
DSP subsystem
Internal memory subsystem
Secure modules
Memory interfaces
Issue 1
Figure 88 Application processor high level block diagram
Section
COMPANY CONFIDENTIAL
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Description
also called an application ASIC because it is
processing application SW and handles the UI SW.
It consists of OMAP3.3 and peripheral subsystems
like camera, display and keyboard driver blocks.
consists of ARM926 (MPU subsystem), TMS320C55x
(DSP subsystem), DMA and OMAP3.3s internal
peripherals.
based on an ARM926EJ. MPU is able to perform most
of the application operations on the chip.
mainly used to help the MPU and DSP perform data
memory transfer-specific tasks, leaving more
available MIPS for both processors.
based on a TMS320C55x™ DSP core, which is
responsible for intensive data computing tasks like
real-time audio and video handling on application
side, e.g. voice recording.
composed of a single port SRAM.
Application processor contains a set of several
components, including ROM, a single port SRAM, and
eFUSE cells. These components enable the system to
support secure applications.
The memory interfaces define the system memory
access organization of application processor.
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