Table Of Contents - Sony RCD-W500C Service Manual
Compact disc recorder
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Also See for RCD-W500C:
- Operating instructions manual (40 pages) ,
- Specifications (2 pages)
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Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
TABLE OF CONTENTS
1. SERVICING NOTE ·····················································
2. GENERAL ···································································
3. DISASSEMBLY ··························································
3-1. Case (409538) ······························································· 7
3-2. Loading Panel (CDR) ··················································· 7
3-3. Front Panel Section ······················································· 8
3-4. SW Board, LED Board, DISP Board ···························· 8
3-5. CD Mechanism Deck (CDM65-RBD2) ······················· 9
3-6. Tray ··············································································· 9
3-7. CDR Board ································································· 10
3-8. Motor Assy (Loading) (M201) ··································· 10
3-9. Holder (MG) Sub Assy, Dust Cover ··························· 11
3-10. Optical Pick-Up (KRM-220CAA) ······························ 11
3-11. Cam (CH) ···································································· 12
3-12. MAIN Board ······························································· 12
3-13. CD Mechanism Deck (CDM53L-30B61M) ··············· 13
3-14. Fitting Base (Magnet) Assy ········································ 13
Motor (Clamp) Assy (M701) ······································ 14
3-16. Fitting Base (Guide) Assy, Bracket (Chassis) ············· 14
3-17. Tray (Sub) ··································································· 15
3-18. Chassis (Mold B) ························································ 15
Motor (Loading) Assy (M702) ··································· 16
3-20. Stocker Section ··························································· 16
Slider (Shutter) ···························································· 17
Gear (Gear B), Gear (Gear A) Installation ·················· 18
3-23. Gear (Chucking) ························································· 18
3-24. BD Board ···································································· 19
3-25. Optical Block Section ················································· 19
···································································· 20
CD SECTION ····························································· 23
CD-R/RW SECTION ·················································· 25
······································································ 55
6-1. Block Diagrams - CD-R Section - ··························· 56
- CD Section - ······························· 57
- POWER/DISPLAY Section - ······ 58
6-2. Printed Wiring Boards - BD Section - ······················· 59
6-3. Schematic Diagrams - BD Section - ·························· 60
6-4. Printed Wiring Boards
- SENSER/MOTOR/SW Section - ····· 61
6-5. Schematic Diagrams
- SENSER/MOTOR/SW Section - ····· 62
6-8. Schematic Diagrams - CD-R Section (1/4) - ············· 65
6-9. Schematic Diagrams - CD-R Section (2/4) - ············· 66
6-10. Schematic Diagrams - CD-R Section (3/4) - ············· 67
6-11. Schematic Diagrams - CD-R Section (4/4) - ············· 68
6-14. Schematic Diagrams - MAIN Section (1/2) - ············ 71
6-15. Schematic Diagrams - MAIN Section (2/2) - ············ 72
6-16. Printed Wiring Boards - LED Section - ····················· 73
6-17. Schematic Diagrams - LED Section - ······················· 74
6-18. Printed Wiring Boards - DISPLAY Section - ············ 75
6-19. Schematic Diagrams - DISPLAY Section - ··············· 76
6-20. IC Block Diagrams ····················································· 77
6-21. IC Pin Function Description ······································· 84
7-1. Case Section ·································································· 94
7-2. Front Panel Section ······················································· 95
7-3. Chassis Section ····························································· 96
7-4. Overall Section (CDM53L-30B61M) ··························· 97
7-5. Chassis (Mold) Assy Section (CDM53L-30B61M) ·········· 98
7-6. Chassis Section (CDM53L-30B61M) ·························· 99
7-7. Base Unit Section (BU-30BBD61M) ························· 100
7-8. CDM65-RBD2 ···························································· 101
RCD-W500C
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