Samsung FH070EAV Servise Manual page 64

■ INDOOR MAIN PCB(DB93-04741C cont.)
Location No. Code No.
CN75 3711-003405
CN74 3711-003406
CN91 3711-004712
CN10 3711-005716
SCREW 6002-000630
FT71 DB27-00032A
SW04 DB34-00009A
SW02 DB34-00010A
PCB DB41-00583A
F701 DB61-00924A
IC01 DB62-03085A
LABEL DB68-02809A
IC04 DB91-00642B
IC04 DB09-00338A
Samsung Electronics
Description Specification
HEADER-BOARD TO CABLE 1WALL,2P,1R,7.92mm,STRAIGHT,SN,BLK
HEADER-BOARD TO CABLE 1WALL,2P,1R,7.92MM,STRAIGHT,SN,YEL
HEADER-BOARD TO CABLE BOX,9P,1R,2mm,STRAIGHT,SN,WHT
HEADER-BOARD TO CABLE BOX,10P,1R,2mm,STRAIGHT,SN,BLK
SCREW-TAPPING PH,+,-,2S,M3,L8,ZPC(WHT),SWRCH18A,-
COIL CHOKE -,-,14mH MIN AT 1KHz(1V),-,-,-,2.5A,Φ19x11x13,-,20*28*20,-
,Φ0.5,480PCS/PACK,-,
SWITCH-DIGITAL PT65 103,ROTARY DIP,-,DC24V Max,0.4VA,50mOhm Max,-
,BULK,10mm*10mm,straight,-,-,-
SWITCH-DIGITAL PT65 503,ROTARY DIP,-,DC24V MAX,0.4VA,50MOHM MAX,-
,BULK,10MM*10MM,STRAIGHT,-,-,-
PCB MAIN FH052EAMC,-,2,FR-4,2mm,15CM*7CM,-,3,-,SSEC
HOLDER-FUSE -,FH-51B,-,-,-,-,SSEC
HEAT SINK -,A6063,25,15,15,-,-,SSEC
LABEL BAR CODE -,-,-,-,W170,L115,-,-,-,FOR PACKING CASE
ASSY-MIC 08 Galaxy1 PJT -EH035EAV1,TH026EAV1 10 micom,STM-
0822-BS, MB90F823, ROM 128K bytes
IC MICOM MB90F823,-,80 P,5 V,24 MHz,Flash Memory,-
,24,16,QFP,QFP,14 * 20 mm,16,-40 ~ 85
Q'ty SA/SNA Remark
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
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