Table of Contents
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Wireless Module
Item
Manufacturer
Specifications
LAN Module
Item
Chipset
Specifications
Bluetooth
Chipset
Data throughput
Protocol
Interface
Connector type
Hard Disk Drive Interface
Item
Capacity (MB)
Vendor &
Model Name
Bytes per
sector
Data heads
Drive Format
Disks
20
Item
Seagate
HGST
2
1
Specification
•
Atheros HB93, Broadcomm 43225, Atheros HB97,
Atheros HB95BG
•
IEEE 802.11b/g and Draft-N1 compliant
•
Advanced security via 802.11i
•
Industry-leading power consumption
•
Includes Wi-Fi PAN – Intel® My WiFi Technology
•
Easy to use Intel® PROSet v12.5 WLAN Software
•
Advanced IT capabilities with Intel® PROSet
Software4
•
Support for Cisco Compatible Extensions* v4
•
Connect with Intel® Centrino® program eligible
Specification
•
Atheros AR8151 GbE LAN Controller with Integrated
Transceiver
•
Integrated PHY for 10/100/1000 Mbps
•
Supports automatic MDI/MDIX functions
•
PCI Express base 1.1 compliant
•
Wake on LAN support
•
256 byte memory (using eFuse) embedded on chip
•
Supports up to 25% over-clocking without requiring
BIOS support
•
Supports Energy Star 5.0
Small footprint 40-pin QFN (5 x 5 mm) package
•
with dramatically improved
characteristics over LQFP packaging
Specification
T60H928.33 miniUSB module
2.1
USB 2.0
8 pin narrow pitch connector
Specification
160
Toshiba
512
1
thermal and electrical
WD
Samsung
1
Chapter 1
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