HP Pavilion 14 Series Maintenance And Service Manual page 75

a. Service door (see
b. Optical drive (see
c. Top cover (see
d. System board (see
e. Fan (see Fan on page
Remove the heat sink assembly:
1. Turn the system board upside down, with the front toward you.
NOTE: Steps 2 through 4 apply to computer models equipped with switchable discrete graphics. See
steps 5 through 7 for heat sink assembly removal information for computer models equipped with UMA
graphics.
2. Remove the four Phillips M2.5x4.0 screws (1) and the three Phillips PM2.5x4.0 screws (2) that secure
the heat sink assembly to the system board.
3. Remove the heat sink assembly (3) from the system board.
NOTE: Due to the adhesive quality of the thermal material located between the heat sink assembly
and the system board components, it may be necessary to move the heat sink assembly from side to
side to detach it.
4. Remove the thermal material. The thermal material must be thoroughly cleaned from the surfaces of
the heat sink assembly and the system board components each time the heat sink assembly is
removed. Replacement thermal material is included with the heat sink assembly and system board
spare part kits.
●
Thermal paste is used on the processor (1) and the heat sink assembly section (2) that services it
●
Thermal paste is used on the graphics subsystem chip (3) and the heat sink assembly section (4)
that services it
Service door on page 38)
Optical drive on page
Top cover on page 47)
System board on page
63)
40)
57)
Component replacement procedures 65