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LG U8290 Service Manual

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Service Manual
U8290
Date: August, 2005 / Issue 1.0

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Summary of Contents for LG U8290

  • Page 1 Service Manual U8290 Date: August, 2005 / Issue 1.0...

  • Page 2: Table Of Contents

    Table Of Contents 1. INTRODUCTION ......6 3.5.9 GSM band Rx RF filter ....37 3.5.10 VCTCXO ........37 1.1 Purpose........... 6 3.5.11 UMTS Rx VCO......37 1.2 Regulatory Information......6 3.5.12 Bluetooth........37 2. PERFORMANCE......8 3. BB Technical Description..... 39 2.1 System Overview ........
  • Page 3 4.7 Bluetooth RF Block ....... 99 7.3 Calibration Explanation ....... 176 4.8 LG-U8290 Main features..... 102 7.3.1 Overview ........176 4.9 LG-U8290 Main Component ....103 7.3.2 Calibration Items ......176 7.3.3 EGSM 900 Calibration Items ..177 4.10 Power ON Trouble ......107 7.3.4 DCS 1800 Calibration Items ..
  • Page 4 Table Of Contents 9. PCB LAYOUT ....... 203 10. EXPLODED VIEW & REPLACEMENT PART LIST ..208 10.1 EXPLODED VIEW ......208 10.2 Replacement Parts <Mechanic component>....209 <Main component> ......214 10.3 Accessory ......... 232 - 5 -...

  • Page 5: Introduction

    1. INTRODUCTION 1. INTRODUCTION 1.1 Purpose This manual provides the information necessary to repair, calibration, description and download the features of this model. 1.2 Regulatory Information A. Security Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services.
  • Page 6 1. INTRODUCTION E. Notice of Radiated Emissions This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user. F.

  • Page 7: Performance

    2. PERFORMANCE 2. PERFORMANCE 2.1 System Overview Item Specification Shape GSM900/1800/1900 and WCDMA Folder Handset Size 89.2 X 47.8 X 24.5 mm Weight 115 g (with Battery) Power 4.0V normal, 1400 mAh Li-Polymer Over 170 min (WCDMA, Tx=12 dBm, Voice) Talk Time Over 220 min (GSM, Tx=Max, Voice) Over 170 Hrs (WCDMA, DRX=1.28)

  • Page 8: Usable Environment

    2. PERFORMANCE 2.2 Usable environment 1) Environment Item Spec. Voltage 4.0 V(Typ), 3.38 V(Min), [Shut Down : 3.28 V] -20 ~ +60 °C Operation Temp -30 ~ +85 °C Storage Temp Humidity 85 % (Max) 2) Environment (Accessory) Item Spec. Typ.
  • Page 9 2. PERFORMANCE Item DCS & PCS 30M~1GHz -36dBm 30M ~ 1GHz -36dBm MS allocated 1G~[A]MHz -30dBm Channel [A]M~[B]MHz -36dBm 1G ~ 4GHz -30dBm Radiated [B]M~4GHz -30dBm Spurious 30M ~ 880MHz -57dBm 30M~880MHz -57dBm Emission 880M ~ 915MHz -59dBm 880M~915MHz -59dBm 915M~1GHz -57dBm 915M~1GHz...
  • Page 10 2. PERFORMANCE Item DCS & PCS Frequency offset 800kHz Intermodulation product should Intermodulation attenuation – be Less than 55dB below the level of Wanted signal Power control Power Tolerance Power control Power Tolerance Level (dBm) (dB) Level (dBm) (dB) ±3 ±3 ±3 ±3...
  • Page 11 2. PERFORMANCE 2) Transmitter-WCDMA Mode Item Specification Class3: +24dBm(+1/-3dB) Maximum Output Power Class4: +21dBm(±2dB) Frequency Error ±0.1ppm Open Loop Power control in uplink ±9dB@normal, ±12dB@extreme Adjust output(TPC command) +0.5/1.5 +1/3 +1.5/4.5 Inner Loop Power control in uplink -0.5/+0.5 -0.5/+0.5 -0.5/+0.5 -0.5/-1.5 -1/-3 -1.5/-4.5...
  • Page 12 2. PERFORMANCE Item Specification 33dB@5MHz, ACP>-50dBm Adjacent Channel Leakage Ratio(ACLR) 43dB@10MHz, ACP>-50dBm -36dBm@f=9~150KHz, 1K BW -36dBm@f=50KHz~30MHz, 10K BW -36dBm@f=30MHz~1000MHz, 100K BW Spurious Emissions -30dBm@f=1~12.5GHz, 1M BW (*: additional requirement) (*)-41dBm@f=1893.5~1919.6MHz, 300K (*)-67dBm@f=925~935MHz, 100K BW (*)-79dBm@f=935~960MHz, 100K BW (*)-71dBm@f=1805~1880MHz, 100K BW -31dBc@5MHz,Interferer -40dBc Transmit Intermodulation -41dBc@10MHz, Interferer -40dBc...
  • Page 13 2. PERFORMANCE 4) Receiver - WCDMA Mode Item Specification Reference Sensivitivity Level -106.7dBm(3.84 MHz) -25dBm(3.84MHz) Maximum Input Level -44dBm/3.84MHz(DPCH_Ec) UE@+20dBm output power(Class3) 33dB Adjacent Channel Selectivity(ACS) UE@+20dBm output power(Class3) -56dBm/3.84MHz@10MHz In-band Blocking UE@+20dBm output power(Class3) -44dBm/3.84MHz@15MHz UE@+20dBm output power(Class3) -44dBm/3.84MHz@f=2050~2095 and 2185~2230MHz UE@+20dBm output power(Class3) -30dBm/3.84MHz@f=2025~2050 and...

  • Page 14: Current Consumption

    2. PERFORMANCE 2.4 Current Consumption Stand by Voice Call Under 8.5 mA Under 450 mA Under 640mA WCDMA (DRX=1.28) (Tx=12dBm) (Tx=12dBm) Under 6.3 mA Under 380 mA (Paging=9period) (Tx=Max) Under 7.0 mA (@Bluetooth Connected, Paging=9period) (Stand by and Voice Call Test Condition : Bluetooth off, LCD backlight Off) (VT Test Condition : Speaker off, LCD backlight On) 2.5 RSSI Bar Level Change...

  • Page 15: Sound Pressure Level

    2. PERFORMANCE 2.7 Sound Pressure Level Test Item Specification Sending Loudness Rating (SLR) 8 ±3 dB -7 ±3 dB Receiving Loudness Rating (RLR) -18 ±3 dB Side Tone Masking Rating (STMR) 17 dB Echo Loss (EL) 40 dB Sending Distortion (SD) Refer to Table 30.3 Receiving Distortion (RD) Refer to Table 30.4...

  • Page 16: Charging

    2. PERFORMANCE 2.8 Charging • Charging Method : CC & CV (Constant Current and Constant Voltage) • Maximum Charging Voltage : 4.2 V • Maximum Charging Current : 600 mA • Normal Battery Capacity : 1400 mAh • Charging Time : Max 4.0 hours (except for trickle charging time) •...

  • Page 17: Technical Brief

    3. TECHNICAL BRIEF 3.1 General Description The U8290 supports UMTS-2100 DS-WCDMA, EGSM-900, DCS-1800, and PCS-1900. All receivers and the UMTS transmitter use the radioOne1Zero-IF architecture to eliminate intermediate frequencies, directly converting signals between RF and baseband. The EGSM, DCS1800 and PCS1900 transmitters use a baseband-to-IF upconversion followed by an offset phase-locked loop that translates the GMSK-modulated signal to RF.
  • Page 18 3. TECHNICAL BRIEF A generic, high-level functional block diagram of U8290 is shown in Figure 1-1. One antenna collects base station forward link signals and radiates handset reverse link signals. The antenna connects with receive and transmit paths through a switch module (plus a duplexer for UMTS-2100 operation).
  • Page 19 3. TECHNICAL BRIEF The device’s general housekeeping functions include an ADC and analog multiplexer circuit for monitoring on-chip voltage sources, charging status, and current flow, as well as user-defined off-chip variables such as temperature, RF output power, and battery ID. Various oscillator, clock, and counter circuits support IC and higher-level handset functions.

  • Page 20: Gsm Mode

    DCS, and PCS). The antenna switch module allows multiple operating bands and modes to share the same antenna. In U8290, a common antenna connects to one of six paths: 1) UMTS-2100 Rx/Tx, 2) EGSM-900 Rx, 3) EGSM-900 Tx, 4) DCS-1800 Rx, and 5) DCS-1800,PCS-1900 Tx(High Band Tx’s share the same path), 6) PCS-1900 Rx.
  • Page 21 3. TECHNICAL BRIEF The EGSM, DCS, and PCS receiver inputs of RTR6250 are connected directly to the transceiver front- end circuits(filters and antenna switch module). EGSM, DCS, and PCS receiver inputs are similar to the RFR6200 UMTS Rx input in that they also use differential configurations to improve common- mode rejection and second-order non-linearity performance.
  • Page 22 3. TECHNICAL BRIEF Figure 3.2.1-1 RTR6250 IC Functional Block Diagram - 23 -...

  • Page 23: Gsm Transmitter

    3. TECHNICAL BRIEF 3.2.2 GSM Transmitter The shared GSM Low-band (EGSM900) and High-band (DCS1800, PCS1900) transmit path begins with the baseband inputs from the MSM6250 IC. These differential analog input signals are buffered, lowpass filtered, corrected for DC offsets then applied to the GSM quadrature upconverter. The upconverter LO signals are generated from the transceiver VCO signal by the LO distribution and generation circuits within RTR6250.

  • Page 24: Wcdma Mode

    3. TECHNICAL BRIEF The waveform at the dual Tx VCO output is the GMSK-modulated signal centered at the desired GSM channel frequency. A phase-locked loop circuit is used to translate the GMSK-modulated signal from IF to RF primarily for two reasons: 1.
  • Page 25 3. TECHNICAL BRIEF VDDM VDDA Bias and SBCK R_BIAS Control SBST SBDT Circuits UMTS_BIAS UMTS_IN UMTS_OUT Ground Slug Figure 3.3.1-1 RFL6200 IC functional block diagram The UMTS LNA output is routed to the RFR6200 through a band selection filter that transforms a single-ended 50Ω...
  • Page 26 3. TECHNICAL BRIEF The RFR6200 IC includes LO generation and distribution circuitry to reduce offchip component requirements. The UMTS Rx LO source is created using an external UMTS Rx CH VCO that is closed- loop controlled by the RTR6250 PLL2 via a discrete loop filter. The external UMTS_RX_VCO signal is processed by the LO generation and distribution circuits to create the quadrature downconverter LO signal.

  • Page 27: Transmitter

    The RTR6200 UMTS output is routed to its power amplifier through a bandpass filter, and delivers fairly high-level signals that are filtered and applied to the PA. The PA device used in U8290 is “Load Insensitive PA”- no need to use isolator - and routed to the duplexer Tx port directly. Transmit power is delivered from the duplexer to the antenna through the switch module.

  • Page 28: Lo Phase-Locked Loop

    AC-couple the inactive pin to ground using an appropriately valued capacitor (12 pF is used in U8290). The 27 pF capacitor should be used to AC-couple the active pin to the VCO signal. Using only the selected VCO signal, the RFR6200 IC LO generation and distribution circuits create the necessary LO signals for the active quadrature downconverter.

  • Page 29: Transceiver Pll (Pll1)

    3. TECHNICAL BRIEF Most UMTS Rx PLL circuits are included within the RTR6250 IC: reference divider, phase detector, charge pump, feedback divider, and digital logic that generate LOCK status. The buffered 19.2 MHz TCXO signal provides the synthesizer input (REF), the frequency reference to which the PLL is phase and frequency locked.

  • Page 30: Off-Chip Rf Components

    A UMTS duplexer splits a single operating band into receive and transmit paths. Important performance requirements include: -. Insertion loss . this component is also in the receive and transmit paths; In the U8290 typical losses: UMTS Tx = 1.2 dB, UMTS Rx = 1.5 dB.

  • Page 31: Umts Power Amplifier

    3. TECHNICAL BRIEF -. Return loss . minimize mismatch losses with typical return losses of 10 dB or more (VSWR <2:1). -. Power handling . high power levels in the transmit path must be accommodated without degraded performance. The specified level depends on the operating band class and mobile station class (per the applicable standard), as well as circuit losses and antenna EIRP.

  • Page 32: Thermistor

    Its detector coupling range and converted voltage is based on diode sensitivity and transmitter power level. The U8290 uses National Semiconductor LMV225TLX power detector IC. In Figure 3.5.5-1, R1 is set to 1.8 resulting in an attenuation of 31.4dB. The output voltage is proportional to the logarithm of the input power.

  • Page 33: Dual Band Gsm Power Amplifier

    3. TECHNICAL BRIEF Figure 3.5.5-1 Block diagram of LMV225TLX with high resistive tap Figure 3.5.5-2 Power detector response, Vout vs PA output power 3.5.6 Dual band GSM power amplifier (U209 : SKY77328) The SKY77328 Power Amplifier Module (PAM) is designed in a low profile (1.2 mm), compact form factor for quad-band cellular handsets comprising GSM850/900, DCS1800, and PCS1900 operation.
  • Page 34 3. TECHNICAL BRIEF Fabricated onto a single Gallium Arsenide (GaAs) die, one Heterojunction Bipolar Transistor (HBT) PA block supports the GSM850/900 bands and the other supports the DCS1800 and PCS1900 bands. Both PA blocks share common power supply pins to distribute current. The GaAs die, the Silicon (Si) die, and the passive components are mounted on a multi-layer laminate substrate.

  • Page 35: Gsm Transmit Vco

    3. TECHNICAL BRIEF 3.5.7 GSM transmit VCO (U210 : MQW5V0C869M) The dual Tx VCO is a key component within the GSM OPLL. This VCO performance directly impacts PLL and transmitter performance. VCO specifications refer to muRata MQW5V0C869M datasheet. The dual Tx VCO outputs, one for Low-band GSM and one for high band, drive a resistive network that splits the active signal into two signals: 1) the input to the active PA.

  • Page 36: Gsm Band Rx Rf Filter

    3.5.12 Bluetooth (U406 : LBDA254AN0, ANT400 : LDA31) The MSM6250 includes BT baseband embedded BT 1.1 compliant baseband core, so the other bluetooth components are an bluetooth RF module and Antenna. Figure 3.5.12-1 shows the bluetooth system architecture in the U8290. - 37 -...
  • Page 37 3. TECHNICAL BRIEF Figure 3.5.12-1 Bluetooth system architecture - 38 -...

  • Page 38: Bb Technical Description

    3. TECHNICAL BRIEF 3. BB Technical Description 3.6 Digital Baseband(DBB/MSM6250) 3.6.1 General Description A. Features(MSM6250) • The ARM926EJ-S microprocessor can operate at up to 150 MHz with variable rate, software controlled clocks to provide greater standby time. • Integrated PLL to provide additional on-chip clock frequencies •...

  • Page 39: Hardware Architecture

    3. TECHNICAL BRIEF 3.7 Hardware Architecture USIM PM6650 Receptacle Receptacle BLUETOOTH SPEAKER GSM TX Loud + Receiver GSMQu Quadba TX VCO GSM RX JACK(12pin) 850/900/1800/190 SP7T RTR6250 RX FILTER MSM6250 1.3M WCDMA TX CAMERA UMTS UMTS MAIN FILTER WCDMA RX UMTS RX VCO SDRAM +...

  • Page 40: Block Diagram

    3. TECHNICAL BRIEF 3.7.1 Block Diagram(MSM6250) HK ADC USB I/F UART 19.2M General Purpose GSM/ UMTS GPRS ROM/ Processor Tx/Rx I/F Tx/Rx I/Q Speaker CODEC VOCODER USIM J-TAG I/F Controller Figure 3.7.1-1 Simplified Block Diagram of MSM6200 - 41 -...

  • Page 41: Subsystem(Msm6250)

    3. TECHNICAL BRIEF 3.8 Subsystem(MSM6250) 3.8.1 ARM Microprocessor Subsystem The MSM6250 device uses an embedded ARM926EJ-S microprocessor. This microprocessor, through the system software, controls most of the functionality for the MSM, including control of the external peripherals such as the keypad, LCD, RAM, and ROM devices. Through a QUALCOMM proprietary serial bus interface (SBI) the ARM926EJ-S configures and controls the functionality of the RTR6250, RFR6200, RFL6200, and PM6650 devices.

  • Page 42: Wideband Codec

    3. TECHNICAL BRIEF 3.8.6 Wideband CODEC The MSM6250 device integrates a wideband voice/audio CODEC into the mobile station modem (MSM). The CODEC supports two differential microphone inputs, one differential earphone output, one single-ended earphone output, and a differential analog auxiliary interface on two single-ended earphone output.

  • Page 43: Uart

    3. TECHNICAL BRIEF 3.8.11 UART There are three UARTs in the MSM6250 ASIC: • UART1 for data • UART2 (can be used for USIM interface) • UART3 (can be used for PM SBI interface) 3.8.12 USB The MSM6250 device integrates a universal serial bus (USB) controller that supports both unidirectional and bidirectional transceiver interfaces.

  • Page 44: External Memory Interface

    • 2-CS(Chip Select) are used Interface Spec Device Part Name Maker Read Access Time Write Access Time FLASH TY90009C00A0GG Toshiba 65 ns 65 ns SDRAM TY90009C00A0GG Toshiba 13 ns 13 ns Table 3.9-1 Table External memory interface for U8290 - 45 -...

  • Page 45: H/W Subsystem

    3. TECHNICAL BRIEF 3.10 H/W SubSystem 3.10.1 RF Interface A. RTR6250(WCDMA_Tx, GSM_Tx/Rx) MSM6250 controls RF part(RTR6250) using these signals. • SBST,SBDT,SBCK : SBI I/F signals for control Sub-chipset • PAON : Power AMP on RF part • RX_I/Q,TX_I/Q : I/Q for T/Rx of RF •...
  • Page 46 3. TECHNICAL BRIEF B. RFR6200(WCDMA_Rx) • SBST,SBDT,SBCK : SBI I/F signals for control Sub-chipset • RX_I/Q, : I/Q for Rx of RF C. RFL6200(WCDMA_Rx_LNA) • SBST,SBDT,SBCK : SBI I/F signals for control Sub-chipset D. the others • UHF_VCO_BAND_SEL : WCDMA(3G)/GSM(2G) VCO Band Selection of UHF VCO •...

  • Page 47: Msm Subsystem

    3. TECHNICAL BRIEF 3.10.2 MSM SubSystem 3.10.2.1 SIM Interface SIM interface scheme is shown in Figure. And, there control signals are followed • USIM_CLK : USIM Clock • USIM_Reset : USIM Reset • USIM_Data : USIM Data T/Rx VREG_USIM 2.85V USIM CLK PM6650 USIM CLK...
  • Page 48 3. TECHNICAL BRIEF 3.10.2.3 USB The MSM6250 device contains a Universal Serial Bus (USB) interface to provide an efficient interconnect between the mobile phone and a personal computer (PC). The USB interface of the MSM6250 was designed to comply with the definition of a peripheral as specified in USB Specification, Revision 1.1.
  • Page 49 3. TECHNICAL BRIEF 3.10.2.4 HKADC(House Keeping ADC) The MSM6250 device has an on-chip 8-bit analog-to-digital converter (HKADC) which is tended to digitize DC signals corresponding to analog parameters such as battery voltage, temperature, and RF power levels. The MSM6250 device has six analog input pins which are multiplexed to the input of the internal HKADC.

  • Page 50: Power Block

    3. TECHNICAL BRIEF 3.10.3 Power Block 3.10.3.1 General MSM6250, included RF, is fully covered by PM6650(Qualcomm PMIC). PM6650 cover the power of MSM6260, MSM memory, RF block, Bluetooth, Camera, T-flash, USIM and TCXO. Major power components are : PM6650(U501) : Phone power supply SI91841DT_18(U400) : MSM MIC Bias SI91841DT_18(U606) : Camera Digital power MIC5205-3.0(U607) : LCD Power...
  • Page 51 3. TECHNICAL BRIEF VDD_SPKR Output USB-OTG REF_ISET Reference VREG_5V Voltage host power ckt VIB_DRV_N REF_BYP Circuit Voltage REF_GND Regulation USB_VBUS Control External Supply VSW_5V Detector +5V Boost VCHG Regulator IMAXSEL KPD_DRV_N VREG_5V USB_CTL_N Charger VREG_5V Control VMAXSEL VSW_MSMC CHG_CTL_N Core Buck VDD_MSMC Regulator VREG_MSMC...
  • Page 52 These pins are connected to the Source (or emitter) and Drain (or collector) contacts of the pass transistor respectively. 4.2V~3.82V 3.81V~3.74V 3.73V~3.67V 3.66V~3.49V 3.48V~3.28V 2~0 (%) 100~75 (%) 75~50 (%) 50~25 (%) 25~2 (%) U8290 Battery Bar Display(Stand By Condition) - 53 -...
  • Page 53 3. TECHNICAL BRIEF Trickle Charging Trickle Charging of the main battery, enabled through SBI control and powered from VDD, is provided by the PM6650 IC, The trickle charger is on-chip programmable current source that supplies current from VDD to pin (VBAT). Trickle charging can be used for lithium-ion and nickel-based batteries, with its performance specified below (3.2V).
  • Page 54 3. TECHNICAL BRIEF Constant Current Charging The PM6650 IC supports constant current charging of the main battery by controlling the charger pass transistor and the battery transistor. The constant current charging continues until the battery reaches its target voltage, 4.2V. Constant Voltage Charging Constant voltage charging begins when the battery voltage reaches a target voltage, 4.2V.

  • Page 55: Key Pad

    3. TECHNICAL BRIEF 3.10.4 Key Pad There are 26 buttons and 3 side keys in Figure. Shows the Keypad circuit. ‘END’ Key is connected On_SW to PMIC(PM6650) and MSM(GPIO76). COL0 COL1 COL2 COL3 COL4 COL5 ROW0 CLR (Clear) MENU Side key (camera) ROW1 LEFT Side key (Down)

  • Page 56: Camera Interface

    3. TECHNICAL BRIEF 3.10.5 Camera Interface U8290 Installed a 1.3M Pixel CMOS VGA Camera. Below figure show the camera board to board connector and camera I/F signal. VREG_CAM_2.6V CONNECTOR CN301 I2C_SDA CAM_DATA(7) HB-1M1005-600JT CAM_DATA(6) CAM_DSP_CLK HB-1M1005-600JT CAM_HSYNC CAM_DATA(3) FB301 CAM_DATA(0)
  • Page 57 3. TECHNICAL BRIEF The Camera module is connected to main board with 24pin Board to Board connector (AXK7L24227). Its interface is dedicated camera interface port in MSM6250. The camera port supply 24MHz master clock to camera module and receive 12MHz pixel clock (30fps), vertical sync signal, horizontal sync signal, reset signal and 8bits data from camera module.

  • Page 58: Folder On/Off Operation

    3. TECHNICAL BRIEF 3.10.6 Folder ON/OFF Operation There is a magnet to detect the folder status, opened or closed. If a magnet is close to the hall-effect switch, the voltage at pin2 of U604 goes to 0V. Otherwise, 2.6V. This folder signal is delivered to MSM6250 GPIO80. FOLDER DETECT U604 R616...

  • Page 59: Camera Direction Detection

    3. TECHNICAL BRIEF 3.10.7 Camera Direction Detection CAM_SENSE detects the Camera Direction (front or back) CAM_SENSOR TR400 R403 A3212ELH VREG_MSMP_2.6V CAM_SENSE C405 C403 0.1u Figure 3.10.7-1 Camera Direction Detection - 60 -...

  • Page 60: Keypad Light

    3. TECHNICAL BRIEF 3.10.8 Keypad Light There are 17 blue LEDs in key board backlight circuit, which are driven by KEYBD_BACKLIGHT line form PM6650. +VPWR LD11 LD12 LEBB-S14H LEBB-S14H LEBB-S14H LEBB-S14H LEBB-S14H LEBB-S14H LEBB-S14H LEBB-S14H LEBB-S14H LD10 LEBB-S14H LEBB-S14H LEBB-S14H LD13 LD14 LD15...

  • Page 61: Camera Light Flash

    3. TECHNICAL BRIEF 3.10.9 Camera Light Flash There is White LED in U8290 Folder Upper, and Drive circuit is in Main Board, which are showed below. Flash lighted by FLASH_ON Signal of FLASH_DRV_N in PM6650. - 62 -...

  • Page 62: Lcd Module

    3. TECHNICAL BRIEF 3.10.10 LCD Module Vibrator MAIN Receiver Back MODULE Light LOUD SPK Camera Flash Figure 3.10.10-1 LCD Module Block Diagram MAIN LCD MODULE SUB LCD MODULE 260K Color TFT 176 * 220 Pixel 65K Color STN 96 * 96 Pixel Gate Drive IC Gate Drive IC Drive IC...
  • Page 63 3. TECHNICAL BRIEF 3.10.10.1 Display & LCD FPC Interface LCD module is connected to key board with 60-pin BtoB connector (CN300_24_5087_060_007_829) and Speaker, Receiver, Vibrator, Camera Flash is connected by soldering the leads to pads in LCD module. The LCD is controlled by 16-bit EBI2 in MSM6250 1 : GND 31 : GND 2 : SPK+ : Loud Speaker +...

  • Page 64: Audio And Sound

    3. TECHNICAL BRIEF 3.10.11 Audio and Sound 3.10.11.1 Overview of Audio & Sound path Head_Set MSM6250 (U100) Receiver Key PCB Module (B’d to B’d (U304) (B’d to B’d Conn.) Conn.) Loud Speaker Head_set MIC Voice Voice + MP3 + MIDI MIDI_Bell Figure 3.10.11.1-1 Audio &...
  • Page 65 3. TECHNICAL BRIEF 3.10.11.2 Audio Signal Processing & Interface Audio signal processing is divided Uplink path and downlink path. The uplink path amplifies the audio signal from MIC and converts this analog signal to digital signal and then transmit it to DBB Chip (MSM6250). This transmitted signal is reformed to fit in GSM & WCDMA Frame format and delivered to RF Chip.

  • Page 66: Ear Jack

    3. TECHNICAL BRIEF MSM6250 BLK FB502 FB503 MIC_Feedback MICFBP MICINN 180K C621 C622 MICOUTP C108 0.1u C100 0.1u R101 C101 0.015u 470K R100 C106 0.015u 180K MICOUTN C107 0.1u C105 0.1u R104 MICINP Near to MSM MICFBN EAR JACK MICBIAS_LDO_1.8V R625 VREG_MSMP_2.6V To prevent from...
  • Page 67 3. TECHNICAL BRIEF U400 SI91841DT-18-T1 VREG_MSMA_2.6V MICBIAS_LDO_1.8V VOUT MICBIAS C400 C402 C625 0.01u MIC1 C401 MIC1P MIC1N OBG-415S42-C1033 C404 UCLAMP0505A C619 C618 U401 Audio AMP C633 (TPA2005D) 0.01u R648 R623 HEADPHONE_R C634 80.6K 0.01u R649 R622 HEADPHONE_L 80.6K C651 C652 U605 TPA2005D1ZQYR 0.015u...

  • Page 68: Audio Mode

    3. TECHNICAL BRIEF 3.10.11.3 Audio Mode Audio Mode includes three states.( Voice call, Video Telephony, Midi, MP3). And each states is sorted by followed Detail Mode according to external Devices (Receiver, Loud, Headset). MODE Device Detail MODE Receiver Mode Receiver Voice Call Voice Call Loud Mode Speaker Phone...
  • Page 69 3. TECHNICAL BRIEF Voice Call Receiver Mode Path Head_Set MSM6250 (U100) Receiver Key PCB Module (B’d to B’d (U650) (B’d to B’d Conn.) Conn.) Loud Speaker Head_set MIC Voice Voice + MP3 + MIDI MIDI_Bell => Voice Call Receiver Mode is Implemented as bellow C621,C622(MSM6250 EAR1ON,EAR1OP) ->...
  • Page 70 3. TECHNICAL BRIEF Voice Call Head_Set Mode Path & Head video Telephony Mode Head_Set MSM6250 (U100) Receiver Key PCB Module (B’d to B’d (U650) (B’d to B’d Conn.) Conn.) Loud Speaker Head_set MIC Voice Voice + MP3 + MIDI MIDI_Bell =>...
  • Page 71 3. TECHNICAL BRIEF Voice Call Speaker Phone Mode & Video Telephony Mode Head_Set MSM6250 (U100) Receiver Key PCB Module (B’d to B’d (U650) (B’d to B’d Conn.) Conn.) Loud Speaker Head_set MIC Voice MIDI_Bell Voice + MP3 + MIDI => Voice Call Speaker Phone Mode is Implemented as bellow MSM6250 (HPH_L, HPH_R) ->...
  • Page 72 3. TECHNICAL BRIEF MIDI Ring Tone (Speaker) Head_Set MSM6250 (U100) Receiver Key PCB Module (B’d to B’d (U650) (B’d to B’d Conn.) Conn.) Loud Speaker Head_set MIC Voice MIDI_Bell Voice + MP3 + MIDI => MIDI Ring tone for speaker MSM6250 (HPH_L, HPH_R) ->...
  • Page 73 3. TECHNICAL BRIEF MIDI Ring Tone (Head_Set) Head_Set MSM6250 (U100) Receiver Key PCB Module (B’d to B’d (U650) (B’d to B’d Conn.) Conn.) Loud Speaker Head_set MIC Voice MIDI_Bell Voice + MP3 + MIDI => MIDI Ring tone for head_set MSM6250 (HPH_L, HPH_R) ->...
  • Page 74 3. TECHNICAL BRIEF MP3 Play (Speaker) Head_Set MSM6250 (U100) Receiver Key PCB Module (B’d to B’d (U650) (B’d to B’d Conn.) Conn.) Loud Speaker Head_set MIC Voice MIDI_Bell Voice + MP3 + MIDI => MP3 play path for speaker MSM6250 (HPH_L, HPH_R) -> R648, R649 -> C633, C634 -> R622, R623-> AMP(U605) -> B’d to B’d Connector ->...
  • Page 75 3. TECHNICAL BRIEF MP3 Play (Head_set) Head_Set MSM6250 (U100) Receiver Key PCB Module (B’d to B’d (U650) (B’d to B’d Conn.) Conn.) Loud Speaker Head_set MIC Voice MIDI_Bell Voice + MP3 + MIDI => MP3 play path for speaker MSM6250 (HPH_L, HPH_R) -> C626, C627 -> Ear_Jack -> Head_Set - 76 -...
  • Page 76 3. TECHNICAL BRIEF Audio & Sound Main Component There are 6 components in U8290 schematic Diagram. Part Number marked on U8290 Schematic Diagram. Component Design No. Maker Part No. Note MSM6250 U100 MSM6250 Base-Band Modem TPA2005D U605 TPA2005D1ZQYR Differential Audio Amp...

  • Page 77: Trouble Shooting

    4. TROUBLE SHOOTING 4. TROUBLE SHOOTING 4.1 RF Component U202 FL204 U204 U203 Q200 FL201 FL202 U205 FL203 FL200 U201 U206 U200 RF component (Top) Reference Description Reference Description U200 WCDMA Receiver IC Q200 WCDMA PAM Vcc Switch U201 WCDMA Rx LNA IC FL200 WCDMA Rx SAW Filter U202...
  • Page 78 4. TROUBLE SHOOTING ANT400 ANT200 RF200 U406 U207 U210 U209 U208 RF component (Bottom) Reference Description Reference Description ANT200 ANT. Contact point U209 EGSM/DCS Tx Dual PAM RF200 Test Connector U210 EGSM/DCS TX Dual VCO U207 ANT. Switch Module U406 Bluetooth RF Module U208 WCDMA Rx VCO...

  • Page 79: Signal Path

    4. TROUBLE SHOOTING 4.2 SIGNAL PATH WCDMA Tx PATH WCDMA Rx PATH GSM Tx PATH GSM Rx PATH DCS/PCS Tx PATH DCS Rx PATH GSM/DCS/PCS Rx PATH PCS Rx PATH - 80 -...

  • Page 80: Checking Vcxo(19.2Mhz) Block

    4. TROUBLE SHOOTING 4.3 Checking VCXO(19.2MHz) Block The reference frequency (19.2MHz) from U206 (VCXO) is used WCDMA TX part, GSM part and BB part. Test Point (Crystal Part) C265 1000p VREG_TCXO_2.85V C276 C274 1000p 0.1u 19.2MHz R219 TRK_LO_ADJ VCONT TG-5001LA-19.2MHz C275 U206 0.01u...
  • Page 81 4. TROUBLE SHOOTING Check TP1 VCC of VCXO CHECK R540 of PMIC (U509) VCC ≥ 2.8V Check TP2 TRK_LO_ADJ Check R227 of MSM(U208) 2V ≥ Voltage ≥ 1V Check TP3.4.5 With Oscilloscope 2V ≥ Voltage ≥ 1V Check soldering and components VCXO is OK Check other part - 82 -...

  • Page 82: Checking Ant. Sw Module Block

    4. TROUBLE SHOOTING 4.4 Checking Ant. SW Module Block ANT _SEL0 ANT_SEL1 ANT_SEL2 Antenna Switch Block(Bottom) ANT200 RF200 R221 C279 2.2nH KMS-507 L229 C283 10nH U207 GSM900_RX VREG_RFRX_0_2.85V GSM1800_RX C286 GSM1900_RX 0.1u WCDMA R224 ANT_SEL2 GSM18001900_TX C285 GSM900_TX 100p SFAY0004601 R223 ANT_SEL1 C277...
  • Page 83 4. TROUBLE SHOOTING Checking Switch Block power source Check Soldering of ANT_SEL 0, 1, 2 High Level Check VCC 2.5V < Voltgae < 3.0V TP1 VREG_RFRX_0_2.85V Check the Logic in each mode - 84 -...

  • Page 84: Checking Wcdma Block

    4. TROUBLE SHOOTING 4.5 Checking WCDMA Block START 1. Check VCXO 19..2MHz 2. Check ANT. SW Module ANT_SEL0, 1, 2 3. Check RF Tx Level 4. Check PAM Block 5. Check RF Rx L evel 6. Re-download SW & CAL. - 85 -...

  • Page 85: Checking Vcxo Block

    4. TROUBLE SHOOTING 4.5.1 Checking VCXO Block Refer to 4.3 4.5.2 Checking Ant. SW module Refer to 4.4 4.5.3 Checking RF TX Level Test Point (RF TX Level) ANT200 RF200 R221 C279 2.2nH KMS-507 L229 C283 10nH U207 GSM900_RX VREG_RFRX_0_2.85V GSM1800_RX C286 GSM1900_RX...
  • Page 86 4. TROUBLE SHOOTING For testing, Max power output is needed. S et the Phone Tx is ON and PDM is 450 Check TP 1 RF Tx L e vel is OK Over 21dB m ? Check TP 2 Chec k ANT. SW Over 19dB m ? M o dule U207 Ch eck TP3...

  • Page 87: Checking Pam Block

    4. TROUBLE SHOOTING 4.5.4 Checking PAM Block PAM control signal PA_ON : WCDMA Tx Power Detect IC(U203:HDET) Enable PA_FET_N : WCDMA PAM Vcc Control Signal (Q200) TX_AGC_ADJ : WCDMA Tx Power Amp Gain Control PA_FET_N PA_ON TX_AGC_ADJ PA_ON must be HIGH(over 2.5V) PA_FET_N must be LOW if the max Tx power is set (lower than 0.5V) PAM IN/OUT Signal PAM_OUT...

  • Page 88: Check Rf Rx Level

    4. TROUBLE SHOOTING 4.5.5 Check RF Rx Level Bias1 B as2 Test Point (RF Rx Level) ANT200 RF200 R221 C279 2.2nH KMS-507 L229 C283 10nH U207 GSM900_RX VREG_RFRX_0_2.85V GSM1800_RX C286 GSM1900_RX 0.1u WCDMA R224 ANT_SEL2 GSM18001900_TX C285 GSM900_TX 100p SFAY0004601 R223 ANT_SEL1 C277...
  • Page 89 4. TROUBLE SHOOTING S et the Phone Rx is ON Chec k bias1,2 Che ck bias block Over 2V ? so ldering Chec k TP1 Check RF200 Signal exist ? Chec k TP2 Chec k ANT. SW Signal exist ? Module U207 Chec k TP3 Che ck Duplexer U202...

  • Page 90: Checking Gsm Block

    4. TROUBLE SHOOTING 4.6 Checking GSM Block START 1. Check TXV CO Block 2. Check ANT. SW Module 3. Check Tx PAM Block 4. Check RF Rx Level 5. Re -download SW & CA L. - 91 -...

  • Page 91: Checking Txvco Block

    4. TROUBLE SHOOTING 4.6.1 Checking TXVCO Block Test Point (TXVCO Level) TP1 TP4 TP2 TP3 R239 C316 C310 C313 (PPS) 120p 1000p ECHU1C223JX5 R238 MQW5V0C869M U210 FB201 R234 VREG_RFTX_2.85V R228 R240 GSM_TX_VCO_0_EN_N OUT_GSM R237 GSM_TX_VCO_1_EN_N OUT_DCSPCS R236 R235 GND5 GND1 R233 R229 GND6...
  • Page 92 4. TROUBLE SHOOTING START Check TP1 Chec k RTR6250 0.5V < TP1 < 2.5 V Check TP2, TP3 I f GSM TP2=High , TP3=Low Check Soldering If DCS/PCS TP2=Low , TP3=High & MSM6250 Chec k TP4 Check PMI C(U501) 2.8V < TP4 < 3.0V Check TP5, TP6 Check Soldering of 0dBm <...

  • Page 93: Checking Ant. Sw Module

    4. TROUBLE SHOOTING 4.6.2 Checking Ant. SW Module Refer to chapter 4.4 4.6.3 Checking RF Tx level Test Point (RF Tx Level) ANT200 RF200 R221 C279 2.2nH KMS-507 L229 C283 10nH U207 GSM900_RX VREG_RFRX_0_2.85V GSM1800_RX C286 GSM1900_RX 0.1u WCDMA R224 ANT_SEL2 GSM18001900_TX C285...
  • Page 94 4. TROUBLE SHOOTING START Check TP1 GSM/DCS/PCS If GSM over 31dBm ? Tx is Ok If DCS/PCS over 28dBm ? Check other part Check TP2, TP3 Check ANT. SW If TP2 over 29dBm ? Module (U207) If TP3 over 25dBm ? Refer to chapter 4.4 Check PAM Block (U209) Check TXVCO (U210)

  • Page 95: Checking Pam Block

    4. TROUBLE SHOOTING 4.6.4 Checking PAM Block PAM Control Signal TP1. GSM_PA_RAMP : Power Amp Gain Control. typically, 0.5V < Vapc < 2.6V, TP2. GSM_PA_EN : Power Amp Enable (Power ON : higher than 2.5V , Power OFF : lower than 0.7V) TP3.

  • Page 96: Checking Rf Rx Block

    4. TROUBLE SHOOTING 4.6.5 Checking RF Rx Block TP1. GSM Rx SAW Input TP2. DCS Rx SAW Input TP3. PCS Rx SAW Input Test Point (RF Rx Level) L220 7.5nH DAC_REF L222 12nH FL203 C226 C241 1000p L210 L223 B7846 1930-1990 MHz 8.2nH 12nH...
  • Page 97 4. TROUBLE SHOOTING START Check ANT. SW TP1, TP2, TP3 signals exist ? Module (U207) and solder ing of TPs GSM/D CS/PCS Rx still has problems ? Rx is OK Re-download & CAL. - 98 -...

  • Page 98: Bluetooth Rf Block

    4. TROUBLE SHOOTING 4.7 Bluetooth RF Block TC-3000A (Bluetooth Tester) 1. Set phone to bluetooth test-mode : Enter Test Mode(277634#*#) → Module Test Set → BT DUT → BT DUT ON 2. Connect phone to bluetooth tester 3. Set channel to 39 4.
  • Page 99 4. TROUBLE SHOOTING VREG_MSMP_TCXO VREG_BT_2.85V U406 L507 BT_SBST SBST 1.5nH BT_SBCK SBCK BT_SBDT SBDT BT_TX_RX_N SYNC_DET_TX_EN BT_DATA RX_BB_TX_BB C406 1000p TCXO_BT LDO1 XTAL_IN BT_CLK LDO2 CLK_REF RB06A 2.2u 1608 Q504 UMC4N TCXO_EN VREG_MSMP_2.6V VREG_MSMP_TCXO VREG_BT_2.85V C542 1000p R500 100K C503 TCXO_BT_IN TCXO_BT 1000p...
  • Page 100 4. TROUBLE SHOOTING START Check BT ANT. TP1 level > -6dBm ? (ANT400) soldering TP3 > 2.5V TP2 > 2.5V & TP4 > 2.0V Replace Q504 Replace PM6650 TP5 > 2.8V (U501) TP6 19.2MH z exist? TP7 19.2MHz exist? Replace U500 Replace U406 Replace Board - 101 -...

  • Page 101: Lg-U8290 Main Features

    4. TROUBLE SHOOTING 4.8 LG-U8290 Main features - Folder Type - WCDMA + GSM(900,1800) + PCS(1900) Triple mode - Dual color LCD(Main:260K TFT, Sub:65K STN) - 1.3M Pixel CMOS VGA Camera - 17 pi single way speaker - Stereo Head_set...

  • Page 102: Lg-U8290 Main Component

    4. TROUBLE SHOOTING 4.9 LG-U8290 Main Component Dual Color LCD Module (LCD, 17 Pi Speaker, 12 Pi Motor) Key B’d Bottom Side & Top Side 1.3M Camera Stereo Head_Set Shied Frame Main B dBottom Side Main B’d Top Side - 103 -...
  • Page 103 4. TROUBLE SHOOTING TOP Side U206 U606 U100-1 X100 S600 CN300 U601 BAT500 U607 U400 Reference Description Reference Description X100 USB Clock(48Mhz) U606 Camera LDO U100-1 MSM6250 U607 LCD LDO NAND Flash+SDRAM U601 U400 MIC bias LDO (64M + 64M) U206 TCXO (19.2Mhz) CON300...
  • Page 104 4. TROUBLE SHOOTING BOTTOM Lower Side U605 X500 U501 U407 Q500 R503 CN302 Reference Description Reference Description U501 PM6650 (PMIC) X500 Sleep X-tal (32.768Khz) U605 Audio AMP Q500 Charger TR CN302 IO Connector U407 USIM Connector R503 Current Sensing R - 105 -...
  • Page 105 4. TROUBLE SHOOTING BOTTOM Upper Side TR400 CN304 CN301 U406 Reference Description Reference Description CN301 Camera Connector CN304 Head_Set Jack TR400 Camera Direction U406 Bluetooth Module Sense TR - 106 -...

  • Page 106: Power On Trouble

    4. TROUBLE SHOOTING 4.10 Power ON Trouble Power On sequence of U8290 is : PWR key press(Key PCB) → On_SW_PM* go to low(D500),PM6650 KPDPWR_N pin(24) → PM6650 Power Up → VREG_MSMC_1.375V(C539), VREG_MSME_1.8V(C537), VREG_MSMP_2.6V(C522), VREG_MSMA_2.6V(C520) VREG_TCXO_2.85V(C512) power up and system reset assert to MSM →...
  • Page 107 4. TROUBLE SHOOTING 19.2MHz VREGC_MSMA_2.6V VREG_MSME_1.8V PM6650 VREGC_MSMP_2.6V VREG_MSMC_1.375V VREG_TCXO_2.85V 32.768KHz - 108 -...

  • Page 108: Usb Trouble

    4. TROUBLE SHOOTING 4.11 USB Trouble USB Initial sequence of U8290 is : USB connected to U8290 → USB_VBUS(D520) go to 5V → USB_D+ go to 3.3V → 48M Crystal on → USB_VP and USB_VN is triggered → USB work. Start...
  • Page 109 4. TROUBLE SHOOTING USB_VBUS USB_D+ USB_D- X100 : 48M 48MHz - 110 -...

  • Page 110: Sim Detect Trouble

    4. TROUBLE SHOOTING 4.12 SIM Detect Trouble USB Initial sequence of U8290 is : USIM_CLK,USIM_RST,USIM_DATA triggered → VREG_USIM_2.85V go to 3.0V → USIM IF work Start Re-insert the SIM card Work well? Check U407, VREG_USIM_2.85V is 3.0V? U408 USIM_P_CLK is run?

  • Page 111: Key Sense Trouble

    4. TROUBLE SHOOTING 4.13 Key Sense Trouble Key Sense sequence of U8290 is : Default condition ROW(0-4) is 2.6V → Press the key → Corresponding row(x) go to 0V → Key sensing Start Change the side key ROW[0-4] Work well?

  • Page 112: Camera Trouble

    4. TROUBLE SHOOTING 4.14 Camera Trouble Camera control signals are generated by MSM6250. Start Check t he camera conn. and reconnect the camera Camera is OK? Change the Main boa rd VREG_CAM_2.6V is 2.6V? (C317) Check t he DSP_CLK Change the Main boa rd (FB301) Change t he camera Camera is OK...

  • Page 113: Main Lcd Trouble

    4. TROUBLE SHOOTING 4.15 Main LCD Trouble Main LCD control signals are generated by MSM6250. Those signal’s path are : MSM6250 → MAIN B’d → CN300 → CN2 → Key Pcb → CN1 → LCD Module START Press END key to turn the power on Follow the Power ON Is the circuit powered?
  • Page 114 4. TROUBLE SHOOTING LCD Control data flow - 115 -...

  • Page 115: Sub Lcd Trouble

    4. TROUBLE SHOOTING 4.16 Sub LCD Trouble Sub LCD control signals are generated by MSM6250. Those signal’s path are : MSM6250 → MAIN B’d → CN300 → CN2 → Key Pcb → CN1 → LCD Module START Press END key to turn the power on Follow the Power ON Is the circuit powered?
  • Page 116 4. TROUBLE SHOOTING LCD Control data flow - 117 -...

  • Page 117: Keypad Backlight Trouble

    4. TROUBLE SHOOTING 4.17 Keypad Backlight Trouble Key Pad Back Light is on as below : Key pressing → KEYD_BACKLIGHT go to 0V → B’d to B’d connector → LED On Start Key p ress Signal VPWR is ab ove 3.2V? Check CN300,CN1 Signal KEYD_B ACKLIGHT Check CN300,CN1...

  • Page 118: Folder On/Off Trouble

    4. TROUBLE SHOOTING 4.18 Folder ON/OFF Trouble Folder On/Off is worked as below : Folder On/Off Event → Flip(U604 pin 2) is triggered(On : about 2.1V, Off : 0V) → MSM6250 Sense the Folder Event Start Check t he magnet in Insert the mag net folder Assy Appr oach the magnet to...
  • Page 119 4. TROUBLE SHOOTING FOLDER DETECT U604 R616 A3212ELH VREG_MSMP_2.6V To MSM6250 ← FOLDER_DETECT C612 C639 0.1u U601 - 120 -...

  • Page 120: Camera Direction Detection Trouble

    4. TROUBLE SHOOTING 4.19 Camera Direction Detection Trouble Camera direction detection is worked as below : Camera direction change Event → CAM_SENSE(TR400 pin 2) is triggered(On : about 2.1V, Off : 0V) → MSM6250 Sense the Camera direction change Event Start Change t he camera direct ion CAM_SENSE is 0V?
  • Page 121 4. TROUBLE SHOOTING TR400 - 122 -...

  • Page 122: Camera Flash Trouble

    4. TROUBLE SHOOTING 4.20 Camera Flash Trouble Camera Flash is worked as below : PM6650 control the camera flash in Folder Assy → PM6650 Port 8(FLSH_DRV_N) → CN300(Flash_On) → CN2(Flash_On) → CN1 → LCD Module → FLASH LED FPCB Module Start Check t he Flash FPCB Reso ld er the FPCB...
  • Page 123 4. TROUBLE SHOOTING Flash LED FLASH_ON from Main B’d PM6650 - 124 -...

  • Page 124: Audio Trouble Shooting

    4. TROUBLE SHOOTING 4.21 Audio Trouble Shooting Audio & Sound Signal Path are followed as below figure. We can check the trouble point corresponded error audio & sound mode. Head_Set MSM6250 (U100) Receiver Key PCB Module (B’d to B’d (U304) (B’d to B’d Conn.) Conn.)

  • Page 125: Receiver Path

    4. TROUBLE SHOOTING Receiver Path Voice Receiver path as below: MSM6250 Ear1ON/Ear1OP → CN300(b’d to b’d connector) → CN2(b’d to b’d connector) → CN1(LCD b’d to b’d connector) → LCD module → Speaker Start Connect the phone to network Equipment and setup call Setup 1 KHz tone out The sine wave appear at Change the Main board...
  • Page 126 4. TROUBLE SHOOTING FB503 FB502 CN500 - 127 -...
  • Page 127 4. TROUBLE SHOOTING Receiver Path for Head_set Voice Receiver & video telephony path for Head_Set as below: MSM6250 HPH_R, HPH_L → C626, C627 → CN304(Head_Set Jack) Start Conne ct the phone to ne twork Equipment and setup call Setup 1 KHz tone out An d in sert head_Set EAR_SENSE*(R624) is 0V? Change the Main board...
  • Page 128 4. TROUBLE SHOOTING Head_set Out put Pin(4,5) CN304 R624 C627 C626 - 129 -...
  • Page 129 4. TROUBLE SHOOTING Voice Speaker Phone & Video telephony path Voice Speaker Phone & Video telephony path as below: MSM6250 HPH_R, HPH_L → R648, R649 → C633, C634 → R622, R623 → U605(Amp) → CN300 → CN2 → CN1 → LCD module → speaker Start Connect the pho ne to netw ork Equipment and setu p call...
  • Page 130 4. TROUBLE SHOOTING R622 C634 R649 U605 R648 R623 C633 CN300 - 131 -...
  • Page 131 4. TROUBLE SHOOTING MIDI Ring tone for speaker MIDI Ring tone speaker path as below: MSM6250 HPH_R, HPH_L → R648, R649 → C633, C634 → R622, R623 → U605(Amp) → CN300 → CN2 → CN1 → LCD module → speaker Start Play Th e Ring tone The Ring t one appe ar at...
  • Page 132 4. TROUBLE SHOOTING R622 C634 R649 U605 R648 R623 C633 CN300 - 133 -...
  • Page 133 4. TROUBLE SHOOTING MIDI Ring tone for Head_Set MIDI Ring tone Head_Set path as below: Voice Receiver & video telephony path for Head_Set as below: MSM6250 HPH_R, HPH_L → C626, C627 → CN304(Head_Set Jack) Start Play t he Ring tone and i nsert the Head_set Check R624 i s 0V? or The Ring t one wave appear...
  • Page 134 4. TROUBLE SHOOTING Head_set Out put Pin(4,5) CN304 R624 C627 C626 - 135 -...
  • Page 135 4. TROUBLE SHOOTING MP3 play for speaker MP3 play for speaker path as below: MSM6250 HPH_R, HPH_L → R648, R649 → C633, C634 → R622, R623 → U605(Amp) → CN300 → CN2 -> CN1 → LCD module → speaker Start Play Th e MP3 The MP3 appear at Change th e Main b oard...
  • Page 136 4. TROUBLE SHOOTING R622 C634 R649 U605 R648 R623 C633 CN300 - 137 -...
  • Page 137 4. TROUBLE SHOOTING MP3 play for Head_Set EAR JACK FB502 FB503 MICBIAS_LDO_1.8V R625 VREG_MSMP_2.6V To prevent from CN304 C621 C622 TDMA noise. C102 MIC2P R640 600 C115 R641 MIC2N C626 HEADPHONE_L C627 HEADPHONE_R R624 EAR_SENSE* MULTI_ADC KEY_ROW(0) KEY_ROW(1) KEY_ROW(2) KEY_ROW(3) KEY_COL(6) Near to MSM C654...
  • Page 138 4. TROUBLE SHOOTING Head_set Out put Pin(4,5) CN304 R624 C627 C626 - 139 -...
  • Page 139 4. TROUBLE SHOOTING Microphone for Main MIC Main Microphone path as below: MIC → MIC pad(MIC1) → C401,C402 → MSM6250 → MIC feed back gain logic → MSM internal CODEC U400 SI91841DT-18-T1 FB502 FB503 VREG_MSMA_2.6V MICBIAS_LDO_1.8V VOUT MICBIAS C400 C402 C625 C621 C622...
  • Page 140 4. TROUBLE SHOOTING C404 C401 Contact - 141 -...
  • Page 141 4. TROUBLE SHOOTING Microphone for Head_Set MIC for Head_Set path as below: Insert Headset → Ear_Sense(R624) go 0V → MSM6250 sense Head_Set insertion → MIC signal go to MSM(C102, C115) EAR JACK MICBIAS_LDO_1.8V R625 VREG_MSMP_2.6V To prevent from CN304 TDMA noise. C102 MIC2P R640 600...
  • Page 142 4. TROUBLE SHOOTING Head_Phone Input Pin(2,3) CN304 R624 C115 C102 - 143 -...

  • Page 143: Charger Trouble Shooting

    4. TROUBLE SHOOTING 4.22 Charger Trouble Shooting Q500 CHG_CNT_N +5V_PWR 2SB1424 (4.6V) ICHARGE ICHARGEOUT +VPWR Q502 4.2~4.25V VBATT Main Batt y SI3493DV BATT_FET_N Charging Procedure - Connecting TA - Control the charging current by PM6050 IC - Charging Current flows into the battery Check Point - Connection of TA - Charging current path...
  • Page 144 4. TROUBLE SHOOTING Start Check t he pin and ba ttery Connect terminals of I/O connect or Connect ion O K? Change I/O connector Is the TA volt age 4.6V Change TA Is it charging p roper ly Af ter chang ing Q 500, Q502? Change the board - 145 -...
  • Page 145 4. TROUBLE SHOOTING 4.6V Receptacle 4.6V - 146 -...
  • Page 146 4. TROUBLE SHOOTING 4.23 Bluetooth RF Block TC-3000A (Bluetooth Tester) 1. Set phone to bluetooth test-mode : Enter Test Mode(277634#*#) → Module Test Set → BT DUT → BT DUT ON 2. Connect phone to bluetooth tester 3. Set channel to 39 4.
  • Page 147 4. TROUBLE SHOOTING Test Point (Bluetooth Block ) VREG_MSMP_TCXO VREG_BT_2.85V U406 L507 BT_SBST SBST 1.5nH BT_SBCK SBCK BT_SBDT SBDT BT_TX_RX_N SYNC_DET_TX_EN BT_DATA RX_BB_TX_BB C406 1000p TCXO_BT LDO1 XTAL_IN BT_CLK LDO2 CLK_REF RB06A 2.2u 1608 Q504 UMC4N TCXO_EN VREG_MSMP_2.6V VREG_MSMP_TCXO VREG_BT_2.85V C542 1000p R500...
  • Page 148 4. TROUBLE SHOOTING START Check BT ANT. TP1 level > -6dBm ? (ANT400) soldering TP3 > 2.5V TP2 > 2.5V & TP4 > 2.0V Replace Q504 Replace PM6650 TP5 > 2.8V (U501) TP6 19.2MH z exist? TP7 19.2MHz exist? Replace U500 Replace U406 Replace Board - 149 -...

  • Page 149: Block Diagram

    5. BLOCK DIAGRAM 5. BLOCK DIAGRAM 5.1 GSM & WCDMA RF Block Fig 5.1-1.UMTS-2100 + EGSM-900/DCS-1800/PCS-1900 RF Functional Block Diagram - 150 -...
  • Page 150 5. BLOCK DIAGRAM Block Ref. Name Part Name Function Comment U207 SFAY0004601 Switch Band select Common RF200 KMS-507 Test Connector Calibration, etc U206 TG-5001LA-19.2MHz VCTCXO 19.2MHz Bluetooth RF U406 LBDA254AN0 Bluetooth TRX Transceiver Bluetooth ANT400 LDA31 Antenna Bluetooth antenna U202 DMF1950IHC Duplexer U201...

  • Page 151: Interface Diagram

    GSM/DCS/PCS RX I/Q Module Rx SAW Filter MSM6250 UMTS TX TX_AGC_ADJ UHF_VCO_EN UMTS UMTS UMTS Tx SAW Duplexer Rx VCO TRK_LO_ADJ Filter VCTCXO 19.2MHz HDET HDET UMTS UMTS RX RFL6200 Rx SAW RFR6200 Filter U8290 Interface Diagram - 152 -...
  • Page 152 5. BLOCK DIAGRAM Main RF signal (black) GSM TX : GSM Tx RF signal GSM RX : GSM Rx RF signal DCS TX : DCS Tx RF signal DCS RX : DCS Rx RF signal PCS TX : PCS Tx RF signal PCS RX : PCS Rx RF signal UMTS TX : UMTS Tx RF signal UMTS RX : UMTS Rx RF signal...
  • Page 153 5. BLOCK DIAGRAM Top Side - 154 -...
  • Page 154 5. BLOCK DIAGRAM Bottom Side - 155 -...

  • Page 155: Download

    6.1 Introduction LGMDP(Ver 1.4)is a software for downloading image files to the phone from Microsoft Windows 2000 or Microsoft Windows XP where the LG USB Modem driver (Ver 4.5 or later) is installed. 6.2 Downloading Procedure 1) Connecting to PC 1.
  • Page 156 6. DOWNLOAD 1-2) It is ready for downloading. 1-3) Choosing image folder Choose a Image folder after clicking on ‘Browse’. - 157 -...
  • Page 157 6. DOWNLOAD 2) Choosing image files 1. Choose a Boot loader Image file after clicking on ‘Browse’. (The file name can be different from yours.) • It’s very important to choose the correct file. The phone NEVER can work with the wrong bootloader file. Caution) Error message will show if you choose improper file.
  • Page 158 6. DOWNLOAD 2. Choose a Boot shell file after clicking on ‘Browse’. (The file name can be different from yours.) • It’s very important to choose the correct file. The phone NEVER can work with the wrong bootlshell file. Caution) Error message will show if you choose improper file. - 159 -...
  • Page 159 6. DOWNLOAD 3. Choose a AMSS Modem Image file after clicking on ‘Browse’. (The file name can be different from yours.) Caution) Error message will show if you choose improper file. - 160 -...
  • Page 160 6. DOWNLOAD 4. Choose a Media Image after clicking on ‘Browse’. (The file name can be different from yours.) Caution) Error message will show if you choose improper file. - 161 -...
  • Page 161 6. DOWNLOAD 5. Choose a Module Image file after clicking on ‘Browse’. (The file name can be different from yours.) Caution) Error message will show if you choose improper file. - 162 -...
  • Page 162 6. DOWNLOAD 6. Click on ‘Download’ to download. - 163 -...

  • Page 163: Download Process

    6. DOWNLOAD 3) Downloading This is whole process for downloading. You will see pictures for each step from the next . Download Start (NV backup) (NV restore) Erase MEDIA directory Reset Erase MODULE directory Download MEDIA (EFS Erase) Download MODULE Download BOOTLOADER Reset Download BOOTSHELL...
  • Page 164 6. DOWNLOAD • • A message box which informs a new file for NV backup is created in the local directory is shown. • • Doing NV backup. - 165 -...
  • Page 165 6. DOWNLOAD • • Downloading the AMSS Modem image followed by the Bootloader and Bootshell images. • • Rebooting and waiting for a while. • • Unless the UE reboots, you should reboot by yourself • • Doing NV restore. - 166 -...
  • Page 166 6. DOWNLOAD • • Rebooting and wating for a while. • • Erasing the existing directory and files for the Media Image. • • Downloading the Media image. - 167 -...
  • Page 167 6. DOWNLOAD • • Downloading the Module image. • • Finally Download has been complete. - 168 -...

  • Page 168: Troubleshooting Download Errors

    6. DOWNLOAD 6.3 Troubleshooting Download Errors 1) When the phone does not work after downloading 2) Media Erasing Error 3) NV Restore Error → Reboot the phone as the emergency mode (keep pressing “2” and “5” key while the phone is being booted).
  • Page 169 6. DOWNLOAD When you meet the “MEDIA Erasing error” before downloading Media Image, → Reboot the phone and then try to download the Media Image again with Module Image. • Both have to be downloaded at the same time. - 170 -...
  • Page 170 6. DOWNLOAD When you meet the “NV Restore error”, → Connect to the phone. - 171 -...
  • Page 171 6. DOWNLOAD → Click on ‘Cancel’. → Click on ‘NV Restore’ then several NV Backup files(*.nv2) are shown. • The files are saved every NV Backup. The name is based on the time when NV Backup is done.) - 172 -...
  • Page 172 6. DOWNLOAD → Select the proper file and click on ‘Restore’. → Reading the NV file and restore NV. - 173 -...

  • Page 173: Caution

    6. DOWNLOAD 6.4 Caution 1) Multi-downloading using the USB hub is not recommendable. 2) The Module and Media Image have to be downloaded at the same time. 3) ‘EFS Erase’ option will be erase everything (media, module, NV Items and user data) in EFS area. - 174 -...

  • Page 174: Calibration

    7.1 General Description This document describes the construction and the usage of the software used for the calibration of LG’s GSM/GPRS/WCDMA Multimedia Mobile Phone (U8290). The calibration menu and their results are displayed in PC terminal by Mobile phone. This calibration software includes GSM, DCS, PCS, WCDMA Band RF parts calibration. This calibration software was called “Pegasus”.

  • Page 175: Calibration Explanation

    7. CALIBRATION 7.3 Calibration Explanation 7.3.1 Overview In this section, it is explained each calibration item in the Pegasus. Also the explanation includes technical information such as basic formula of calibration and settings for key parameters related with Pegasus’s internal calibration process. At first, when any of calibration process is done, the results are displayed in the Pegasus result window.

  • Page 176: Egsm 900 Calibration Items

    7. CALIBRATION 7.3.3 EGSM 900 Calibration Items A. GSM Ramp Up/Down Calibration - Purpose This item contains the GSM normal Tx burst up/down-ramp DAC values for each power level. When a GSM Tx burst is generated, it shall pass the ETSI standard power mask as well as Output RF Spectrum due to Modulation and Switching (OSRF).
  • Page 177 7. CALIBRATION B. GSM Freq. Comp. Calibration - Purpose This item contains the change in Tx power of 7 ARFCN (Absolute Radio Frequency Channel Number) relative to a reference ARFCN (channel 49). NOTE 7 ARFCN + 1 ref channel = 8 channels. - Procedure Proposal 1.

  • Page 178: Dcs 1800 Calibration Items

    7. CALIBRATION 7.3.4 DCS 1800 Calibration Items A. DCS Ramp Up/Down Calibration - Purpose This item contains the DCS normal Tx burst up/down-ramp DAC values for each power level. When a DCS Tx burst is generated, it shall pass the ETSI standard power mask as well as Output RF Spectrum due to Modulation and Switching (OSRF).

  • Page 179: Pcs 1900 Calibration Items

    7. CALIBRATION B. DCS Freq. Comp. Calibration - Purpose This item contains the change in Tx power of 15 ARFCN (Absolute Radio Frequency Channel Number) relative to a reference ARFCN (channel 663). NOTE 15 ARFCN + 1 ref channel = 16 channels. - Procedure Proposal 1.
  • Page 180 7. CALIBRATION NV_GSM_1900_TX_BURST_UP_RAMP_INDEX_X = (X, Y(x) (i) ), where X is a power level For Power Control Level X= 5 to 19 For i = 1 to 30 (Number of step for Ramp Up) NV_GSM_1900_TX_BURST_UP_RAMP_INDEX_X[X, Y(x) (i)] = DCS_PA_DAC_CODE[X] - DAC Table [X,Y(x) (i)] Next i Next x...

  • Page 181: Wcdma Calibration Items

    7. CALIBRATION 7.3.6 WCDMA Calibration Items A. TX Linearity Calibration - Purpose This item contains the TX_AGC_ADJ PDM values that make up the Tx Master Linearizer for low (or high) PA gain state (PA Range 0 or 1). The linearizer is made up of 37 values for 37 equally spaced Tx power levels, 33 points over the phone true dynamic range, 2 points on the high side of the dynamic range, and 2 points on the low side of the dynamic range.
  • Page 182 7. CALIBRATION B. TX HDET Calibration - Purpose This item is for building a lookup table, which indexes Tx power estimation via a scaled TX_GAIN_CTL (representing the desired Tx power), to associated HDET circuit values at reference temperature and the reference frequency. - NV Items There are three NV items stored in non-volatile (NV) memory as following 1.
  • Page 183 7. CALIBRATION 3. Store the NV item such that: NV_CDMA_TX_LIM_VS_FREQ[i] = 12*(PowerRef - Power[i]) Note that the first index will correspond to the lowest frequency. E. RX Linearity Calibration - Purpose This item contains the DVGA gain value that makes the RSSI of the DVGA equal to the corresponding power levels at the antenna port, at ambient temperature, and reference frequency.
  • Page 184 7. CALIBRATION F. RX Freq. Calibraion - Purpose This item contains 15 VGA gain offset values relative to a reference frequency. These values are represented by an 8-bit signed number. The values are the change between the reference frequency VGA gain offset value and the VGA gain offset value at the frequency of interest. These values, once calibrated, ensure that the RSSI will align with received frequency.
  • Page 185 7. CALIBRATION H. RX LNA Freq. Calibration - Purpose This item contains 15 adjustment values relative to the reference frequency for the NV_WCDMA_LNA_RANGE_OFFSET item. These NV values should be considered as adjustments for gain variation of the LNA gain step based on the frequency index. These values are represented by an 8-bit signed number.

  • Page 186: Program Operation

    7.4 Program Operation 7.4.1 Pegasus Program Overview When you try to calibrate the U8290 mobile phone, you should make a configuration of calibration environment as shown in Figure 7-1. And if you finish making configuration, please execute the Pegasus program. Running the Pegasus program, you should show Pegasus program window like shown in Figure 7-4.
  • Page 187 7. CALIBRATION A. Serial Port Setup - Function As shown in Figure 7-5, Serial Port Setup section supports setting the connection between PC and U8290. Figure 7-5. Serial Port Setup - Procedure Proposal 1. First you have to setup your hardware: connect interface cable to one of the serial communication ports (so COM1, COM2, COM3, or COM4) of your PC.
  • Page 188 As shown in Figure 7-7, Phone Select Setup section supports selecting phone’s model to calibrate. - Procedure Proposal 1. Select phone’s model (default: U8290) to calibrate phone. Figure 7-7. Phone Select Setup 2. To backup calibrated NV items, type in your phone’s serial number on ‘NUM’ box. Typed number would be the file name of backup data (NUM_[time].xls).
  • Page 189 - Function As shown in Figure 7-11, Calibration Type Setup section supports selecting calibration band. Figure 7-11. Calibration Type - Procedure Proposal 1. Check the radio button to calibrate band. Note To calibrate U8290, check ‘WCDMA+GSM’ is recommended. - 190 -...
  • Page 190 7. CALIBRATION H. Calibration Items - Function As shown in Figure 7-12, Calibration Items Setup section supports running calibration process for single NV item. Figure 7-12. Calibration Type - Procedure Proposal 1. Click wanted single calibration NV item on Calibration Items section. I.

  • Page 191: Calibration Procedure

    7.4.3 Calibration Procedure Calibration procedure of Pegasus was the same as below procedure. 1. Setup instruments and U8290 mobile phone as depicted in Figure 7-1. 2. Turn on all instruments and U8290 mobile phone. 3. Setup Com ‘Port’ and ‘Baudrate’. Then, click ‘Connect’ button to setup serial port connection from PC to U8290 in Serial Port Set section.

  • Page 192: Pegasus Configuration File Format

    7. CALIBRATION Figure 7-15. (a) Calibration PASS Message Window and (b) Calibration FAIL Message Window 7.4.5 Pegasus Configuration File Format A. “CalInit.cfg” file The initial values of Pegasus can be set by changing configuration file (CalInit.cfg). Therefore, the configuration file should be located with Pegasus in the same folder. The configuration file includes items related to Pegasus’s internal variables such as default channel, default cable loss, temperature offset values and etc.
  • Page 193 7. CALIBRATION B. “dacTable.cfg” file The format of “dacTable.cfg” file is shown below. The values of this file make the characteristic of “Power vs Time” shape for GSM(ESGM/DCS/PCS) Modes to let the ETSI standard specification passed. Therefore it is not recommend to change this values without H/W engineer’s approval. Figure 7-16.

  • Page 194: Circuit Diagram

    8. CIRCUIT DIAGRAM FB502 FB503 < USB 48M CLK > C142 USB_XTAL_IN MICFBP FA-238 X100 C621 C622 48MHz MICINN 180K C141 USB_XTAL_OUT MICOUTP C108 0.1u C100 0.1u R101 C101 0.015u 470K 2012 2012 R100 C106 0.015u SDRAM_ADDR(0:14) 180K MICOUTN C107 0.1u C105 0.1u R104...
  • Page 195 8. CIRCUIT DIAGRAM ANT_SEL2 ANT_SEL1 ANT_SEL0 GSM_PA_BAND MODE TX_VCO_EN_0_N TX_VCO_EN_1_N GSM 900 TX HIGH GSM900 HIGH DCS/PCS GSM 900 RX/WCDMA HIGH DCS1800/PCS1900 TX HIGH HIGH DCS1800/PCS1900 HIGH ANT200 DCS 1800 RX HIGH HIGH HIGH PCS 1900 RX HIGH RF200 R221 C279 2.2nH L220...
  • Page 196 8. CIRCUIT DIAGRAM VREG_CAM_2.6V VREG_MSMP_2.6V CONNECTOR U606 SI91841DT-18-T1 VREG_MSMP_2.6V VOUT VREG_CAM_1.8V HF_N C649 M_CAM_EN CN301 Q506 C643 C650 HF_MODE DTC114EE I2C_SDA 0.01u 4.7u CAM_DATA(7) HB-1M1005-600JT CAM_DATA(6) CAM_DSP_CLK HB-1M1005-600JT CAM_HSYNC CAM_DATA(3) FB301 CAM_DATA(0) C318 CAM_PCLK CAM_RESET_N CAM_DATA(2) FB303 I2C_SCL CAM_DATA(1) C646 CAM_VSYNC HH-1M1608-121JT FB305...
  • Page 197 8. CIRCUIT DIAGRAM BLUETOOTH IRDA VREG_MSMP_TCXO U400 SI91841DT-18-T1 U405 VREG_MSMA_2.6V MICBIAS_LDO_1.8V VOUT RPM840-H11 VREG_BT_2.85V MICBIAS R404 C400 C402 VREG_MSMP_TCXO C625 0.01u IrDA_SD RX_IrDA U406 SHIELD TX_IrDA L507 BT_SBST SBST TX-RC 1.5nH SBCK BT_SBCK MIC1 SBDT BT_SBDT LEDA C401 BT_TX_RX_N MIC1P SYNC_DET_TX_EN RX_BB_TX_BB BT_DATA...
  • Page 198 8. CIRCUIT DIAGRAM C633 R509 VREG_MSMP_TCXO VBATT_TEMP 0.01u R648 R623 HEADPHONE_R (1%) C634 80.6K C541 0.01u R649 R622 0.068u HEADPHONE_L 80.6K C651 C652 U605 TPA2005D1ZQYR 0.015u 0.015u VDD1 +VPWR VDD2 R644 SPK- C648 LOUD_SPK_EN SPK+ C632 +VPWR C534 Q500 CHG_CNT_N +5V_PWR 2SB1424 ICHARGE...
  • Page 199 8. CIRCUIT DIAGRAM MEMORY SDRAM_DATA(0:31) SDRAM_ADDR(0:12) SDRAM_DATA(0) SDRAM_ADDR(0) SDRAM_DATA(1) SDRAM_ADDR(1) SDRAM_DATA(2) SDRAM_ADDR(2) SDRAM_DATA(3) SDRAM_ADDR(3) SDRAM_DATA(4) SDRAM_ADDR(4) SDRAM_DATA(5) SDRAM_ADDR(5) SDRAM_DATA(6) SDRAM_ADDR(6) U600 SDRAM_DATA(7) SDRAM_ADDR(7) SDRAM_DATA(8) SDRAM_ADDR(8) SDRAM_DATA(9) SDRAM_ADDR(9) MMC_CD MMC_CMD SDRAM_DATA(10) SDRAM_ADDR(10) DQ10 SDRAM_DATA(11) SDRAM_ADDR(11) DQ11 VREG_T-FLASH_3.0V SDRAM_DATA(12) SDRAM_ADDR(12) DQ12 SDRAM_DATA(13) DQ13 MMC_DATA MMC_CLK...
  • Page 200 8. CIRCUIT DIAGRAM +VPWR +VPWR RCV+ ON_SW* SPK+ LD11 LD12 SPK- RCV- KEY_ROW(2) LEBB-S14H LEBB-S14H LEBB-S14H UCLAMP0505A AVLC14S02050 KEY_ROW(1) LEBB-S14H LEBB-S14H LEBB-S14H SM8132AB VM_LED1 DIN1 VM_LED2 DIN2 AVLC14S02050 VM_LED3 DIN3 KEY_ROW(0) LEBB-S14H LEBB-S14H LEBB-S14H VM_LED4 DIN4 LD10 AVLC14S02050 +VPWR KEY_COL(5) LEBB-S14H LEBB-S14H LEBB-S14H...
  • Page 201 8. CIRCUIT DIAGRAM AXK8L44125J AXK840145J LCD_IF_MODE VREG_LCD_3.0V SPK+ VREG_LCD_3.0V LCD_RESET_N SPK- VREG_LED MAIN_LCD_CS_N LCD_RESET_N RCV+ LCD_ADS SUB_LCD_CS_N RCV- EBI2_DATA(0) SUB_LCD_CS_N LCD_IF_MODE +VPWR EBI2_DATA(1) EBI2_WE_N EBI2_DATA(0) MOT_PWR- EBI2_DATA(2) VM_LED1 EBI2_DATA(1) LCD_MAKER_ID EBI2_DATA(3) EBI2_DATA(8) EBI2_DATA(2) LCD_ADS EBI2_DATA(4) EBI2_DATA(9) EBI2_DATA(3) MAIN_LCD_CS_N EBI2_DATA(5) EBI2_DATA(10) EBI2_DATA(4) EBI2_WE_N EBI2_DATA(6)

  • Page 202: Pcb Layout

    9. PCB LAYOUT - 203 -...
  • Page 203 9. PCB LAYOUT - 204 -...
  • Page 204 9. PCB LAYOUT - 205 -...
  • Page 205 9. PCB LAYOUT - 206 -...
  • Page 206 9. PCB LAYOUT - 207 -...

  • Page 207: Exploded View & Replacement Part List

    10. EXPLODED VIEW & REPLACEMENT PART LIST 10.1 EXPLODED VIEW - 208 -...

  • Page 208: Replacement Parts

    10. EXPLODED VIEW & REPLACEMENT PART LIST 10.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC <Mechanic component> Location Level Description Part Number Specification Color Remark IMT,FOLDER TIFF0010601 Silver Snow AAAY00 ADDITION AAAY0118401...
  • Page 209 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark Without MICC01 INSERT,FRONT(UPPER) MICC0008501 Color Without MPBJ00 PAD,MOTOR MPBJ0023601 Color Without MPBN00 PAD,SPEAKER MPBN0018201 Color Without MPBQ00 PAD,LCD(SUB) MPBQ0021501 Color MPBS00 PAD,FOLDER MPBS0003801 Silver Without MTAA00 TAPE,DECO MTAA0075801...
  • Page 210 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark Aluminum BFAA00 FILM,INMOLD BFAA0028901 U8200 Silver Without MWAF00 WINDOW,LCD(SUB) MWAF0026301 Color Without GMEY00 SCREW MACHINE,BIND GMEY0011201 1.4 mm,3 mm,MSWR3(BK) ,N ,+ ,NYLOK Color Color MCCH00 CAP,SCREW MCCH0048801 Unfixed...
  • Page 211 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark Color MCCC00 CAP,EARPHONE JACK MCCC0023301 Unfixed Color MCCG00 CAP,MULTIMEDIA CARD MCCG0002001 Unfixed Without MCIA00 CONTACT,ANTENNA MCIA0014001 Color Color MCJN00 COVER,REAR MCJN0034301 Unfixed Color MICZ INSERT MICZ0014901 Unfixed MLAN00...
  • Page 212 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark MCCH01 CAP,SCREW MCCH0049201 Silver Without MFEA00 FRAME,SHIELD MFEA0007001 Color MLAK00 LABEL,MODEL MLAK0010701 G7200 (CE0889) White Without ADCA00 DOME ASSY,METAL ADCA0039401 Color - 213 -...

  • Page 213: Main Component

    10. EXPLODED VIEW & REPLACEMENT PART LIST 10.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC <Main component> Location Level Description Part Number Specification Color Remark SVCY02 CAMERA SVCY0005701 CMOS ,MEGA ,1.3M Omnivision Sensor SAEY00 PCB ASSY,KEYPAD SAEY0040903...
  • Page 214 18 V, ,SMD ,50pF, 2012, 4 ARRAY VARISTOR VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 SPEY00 PCB,KEYPAD SPEY0036501 FR-4 ,0.5 mm,BuildUp4 ,U8290 KEYPAD PCB SAFY00 PCB ASSY,MAIN SAFY0127602 SAFB00 PCB ASSY,MAIN,INSERT SAFB0042502 SAFF00 PCB ASSY,MAIN,SMT SAFF0054101...
  • Page 215 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark PCB ASSY,MAIN,SMT SAFC00 SAFC0057101 BOTTOM ANT400 ANTENNA,MOBILE,FIXED SNMF0015901 2.1 ,-3.2 dB,Chip_Bluetooth_Ceramic(9*2.5*2) C102 CAP,CERAMIC,CHIP ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP C115 CAP,CERAMIC,CHIP ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP C145 CAP,CERAMIC,CHIP ECCH0000167...
  • Page 216 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C301 CAP,CERAMIC,CHIP ECCH0000142 820 pF,50V,K,X7R,HD,1005,R/TP C302 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C303 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C304 CAP,CERAMIC,CHIP ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP C305 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C306 CAP,FILM,MPP ECFD0000103...
  • Page 217 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C412 CAP,CERAMIC,CHIP ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C413 CAP,CERAMIC,CHIP ECCH0005801 2.2 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP C414 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C420 CAP,CERAMIC,CHIP ECCH0000167...
  • Page 218 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C536 CAP,CERAMIC,CHIP ECCH0005801 2.2 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP C537 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP C538 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP C539 CAP,CERAMIC,CHIP ECCH0006201...
  • Page 219 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark D502 DIODE,TVS EDTY0001901 SOD-323 ,6 V,350 W,R/TP ,Junction capacitance:350 pF SC-89 ,5 V,100 W,R/TP ,5 Channel Array , Vc 12V , 75pF , D503 DIODE,TVS EDTY0007601 1.6*1.625*0.58 D504...
  • Page 220 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R225 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP R226 RES,CHIP ERHY0000263 15K ohm,1/16W,J,1005,R/TP R227 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP R228 RES,CHIP ERHY0000205 15 ohm,1/16W,J,1005,R/TP R229 RES,CHIP ERHY0000228 270 ohm,1/16W,J,1005,R/TP R230 RES,CHIP ERHY0000245...
  • Page 221 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R605 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R609 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP R611 RES,CHIP ERHY0000263 15K ohm,1/16W,J,1005,R/TP R613 RES,CHIP ERHY0000169 470000 ohm,1/16W ,F ,1005 ,R/TP R614 RES,CHIP ERHY0000199 680 Kohm,1/16W ,F ,1005 ,R/TP R622...
  • Page 222 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005...
  • Page 223 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C125 CAP,CERAMIC,CHIP ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP C126 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C127 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C128 CAP,CERAMIC,CHIP ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP C129 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C130 CAP,CERAMIC,CHIP ECCH0000143...
  • Page 224 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C214 CAP,CERAMIC,CHIP ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP C215 CAP,CERAMIC,CHIP ECCH0000102 1 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP C216 CAP,CERAMIC,CHIP ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP C217 CAP,CERAMIC,CHIP ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP C218 CAP,CERAMIC,CHIP ECCH0000167...
  • Page 225 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C250 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C251 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C252 CAP,CERAMIC,CHIP ECCH0000151 4.7 nF,25V,K,X7R,HD,1005,R/TP C253 CAP,CERAMIC,CHIP ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C255 CAP,CERAMIC,CHIP ECCH0000107...
  • Page 226 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C600 CAP,CERAMIC,CHIP ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP C601 CAP,CERAMIC,CHIP ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP C602 CAP,CERAMIC,CHIP ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP C603 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C604 CAP,CERAMIC,CHIP ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP C605 CAP,CERAMIC,CHIP ECCH0000167...
  • Page 227 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark FL202 FILTER,SAW SFSY0021801 1842.5 MHz,2.0*1.4*0.68 ,SMD ,5pin, Unbal-Bal, 50//150 FL203 FILTER,SAW SFSY0025501 1960 MHz,2.0*1.4*0.68 ,SMD ,Balanced Output (150ohm) FL204 FILTER,SAW SFSY0023001 1950 MHz,2.0*1.4*0.8 ,SMD ,5pin, Unbal-Unbal, 50//50 L200 INDUCTOR,CHIP ELCH0001004...
  • Page 228 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark Q505 TR,BJT,ARRAY EQBA0000301 SC-88A,0.15W,R/TP,NPN/PNP DUAL R100 RES,CHIP ERHY0000169 470000 ohm,1/16W ,F ,1005 ,R/TP R101 RES,CHIP ERHY0000160 180K ohm,1/16W,F,1005,R/TP R102 RES,CHIP ERHY0000125 10K ohm,1/16W,F,1005,R/TP R103 RES,CHIP ERHY0000125 10K ohm,1/16W,F,1005,R/TP R104...
  • Page 229 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R219 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP R220 RES,CHIP ERHY0011601 11 Kohm,1/16W ,F ,1005 ,R/TP R400 RES,CHIP ERHY0000247 2.2K ohm,1/16W,J,1005,R/TP R402 RES,CHIP ERHY0000247 2.2K ohm,1/16W,J,1005,R/TP R404 RES,CHIP ERHY0000202 4.7 ohm,1/16W,J,1005,R/TP R500...
  • Page 230 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark U500 EUSY0084701 SSOP5-P-A ,6 PIN,R/TP ,Inverter, Pb Free U600 DIODE,TVS EDTY0007801 SC-70 ,5 V,150 W,R/TP ,LOW CAPACITANCE TVS ARRAY TFBGA ,225 PIN,ETC ,512M(X8) NAND+512M(256*2/32 U601 EUSY0216702 BITS IO) SDRAM / LEAD FREE 10 uMAX ,10 PIN,R/TP ,DUAL SPDT ANALOG SWITCH,...

  • Page 231: Accessory

    10. EXPLODED VIEW & REPLACEMENT PART LIST 10.3 Accessory Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC Location Level Description Part Number Specification Color Remark MHBY00 HANDSTRAP MHBY0002101 T5100 RUSSV Square Coupling, Cow Leather Metal Silver 3.7 V,1400 mAh,1 CELL,PRISMATIC ,U8130 BATTERY(Li- SBPL00...

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