1. INTRODUCTION 1. INTRODUCTION 1.1 Purpose This manual provides the information necessary to repair, calibration, description and download the features of this model. 1.2 Regulatory Information A. Security Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services.
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1. INTRODUCTION E. Notice of Radiated Emissions This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user. F.
2. PERFORMANCE 2. PERFORMANCE 2.1 System Overview Item Specification Shape GSM900/1800/1900 and WCDMA Folder Handset Size 89.2 X 47.8 X 24.5 mm Weight 115 g (with Battery) Power 4.0V normal, 1400 mAh Li-Polymer Over 170 min (WCDMA, Tx=12 dBm, Voice) Talk Time Over 220 min (GSM, Tx=Max, Voice) Over 170 Hrs (WCDMA, DRX=1.28)
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2. PERFORMANCE Item DCS & PCS Frequency offset 800kHz Intermodulation product should Intermodulation attenuation – be Less than 55dB below the level of Wanted signal Power control Power Tolerance Power control Power Tolerance Level (dBm) (dB) Level (dBm) (dB) ±3 ±3 ±3 ±3...
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2. PERFORMANCE 2) Transmitter-WCDMA Mode Item Specification Class3: +24dBm(+1/-3dB) Maximum Output Power Class4: +21dBm(±2dB) Frequency Error ±0.1ppm Open Loop Power control in uplink ±9dB@normal, ±12dB@extreme Adjust output(TPC command) +0.5/1.5 +1/3 +1.5/4.5 Inner Loop Power control in uplink -0.5/+0.5 -0.5/+0.5 -0.5/+0.5 -0.5/-1.5 -1/-3 -1.5/-4.5...
2. PERFORMANCE 2.4 Current Consumption Stand by Voice Call Under 8.5 mA Under 450 mA Under 640mA WCDMA (DRX=1.28) (Tx=12dBm) (Tx=12dBm) Under 6.3 mA Under 380 mA (Paging=9period) (Tx=Max) Under 7.0 mA (@Bluetooth Connected, Paging=9period) (Stand by and Voice Call Test Condition : Bluetooth off, LCD backlight Off) (VT Test Condition : Speaker off, LCD backlight On) 2.5 RSSI Bar Level Change...
2. PERFORMANCE 2.8 Charging • Charging Method: CC & CV (Constant Current and Constant Voltage) • Maximum Charging Voltage: 4.2 V • Maximum Charging Current: 600 mA • Normal Battery Capacity: 1400 mAh • Charging Time: Max 4.0 hours (except for trickle charging time) •...
3. TECHNICAL BRIEF 3. TECHNICAL BRIEF 3.1 General Description The U8210 supports UMTS-2100 DS-WCDMA, EGSM-900, DCS-1800, and PCS-1900. All receivers and the UMTS transmitter use the radioOne Zero-IF architecture to eliminate intermediate frequencies, directly converting signals between RF and baseband. The EGSM, DCS1800 and PCS1900 transmitters use a baseband-to-IF upconversion followed by an offset phase-locked loop that translates the GMSK-modulated signal to RF.
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(APC) circuit that samples the transmit power and adjusts its level, the switch module (which includes a band-appropriate lowpass filter), and the antenna. U8210 power supply voltages are managed and regulated by the PM6650 Power Management IC. This versatile device integrates all wireless handset power management, general housekeeping, and user interface support functions into a single mixed signal IC.
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3. TECHNICAL BRIEF The device’s general housekeeping functions include an ADC and analog multiplexer circuit for monitoring on-chip voltage sources, charging status, and current flow, as well as user-defined off-chip variables such as temperature, RF output power, and battery ID. Various oscillator, clock, and counter circuits support IC and higher-level handset functions.
DCS, and PCS). The antenna switch module allows multiple operating bands and modes to share the same antenna. In U8210, a common antenna connects to one of six paths: 1) UMTS-2100 Rx/Tx, 2) EGSM-900 Rx, 3) EGSM-900 Tx, 4) DCS-1800 Rx, and 5) DCS-1800,PCS-1900 Tx(High Band Tx’s share the same path), 6) PCS-1900 Rx.
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3. TECHNICAL BRIEF The EGSM, DCS, and PCS receiver inputs of RTR6250 are connected directly to the transceiver front- end circuits(filters and antenna switch module). EGSM, DCS, and PCS receiver inputs are similar to the RFR6200 UMTS Rx input in that they also use differential configurations to improve common- mode rejection and second-order non-linearity performance.
3. TECHNICAL BRIEF 3.2.2 GSM Transmitter The shared GSM Low-band (EGSM900) and High-band (DCS1800, PCS1900) transmit path begins with the baseband inputs from the MSM6250 IC. These differential analog input signals are buffered, lowpass filtered, corrected for DC offsets then applied to the GSM quadrature upconverter. The upconverter LO signals are generated from the transceiver VCO signal by the LO distribution and generation circuits within RTR6250.
3. TECHNICAL BRIEF The waveform at the dual Tx VCO output is the GMSK-modulated signal centered at the desired GSM channel frequency. A phase-locked loop circuit is used to translate the GMSK-modulated signal from IF to RF primarily for two reasons: 1.
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3. TECHNICAL BRIEF VDDM VDDA Bias and SBCK R_BIAS Control SBST SBDT Circuits UMTS_BIAS UMTS_IN UMTS_OUT Ground Slug Figure 3.3.1-1 RFL6200 IC functional block diagram The UMTS LNA output is routed to the RFR6200 through a band selection filter that transforms a single-ended 50Ω...
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3. TECHNICAL BRIEF The RFR6200 IC includes LO generation and distribution circuitry to reduce offchip component requirements. The UMTS Rx LO source is created using an external UMTS Rx CH VCO that is closed- loop controlled by the RTR6250 PLL2 via a discrete loop filter. The external UMTS_RX_VCO signal is processed by the LO generation and distribution circuits to create the quadrature downconverter LO signal.
The RTR6250 UMTS output is routed to its power amplifier through a bandpass filter, and delivers fairly high-level signals that are filtered and applied to the PA. The PA device used in U8210 is “Load Insensitive PA”- no need to use isolator - and routed to the duplexer Tx port directly. Transmit power is delivered from the duplexer to the antenna through the switch module.
AC-couple the inactive pin to ground using an appropriately valued capacitor (12 pF is used in U8210). The 27 pF capacitor should be used to AC-couple the active pin to the VCO signal. Using only the selected VCO signal, the RFR6200 IC LO generation and distribution circuits create the necessary LO signals for the active quadrature downconverter.
3. TECHNICAL BRIEF Most UMTS Rx PLL circuits are included within the RTR6250 IC: reference divider, phase detector, charge pump, feedback divider, and digital logic that generate LOCK status. The buffered 19.2 MHz TCXO signal provides the synthesizer input (REF), the frequency reference to which the PLL is phase and frequency locked.
A UMTS duplexer splits a single operating band into receive and transmit paths. Important performance requirements include: -. Insertion loss . this component is also in the receive and transmit paths; In the U8210 typical losses: UMTS Tx = 1.2 dB, UMTS Rx = 1.5 dB.
3. TECHNICAL BRIEF -. Return loss . minimize mismatch losses with typical return losses of 10 dB or more (VSWR < 2). -. Power handling . high power levels in the transmit path must be accommodated without degraded performance. The specified level depends on the operating band class and mobile station class (per the applicable standard), as well as circuit losses and antenna EIRP.
Its detector coupling range and converted voltage is based on diode sensitivity and transmitter power level. The U8210 uses National Semiconductor LMV225TLX power detector IC. In Figure 3.5.5.-1, R1 is set to 1.8 Kohm resulting in an attenuation of 31.4dB. The output voltage is proportional to the logarithm of the input power.
3. TECHNICAL BRIEF LMV225 20076001 Figure 3.5.5-1 Block diagram of LMV225TLX with high resistive tap Figure 3.5.5-2 Power detector response, Vout vs PA output power 3.5.6 Dual band GSM power amplifier (U209 : SKY77328) The SKY77328 Power Amplifier Module (PAM) is designed in a low profile (1.2 mm), compact form factor for quad-band cellular handsets comprising GSM850/900, DCS1800, and PCS1900 operation.
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3. TECHNICAL BRIEF Fabricated onto a single Gallium Arsenide (GaAs) die, one Heterojunction Bipolar Transistor (HBT) PA block supports the GSM850/900 bands and the other supports the DCS1800 and PCS1900 bands. Both PA blocks share common power supply pins to distribute current. The GaAs die, the Silicon (Si) die, and the passive components are mounted on a multi-layer laminate substrate.
3. TECHNICAL BRIEF 3.5.7 GSM transmit VCO (U210 : MQW5V0C869M) The dual Tx VCO is a key component within the GSM OPLL. This VCO performance directly impacts PLL and transmitter performance. VCO specifications refer to muRata MQW5V0C869M datasheet. The dual Tx VCO outputs, one for Low-band GSM and one for high band GSM, drive a resistive network that splits the active signal into two signals: 1) the input to the active PA.
3.5.12 Bluetooth (U406 : RB06A, ANT400 : KFBA090025020AA ) The MSM6250 includes BT baseband embedded BT 1.1 compliant baseband core, so the other bluetooth components are an bluetooth RF module and Antenna. Figure 3.5.12-1 shows the bluetooth system architecture in the U8210. - 37 -...
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3. TECHNICAL BRIEF Figure 3.5.12-1 Bluetooth system architecture - 38 -...
3. TECHNICAL BRIEF 3. BB Technical Description 3.6 Digital Baseband(DBB/MSM6250) 3.6.1 General Description A. Features(MSM6250) • The ARM926EJ-S microprocessor can operate at up to 150 MHz with variable rate, software controlled clocks to provide greater standby time. • Integrated PLL to provide additional on-chip clock frequencies •...
3. TECHNICAL BRIEF 3.8 Subsystem(MSM6250) 3.8.1 ARM Microprocessor Subsystem The MSM6250 device uses an embedded ARM926EJ-S microprocessor. This microprocessor, through the system software, controls most of the functionality for the MSM, including control of the external peripherals such as the keypad, LCD, RAM, and ROM devices. Through a QUALCOMM proprietary serial bus interface (SBI) the ARM926EJ-S configures and controls the functionality of the RTR6250, RFR6200, RFL6200, and PM6650 devices.
3. TECHNICAL BRIEF 3.8.6 Wideband CODEC The MSM6250 device integrates a wideband voice/audio CODEC into the mobile station modem (MSM). The CODEC supports two differential microphone inputs, one differential earphone output, one single-ended earphone output, and a differential analog auxiliary interface on two single-ended earphone output.
3. TECHNICAL BRIEF 3.8.11 UART There are three UARTs in the MSM6250 ASIC: • UART1 for data • UART2 (can be used for USIM interface) • UART3 (can be used for PM SBI interface) 3.8.12 USB The MSM6250 device integrates a universal serial bus (USB) controller that supports both unidirectional and bidirectional transceiver interfaces.
3. TECHNICAL BRIEF 3.10 H/W Subsystem 3.10.1 RF Interface A. RTR6250(WCDMA_Tx, GSM_Tx/Rx) MSM6250 controls RF part(RTR6250) using these signals. • SBST,SBDT,SBCK : SBI I/F signals for control Sub-chipset • PAON : Power AMP on RF part • RX_I/Q,TX_I/Q : I/Q for Tx/Rx of RF •...
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3. TECHNICAL BRIEF B. RFR6200(WCDMA_Rx) • SBST,SBDT,SBCK : SBI I/F signals for control Sub-chipset • RX_I/Q, : I/Q for Rx of RF C. RFL6200(WCDMA_Rx_LNA) • SBST,SBDT,SBCK : SBI I/F signals for control Sub-chipset D. the others • UHF_VCO_BAND_SEL : WCDMA(3G)/GSM(2G) VCO Band Selection of UHF VCO •...
3. TECHNICAL BRIEF 3.10.2 MSM Subsystem 3.10.2.1 USIM Interface USIM interface scheme is shown in Figure. And, there control signals are followed • USIM_CLK : USIM Clock • USIM_Reset : USIM Reset • USIM_Data : USIM Data Tx/Rx VREG_USIM 2.85V USIM CLK PM6650 USIM CLK...
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3. TECHNICAL BRIEF 3.10.2.3 USB The MSM6250 device contains a Universal Serial Bus (USB) interface to provide an efficient interconnect between the mobile phone and a personal computer (PC). The USB interface of the MSM6250 was designed to comply with the definition of a peripheral as specified in USB Specification, Revision 1.1.
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3. TECHNICAL BRIEF 3.10.2.4 HKADC(House Keeping ADC) The MSM6250 device has an on-chip 8-bit analog-to-digital converter (HKADC) which is tended to digitize DC signals corresponding to analog parameters such as battery voltage, temperature, and RF power levels. The MSM6250 device has six analog input pins which are multiplexed to the input of the internal HKADC.
3. TECHNICAL BRIEF 3.10.3 Power Block 3.10.3.1 General MSM6250, included RF, is fully covered by PM6650(Qualcomm PMIC). PM6650 cover the power of MSM6260, MSM memory, RF block, Bluetooth, Camera, T-flash, USIM and TCXO. Major power components are : PM6650(U501) : Phone power supply SI91841DT_18(U400) : MSM MIC Bias SI91841DT_18(U606) : Camera Digital power MIC5205-3.0(U607) : LCD Power...
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3. TECHNICAL BRIEF VDD_SPKR Output USB-OTG REF_ISET Reference VREG_5V Voltage host power ckt VIB_DRV_N REF_BYP Circuit Voltage REF_GND Regulation USB_VBUS Control External Supply VSW_5V Detector +5V Boost VCHG Regulator IMAXSEL KPD_DRV_N VREG_5V USB_CTL_N Charger VREG_5V Control VMAXSEL VSW_MSMC CHG_CTL_N Core Buck VDD_MSMC Regulator VREG_MSMC...
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3. TECHNICAL BRIEF Trickle Charging Trickle Charging of the main battery, enabled through SBI control and powered from VDD, is provided by the PM6650 IC, The trickle charger is on-chip programmable current source that supplies current from VDD to pin (VBAT). Trickle charging can be used for lithium-ion and nickel-based batteries, with its performance specified below (3.2V).
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3. TECHNICAL BRIEF Constant Current Charging The PM6650 IC supports constant current charging of the main battery by controlling the charger pass transistor and the battery transistor. The constant current charging continues until the battery reaches its target voltage, 4.2V. Constant Voltage Charging Constant voltage charging begins when the battery voltage reaches a target voltage, 4.2V.
3. TECHNICAL BRIEF 3.10.4 Key Pad There are 26 buttons and 3 side keys in Figure. Shows the Keypad circuit. ‘END’ Key is connected On_SW to PMIC(PM6650) and MSM(GPIO76). COL0 COL1 COL2 COL3 COL4 COL5 ROW0 CLR (Clear) MENU Side key (camera) ROW1 LEFT Side key (Down)
3. TECHNICAL BRIEF 3.10.5 Camera Interface U8210 Installed a 1.3M Pixel CMOS VGA Camera. Below figure show the camera board to board connector and camera I/F signal. VREG_CAM_2.6V CONNECTOR CN301 I2C_SDA CAM_DATA(7) HB-1M1005-600JT CAM_DATA(6) CAM_DSP_CLK HB-1M1005-600JT CAM_HSYNC CAM_DATA(3) FB301 CAM_DATA(0)
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3. TECHNICAL BRIEF The Camera module is connected to main board with 24pin Board to Board connector (AXK7L24227). Its interface is dedicated camera interface port in MSM6250. The camera port supply 24MHz master clock to camera module and receive 12MHz pixel clock (30fps), vertical sync signal, horizontal sync signal, reset signal and 8bits data from camera module.
3. TECHNICAL BRIEF 3.10.6 Folder ON/OFF Operation There is a magnet to detect the folder status, opened or closed. If a magnet is close to the hall-effect switch, the voltage at pin2 of U604 goes to 0V. Otherwise, 2.6V. This folder signal is delivered to MSM6250 GPIO80. FOLDER DETECT U604 R616...
3. TECHNICAL BRIEF 3.10.7 Camera Direction Detection CAM_SENSE detects the Camera Direction (front or back) CAM_SENSOR TR400 R403 A3212ELH VREG_MSMP_2.6V CAM_SENSE C405 C403 0.1u Figure 3.10.7-1 Camera Direction Detection - 60 -...
3. TECHNICAL BRIEF 3.10.8 Keypad Light There are 17 blue LEDs in key board backlight circuit, which are driven by KEYBD_BACKLIGHT line form PM6650. +VPWR LD11 LD12 LEBB-S14H LEBB-S14H LEBB-S14H LEBB-S14H LEBB-S14H LEBB-S14H LEBB-S14H LEBB-S14H LEBB-S14H LD10 LEBB-S14H LEBB-S14H LEBB-S14H LD13 LD14 LD16...
3. TECHNICAL BRIEF 3.10.9 Camera Light Flash There is White LED in U8210 Folder Upper, and Drive circuit is in Main Board, which are showed below. Flash lighted by FLASH_ON Signal of FLASH_DRV_N in PM6650. - 62 -...
3. TECHNICAL BRIEF 3.10.10 LCD Module Vibrator MAIN Receiver Back Light MODULE LOUD SPK Camera Flash Figure 3.10.10-1 LCD Module Block Diagram MAIN LCD MODULE SUB LCD MODULE 260K Color TFT 176 * 220 Pixel 65K Color STN 96 * 96 Pixel Gate Drive IC Source te Drive IC Drive IC...
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3. TECHNICAL BRIEF 3.10.10.1 Display & LCD FPC Interface LCD module is connected to key board with 60-pin BtoB connector (CN300_24_5087_060_007_829) and Speaker, Receiver, Vibrator, Camera Flash is connected by soldering the leads to pads in LCD module. The LCD is controlled by 16-bit EBI2 in MSM6250 1 : GND 31 : GND 2 : SPK+ : Loud Speaker +...
3. TECHNICAL BRIEF 3.10.11 Audio and Sound 3.10.11.1 Overview of Audio & Sound path Head_Set MSM6250 (U100) Receiver Key PCB Module (B'd to B'd (U304) (B'd to B'd Conn.) Conn.) Loud Speaker Head_set MIC Voice Voice + MP3 + MIDI MIDI_Bell Figure 3.10.11.1-1 Audio &...
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3. TECHNICAL BRIEF 3.10.11.2 Audio Signal Processing & Interface Audio signal processing is divided Uplink path and downlink path. The uplink path amplifies the audio signal from MIC and converts this analog signal to digital signal and then transmit it to DBB Chip (MSM6250). This transmitted signal is reformed to fit in GSM &...
3. TECHNICAL BRIEF 3.10.11.3 Audio Mode Audio Mode includes three states.( Voice call, Video Telephony, Midi, MP3). And each states is sorted by followed Detail Mode according to external Devices (Receiver, Loud , Headset). Video Telephony Mode Operate on state of the WCDMA CALL. MODE Device Detail MODE...
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3. TECHNICAL BRIEF Voice Call Receiver Mode Path Head_Set MSM6250 (U100) Receiver Key PCB Module (B'd to B'd (B'd to B'd Conn.) Conn.) (U650) Loud Speaker Head_set MIC Voice Voice + MP3 + MIDI MIDI_Bell => Voice Call Receiver Mode is Implemented as bellow C621,C622(MSM6250 EAR1ON,EAR1OP) ->...
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3. TECHNICAL BRIEF Voice Call Head_Set Mode Path & Head video Telephony Mode Head_Set MSM6250 (U100) Receiver Key PCB Module (B'd to B'd (B'd to B'd Conn.) Conn.) (U650) Loud Speaker Head_set MIC Voice Voice + MP3 + MIDI MIDI_Bell =>...
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3. TECHNICAL BRIEF Voice Call Speaker Phone Mode & Video Telephony Mode Head_Set MSM6250 (U100) Receiver Key PCB Module (B'd to B'd (B'd to B'd Conn.) Conn.) (U650) Loud Speaker Head_set MIC Voice MIDI_Bell Voice + MP3 + MIDI => Voice Call Speaker Phone Mode is Implemented as bellow MSM6250 (HPH_L, HPH_R) ->...
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3. TECHNICAL BRIEF MIDI Ring Tone (Speaker) Head_Set MSM6250 (U100) Receiver Key PCB Module (B'd to B'd (B'd to B'd Conn.) Conn.) (U650) Loud Speaker Head_set MIC Voice MIDI_Bell Voice + MP3 + MIDI => MIDI Ring tone for speaker MSM6250 (HPH_L, HPH_R) ->...
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3. TECHNICAL BRIEF MIDI Ring Tone (Head_Set) Head_Set MSM6250 (U100) Receiver Key PCB Module (B'd to B'd (B'd to B'd Conn.) Conn.) (U650) Loud Speaker Head_set MIC Voice MIDI_Bell Voice + MP3 + MIDI => MIDI Ring tone for head_set MSM6250 (HPH_L, HPH_R) ->...
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3. TECHNICAL BRIEF MP3 Play (Speaker) Head_Set MSM6250 (U100) Receiver Key PCB Module (B'd to B'd (B'd to B'd Conn.) Conn.) (U650) Loud Speaker Head_set MIC Voice MIDI_Bell Voice + MP3 + MIDI => MP3 play path for speaker MSM6250 (HPH_L, HPH_R) -> R648, R649 -> C633, C634 -> R622, R623-> AMP(U605) -> B’d to B’d Connector ->...
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3. TECHNICAL BRIEF MP3 Play (Head_set) Head_Set MSM6250 (U100) Receiver Key PCB Module (B'd to B'd (B'd to B'd Conn.) Conn.) (U650) Loud Speaker Head_set MIC Voice Voice + MP3 + MIDI MIDI_Bell => MP3 play path for speaker MSM6250 (HPH_L, HPH_R) -> C626, C627 -> Ear_Jack -> Head_Set - 76 -...
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3. TECHNICAL BRIEF Audio & Sound Main Component There are 6 components in U8210 schematic Diagram. Part Number marked on U8210 Schematic Diagram. Component Design No. Maker Part No. Note MSM6250 U100 MSM6250 Base-Band Modem TPA2005D U605 TPA2005D1ZQYR Differential Audio Amp...
4. TROUBLE SHOOTING 4.3 Checking VCXO Block The reference frequency (19.2MHz) from U206 (VCXO) is used WCDMA TX part, GSM part and BB part. - 81 -...
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4. TROUBLE SHOOTING Check 1. Crystal part If you already check this crystal part, you can skip check 1. Test Point (Crystal Part) C265 VREG_TCXO_2.85V 1000p C276 C274 1000p 0.1u 19.2MHz R219 TRK_LO_ADJ VCONT TG-5001LA-19.2MHz C275 U206 0.01u C287 100p TCXO_PM C206 1000p...
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4. TROUBLE SHOOTING Check TP1 VCC of VCXO CHECK R540 of PMIC (U509) VCC ≥ 2.8V Check TP2 TRK_LO_ADJ Check R227 of MSM(U208) 2V ≥ Voltage ≥ 1V Check TP3.4.5 With Oscilloscope 2V ≥ Voltage ≥ 1V Check soldering and components VCXO is OK Check other part - 83 -...
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4. TROUBLE SHOOTING For testing, Max power output is needed. S et the Phone Tx is ON and PDM is 450 Check TP 1 RF Tx L e vel is OK Over 21dB m ? Check TP 2 Chec k ANT. SW Over 19dB m ? M o dule U207 Ch eck TP3...
4. TROUBLE SHOOTING 4.5.4 Checking PAM Block PAM control signal PA_ON : WCDMA Tx Power Detect IC(U203:HDET) Enable PA_FET_N : WCDMA PAM Vcc Control Signal (Q200) TX_AGC_ADJ : WCDMA Tx Power Amp Gain Control PA_FET_N PA_ON TX_AGC_ADJ PA_ON must be HIGH(over 2.5V) PA_FET_N must be LOW if the max Tx power is set (lower than 0.5V) PAM control signal PAM_OUT...
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4. TROUBLE SHOOTING S et the Phone Rx is ON Chec k bias1,2 Che ck bias block Over 2V ? so ldering Chec k TP1 Check RF200 Signal exist ? Chec k TP2 Chec k ANT. SW Signal exist ? Module U207 Chec k TP3 Che ck Duplexer U202...
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4. TROUBLE SHOOTING START Check TP1 GSM/DCS/PCS If GSM over 31dBm ? Tx is Ok If DCS/PCS over 28dBm ? Check other part Check TP2, TP3 Check ANT. SW If TP2 over 29dBm ? Module (U207) If TP3 over 25dBm ? Refer to chapter 4.4 Check PAM Block (U209) Check TXVCO (U210)
4. TROUBLE SHOOTING 4.6.4 Checking PAM Block PAM Control Signal TP1. GSM_PA_RAMP : Power Amp Gain Control. typically, 0.5V < Vapc < 2.6V, TP2. GSM_PA_EN : Power Amp Enable (Power ON : higher than 2.5V , Power OFF : lower than 0.7V) TP3.
4. TROUBLE SHOOTING 4.7 Bluetooth RF Block 1. Set phone to bluetooth test-mode : Enter Test Mode(277634#*#) → Module Test Set → BT DUT → BT DUT ON 2. Connect phone to bluetooth tester 3. Set channel to 39 4. Measure output-power 5.
4. TROUBLE SHOOTING 4.8 Main Features 4.8.1 LG-U8210 Main Features - Folder Type - WCDMA + GSM(900,1800) + PCS(1900) Triple mode - Dual color LCD(Main:260K TFT, Sub:65K STN) - 1.3M Pixel CMOS VGA Camera - 17 pi single way speaker...
4. TROUBLE SHOOTING 4.9 Main Component 4.9.1 LG-U8210 Main Component Dual Color LCD Module (LCD, 17 Pi Speaker, 12 Pi Motor) Key B'd Bottom Side & Top Side 1.3M Camera Stereo Head_Set Shied Frame Main Bíd Bottom Side Main Bíd Top Side...
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4. TROUBLE SHOOTING TOP Side U206 U606 U100-1 X100 S600 CN300 U601 BAT500 U607 U400 Reference Description Reference Description X100 USB Clock(48Mhz) U606 Camera LDO U100-1 MSM6250 U607 LCD LDO NAND Flash+SDRAM U601 U400 MIC bias LDO (64M + 64M) U206 TCXO (19.2Mhz) CON300...
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4. TROUBLE SHOOTING BOTTOM Upper Side TR400 CN304 CN301 U406 Reference Description Reference Description CN301 Camera Connector CN304 Head_Set Jack TR400 Camera Direction U406 Bluetooth Module Sense TR - 107 -...
4. TROUBLE SHOOTING 4.10 Power ON Trouble Power On sequence of U8210 is : PWR key press(Key PCB) → On_SW_PM* go to low(D500),PM6650 KPDPWR_N pin(24) → PM6650 Power Up → VREG_MSMC_1.375V(C539), VREG_MSME_1.8V(C537), VREG_MSMP_2.6V(C522), VREG_MSMA_2.6V(C520) VREG_TCXO_2.85V(C512) power up and system reset assert to MSM →...
4. TROUBLE SHOOTING 4.11 USB Trouble USB Initial sequence of U8210 is : USB connected to U8210 → USB_VBUS(D520) go to 5V → USB_D+ go to 3.3V → 48M Crystal on → USB_VP and USB_VN is triggered → USB work. Start...
4. TROUBLE SHOOTING 4.12 SIM Detect Trouble USB Initial sequence of U8210 is : USIM_CLK,USIM_RST,USIM_DATA triggered → VREG_USIM_2.85V go to 3.0V → USIM IF work Start Re-insert the SIM card Work well? Check U407, VREG_USIM_2.85V is 3.0V? U408 USIM_P_CLK is run?
4. TROUBLE SHOOTING 4.13 Key Sense Trouble Key Sense sequence of U8210 is : Default condition ROW(0-4) is 2.6V → Press the key → Corresponding row(x) go to 0V → Key sensing Start Change the side key ROW[0-4] Work well?
4. TROUBLE SHOOTING 4.14 Camera Trouble Camera control signals are generated by MSM6250. Start Check t he camera conn. and reconnect the camera Camera is OK? Change the Main boa rd VREG_CAM_2.6V is 2.6V? (C317) Check t he DSP_CLK Change the Main boa rd (FB301) Change t he camera Camera is OK...
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4. TROUBLE SHOOTING 4.15 Main LCD Trouble Main LCD control signals are generated by MSM6250. Those signal’s path are : MSM6250 → MAIN B’d → CN300 → CN2 → Key Pcb → CN1 → LCD Module START Press END key to turn the power on Follow the Power ON Is the circuit powered?
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4. TROUBLE SHOOTING LCD Control data flow - 116 -...
4. TROUBLE SHOOTING 4.16 Sub LCD Trouble Sub LCD control signals are generated by MSM6250. Those signal’s path are : MSM6250 → MAIN B’d → CN300 → CN2 → Key Pcb → CN1 → LCD Module START Press END key to turn the power on Follow the Power ON Is the circuit powered?
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4. TROUBLE SHOOTING LCD Control data flow - 118 -...
4. TROUBLE SHOOTING 4.17 Keypad Backlight Trouble Key Pad Back Light is on as below : Key pressing → KEYD_BACKLIGHT go to 0V → B’d to B’d connector → LED On Start Key p ress Signal VPWR is ab ove 3.2V? Check CN300,CN1 Signal KEYD_B ACKLIGHT Check CN300,CN1...
4. TROUBLE SHOOTING 4.18 Folder ON/OFF Trouble Folder On/Off is worked as below : Folder On/Off Event → Flip(U604 pin 2) is triggered(On : about 2.1V, Off : 0V) → MSM6250 Sense the Folder Event Start Check t he magnet in Insert the mag net folder Assy Appr oach the magnet to...
4. TROUBLE SHOOTING 4.19 Camera Direction Detection Trouble Camera direction detection is worked as below : Camera direction change Event → CAM_SENSE(TR400 pin 2) is triggered(On : about 2.1V, Off : 0V) → MSM6250 Sense the Camera direction change Event Start Change t he camera direct ion CAM_SENSE is 0V?
4. TROUBLE SHOOTING 4.20 Camera Flash Trouble Camera Flash is worked as below : PM6650 control the camera flash in Folder Assy → PM6650 Port 8(FLSH_DRV_N) → CN300(Flash_On) → CN2(Flash_On) → CN1 → LCD Module → FLASH LED FPCB Module Start Check t he Flash FPCB Reso ld er the FPCB...
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4. TROUBLE SHOOTING Flash LED FLASH_ON from Main Bíd PM6650 - 125 -...
4. TROUBLE SHOOTING 4.21 Audio Trouble Shooting Audio & Sound Signal Path are followed as below figure. We can check the trouble point corresponded error audio & sound mode. Head_Set MSM6250 (U100) Receiver Key PCB Module (B'd to B'd (B'd to B'd Conn.) Conn.) (U650)
4. TROUBLE SHOOTING Receiver Path Voice Receiver path as below: MSM6250 Ear1ON/Ear1OP → CN300(b’d to b’d connector) → CN2(b’d to b’d connector) → CN1(LCD b’d to b’d connector) → LCD module → Speaker Start Conne ct the phone to ne twor k Equipme nt and s etup c all Setup 1 KHz tone out The sin e wave appear at...
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4. TROUBLE SHOOTING Receiver Path for Head_set Voice Receiver & video telephony path for Head_Set as below: MSM6250 HPH_R, HPH_L → C626, C627 → CN304(Head_Set Jack) Start Conne ct the phone to ne twor k Equipme nt and s etup c all Setup 1 KHz tone out An d in sert head_Set EAR_SENSE*(R624) is 0V?
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4. TROUBLE SHOOTING MIDI Ring tone for speaker MIDI Ring tone speaker path as below: MSM6250 HPH_R, HPH_L → R648, R649 → C633, C634 → R622, R623 → U605(Amp) → CN300 → CN2 → CN1 → LCD module → speaker Start Play Th e Ring t one The Ring t one appe ar at...
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4. TROUBLE SHOOTING MIDI Ring tone for Head_Set MIDI Ring tone Head_Set path as below: Voice Receiver & video telephony path for Head_Set as below: MSM6250 HPH_R, HPH_L → C626, C627 → CN304(Head_Set Jack) Start Play t he Ring tone and i nsert the Head_set Check R624 i s 0V? or The Ring t one wave appear...
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4. TROUBLE SHOOTING MP3 play for speaker MP3 play for speaker path as below: MSM6250 HPH_R, HPH_L → R648, R649 → C633, C634 → R622, R623 → U605(Amp) → CN300 → CN2 → CN1 → LCD module → speaker Start Play Th e MP3 The MP3 appear at Change th e Main b oard...
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4. TROUBLE SHOOTING Microphone for Main MIC Main Microphone path as below: MIC → MIC pad(MIC1) → C401,C402 → MSM6250 → MIC feed back gain logic → MSM internal CODEC U400 SI91841DT-18-T1 FB502 FB503 VREG_MSMA_2.6V MICBIAS_LDO_1.8V VOUT MICBIAS C400 C402 C625 0.01u C621...
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4. TROUBLE SHOOTING Microphone for Head_Set MIC for Head_Set path as below: Insert Headset → Ear_Sense(R624) go 0V → MSM6250 sense Head_Set insertion → MIC signal go to MSM(C102, C115) EAR JACK MICBIAS_LDO_1.8V R625 VREG_MSMP_2.6V To prevent from CN304 TDMA noise. C102 MIC2P R640 600...
4. TROUBLE SHOOTING 4.22 Charger Trouble Shooting • Check Points Pass Tr Charging Current Flow (ON) Q500 CHG_CNT_N +5V_PWR 2SB1424 (4.6V) ICHARGE ICHARGEOUT +VPWR Battery FET Q502 (ON) 4.2~4.25V VBATT Main Battery SI3493DV BATT_FET_N Charging Procedure - Connecting TA - Control the charging current by PM6050 IC - Charging Current flows into the battery Check Point - Connection of TA...
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4. TROUBLE SHOOTING Start Check t he pin and ba ttery Connect terminals of I/O connect or Connect ion O K? Change I/O connect or Is the TA volt age 4.6V Change TA Is it charg ing p roper ly Af ter chang ing Q 500, Q502? Change t he board - 146 -...
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5. BLOCK DIAGRAM Block Ref. Name Part Name Function Comment U207 LMSP43MA-288 Switch Band select Common RF200 KMS-507 Test Connector Calibration, etc U206 TG-5001LA-19.2MHz VCTCXO 19.2MHz Bluetooth RF U406 LBDA254AN0 Bluetooth TRX Transceiver Bluetooth ANT400 LDA31 Antenna Bluetooth antenna U202 DMF1950IHC Duplexer U201...
6.1 Introduction LGMDP(Ver 1.4)is a software for downloading image files to the phone from Microsoft Windows 2000 or Microsoft Windows XP where the LG USB Modem driver (Ver 4.5 or later) is installed. 6.2 Downloading Procedure 1) Connecting to PC 1.
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6. DOWNLOAD It is ready for downloading. - 155 -...
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6. DOWNLOAD 2) Choosing image files 1. Choose a Boot loader Image file after clicking on ‘Browse’. (The file name can be different from yours.) • It’s very important to choose the correct file. The phone NEVER can work with the wrong bootloader file. Caution) Error message will show if you choose improper file.
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6. DOWNLOAD 2. Choose a Boot shell file after clicking on ‘Browse’. (The file name can be different from yours.) • It’s very important to choose the correct file. The phone NEVER can work with the wrong bootlshell file. Confirm the information on the message box. Caution) Error message will show if you choose improper file.
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6. DOWNLOAD 3. Choose a AMSS Modem Image file after clicking on ‘Browse’. (The file name can be different from yours.) Confirm the information on the message box. Caution) Error message will show if you choose improper file. - 158 -...
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6. DOWNLOAD 4. Choose a Media Image after clicking on ‘Browse’. (The file name can be different from yours.) Confirm the information on the message box. Caution) Error message will show if you choose improper file. - 159 -...
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6. DOWNLOAD 5. Choose a Module Image file after clicking on ‘Browse’. (The file name can be different from yours.) Confirm the information on the message box. Caution) Error message will show if you choose improper file. - 160 -...
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6. DOWNLOAD 6. Click on ‘Download’ to download. - 161 -...
6. DOWNLOAD 3) Downloading This is whole process for downloading. You will see pictures for each step from the next . Download Start (NV backup) (NV restore) Erase MEDIA directory Reset Erase MODULE directory Download MEDIA (EFS Erase) Download MODULE Download BOOTLOADER Reset Download BOOTSHELL...
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6. DOWNLOAD • • A message box which informs a new file for NV backup is created in the local directory is shown. • • Doing NV backup. • • Erasing the existing directory and files for the Module Image. - 163 -...
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6. DOWNLOAD • • Downloading the AMSS Modem image followed by the Bootloader and Bootshell images. • • Rebooting and wating for a while. • • Doing NV restore. - 164 -...
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6. DOWNLOAD • • Rebooting and wating for a while. • • Erasing the existing directory and files for the Media Image. • • Downloading the Media image. - 165 -...
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6. DOWNLOAD • • Downloading the Module image. • • Finally Download has been complete. - 166 -...
6. DOWNLOAD 6.3 Troubleshooting Download Errors 1) When the phone does not work after downloading 2) Media Erasing Error 3) NV Restore Error → Reboot the phone as the emergency mode (keep pressing “2” and “5” key while the phone is being booted).
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6. DOWNLOAD When you meet the “MEDIA Erasing error” before downloading Media Image, → Reboot the phone and then try to download the Media Image again with Module Image. • Both have to be downloaded at the same time. - 168 -...
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6. DOWNLOAD When you meet the “NV Restore error”, → Connect to the phone. - 169 -...
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6. DOWNLOAD → Click on ‘Cancel’. → Click on ‘NV Restore’ then several NV Backup files(*.nv2) are shown. • The files are saved every NV Backup. The name is based on the time when NV Backup is done.) - 170 -...
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6. DOWNLOAD → Select the proper file and click on ‘Restore’. → Reading the NV file and restore NV. - 171 -...
6. DOWNLOAD 6.4 Caution 1) Multi-downloading using the USB hub is not recommendable. 2) The Module and Media Image have to be downloaded at the same time. 3) ‘EFS Erase’ option will be erase everything (media, module, NV Items and user data) in EFS area. - 172 -...
This document describes the construction and the usage of the software used for the calibration of LG’s GSM/GPRS/WCDMA Multimedia Mobile Phone (U8210). The calibration menu and their results are displayed in PC terminal by Mobile phone. This calibration software includes GSM, DCS, PCS, WCDMA Band RF parts calibration.
7. CALIBRATION 7.3 Calibration Explanation 7.3.1 Overview In this section, it is explained each calibration item in the Pegasus. Also the explanation includes technical information such as basic formula of calibration and settings for key parameters related with Pegasus’s internal calibration process. At first, when any of calibration process is done, the results are displayed in the Pegasus result window.
7. CALIBRATION 7.3.3 EGSM 900 Calibration Items A. GSM Ramp Up/Down Calibration - Purpose This item contains the GSM normal Tx burst up/down-ramp DAC values for each power level. When a GSM Tx burst is generated, it shall pass the ETSI standard power mask as well as Output RF Spectrum due to Modulation and Switching (OSRF).
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7. CALIBRATION B. GSM Freq. Comp. Calibration - Purpose This item contains the change in Tx power of 7 ARFCN (Absolute Radio Frequency Channel Number) relative to a reference ARFCN (channel 49). NOTE 7 ARFCN + 1 ref channel = 8 channels. - Procedure Proposal 1.
7. CALIBRATION 7.3.4 DCS 1800 Calibration Items A. DCS Ramp Up/Down Calibration - Purpose This item contains the DCS normal Tx burst up/down-ramp DAC values for each power level. When a DCS Tx burst is generated, it shall pass the ETSI standard power mask as well as Output RF Spectrum due to Modulation and Switching (OSRF).
7. CALIBRATION B. DCS Freq. Comp. Calibration - Purpose This item contains the change in Tx power of 15 ARFCN (Absolute Radio Frequency Channel Number) relative to a reference ARFCN (channel 663). NOTE 15 ARFCN + 1 ref channel = 16 channels. - Procedure Proposal 1.
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7. CALIBRATION NV_GSM_1900_TX_BURST_UP_RAMP_INDEX_X = (X, Y(x) (i) ), where X is a power level For Power Control Level X= 5 to 19 For i = 1 to 30 (Number of step for Ramp Up) NV_GSM_1900_TX_BURST_UP_RAMP_INDEX_X[X, Y(x) (i)] = DCS_PA_DAC_CODE[X] - DAC Table [X,Y(x) (i)] Next i Next x...
7. CALIBRATION 7.3.6 WCDMA Calibration Items A. TX Linearity Calibration - Purpose This item contains the TX_AGC_ADJ PDM values that make up the Tx Master Linearizer for low (or high) PA gain state (PA Range 0 or 1). The linearizer is made up of 37 values for 37 equally spaced Tx power levels, 33 points over the phone true dynamic range, 2 points on the high side of the dynamic range, and 2 points on the low side of the dynamic range.
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7. CALIBRATION B. TX HDET Calibration - Purpose This item is for building a lookup table, which indexes Tx power estimation via a scaled TX_GAIN_CTL (representing the desired Tx power), to associated HDET circuit values at reference temperature and the reference frequency. - NV Items There are three NV items stored in non-volatile (NV) memory as following 1.
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7. CALIBRATION 3. Store the NV item such that: NV_CDMA_TX_LIM_VS_FREQ[i] = 12*(PowerRef - Power[i]) Note that the first index will correspond to the lowest frequency. E. RX Linearity Calibration - Purpose This item contains the DVGA gain value that makes the RSSI of the DVGA equal to the corresponding power levels at the antenna port, at ambient temperature, and reference frequency.
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7. CALIBRATION F. RX Freq. Calibraion - Purpose This item contains 15 VGA gain offset values relative to a reference frequency. These values are represented by an 8-bit signed number. The values are the change between the reference frequency VGA gain offset value and the VGA gain offset value at the frequency of interest. These values, once calibrated, ensure that the RSSI will align with received frequency.
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7. CALIBRATION H. RX LNA Freq. Calibration - Purpose This item contains 15 adjustment values relative to the reference frequency for the NV_WCDMA_LNA_RANGE_OFFSET item. These NV values should be considered as adjustments for gain variation of the LNA gain step based on the frequency index. These values are represented by an 8-bit signed number.
7.4 Program Operation 7.4.1 Pegasus Program Overview When you try to calibrate the U8210 mobile phone, you should make a configuration of calibration environment as shown in Figure 7-1. And if you finish making configuration, please execute the Pegasus program. Running the Pegasus program, you should show Pegasus program window like shown in Figure 7-4.
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7. CALIBRATION A. Serial Port Setup - Function As shown in Figure 7-5, Serial Port Setup section supports setting the connection between PC and U8210. Figure 7-5. Serial Port Setup - Procedure Proposal 1. First you have to setup your hardware: connect interface cable to one of the serial communication ports (so COM1, COM2, COM3, or COM4) of your PC.
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Figure 7-7. Phone Select Setup - Procedure Proposal 1. Select phone’s model (default: U8210) to calibrate phone. 2. To backup calibrated NV items, type in your phone’s serial number on ‘NUM’ box. Typed number would be the file name of backup data (NUM_[time].xls).
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- Function As shown in Figure 7-11, Calibration Type Setup section supports selecting calibration band. Figure 7-11. Calibration Type - Procedure Proposal 1. Check the radio button to calibrate band. Note To calibrate U8210, check ‘WCDMA+GSM’ is recommended. - 188 -...
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7. CALIBRATION H. Calibration Items - Function As shown in Figure 7-12, Calibration Items Setup section supports running calibration process for single NV item. Figure 7-12. Calibration Type - Procedure Proposal 1. Click wanted single calibration NV item on Calibration Items section. I.
7.4.3 Calibration Procedure Calibration procedure of Pegasus was the same as below procedure. 1. Setup instruments and U8210 mobile phone as depicted in Figure 7-1. 2. Turn on all instruments and U8210 mobile phone. 3. Setup Com ‘Port’ and ‘Baudrate’. Then, click ‘Connect’ button to setup serial port connection from PC to U8210 in Serial Port Set section.
7. CALIBRATION Figure 7-15. (a) Calibration PASS Message Window and (b) Calibration FAIL Message Window 7.4.5 Pegasus Configuration File Format A. “CalInit.cfg” file The initial values of Pegasus can be set by changing configuration file (CalInit.cfg). Therefore, the configuration file should be located with Pegasus in the same folder. The configuration file includes items related to Pegasus’s internal variables such as default channel, default cable loss, temperature offset values and etc.
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7. CALIBRATION B. “dacTable.cfg” file The format of “dacTable.cfg” file is shown below. The values of this file make the characteristic of “Power vs Time” shape for GSM(ESGM/DCS/PCS) Modes to let the ETSI standard specification passed. Therefore it is not recommend to change this values without H/W engineer’s approval. Figure 7-16.
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8. CIRCUIT DIAGRAM ANT_SEL2 ANT_SEL1 ANT_SEL0 GSM_PA_BAND MODE TX_VCO_EN_0_N TX_VCO_EN_1_N GSM 900 TX HIGH GSM900 HIGH DCS/PCS GSM 900 RX/WCDMA HIGH DCS1800/PCS1900 TX HIGH HIGH DCS1800/PCS1900 HIGH ANT200 DCS 1800 RX HIGH HIGH HIGH PCS 1900 RX HIGH RF200 R221 C279 2.2nH KMS-507...
Without MCJA00 COVER,BATTERY MCJA0017802 Color MHBY00 HANDSTRAP MHBY0001101 Neck Strap 380mm Gray SILVER ABEZ00 BOX ASSY ABEZ0055001 BOX ASSY(for U8210 TLF w_DK TDR) SNOW Without APLY00 PALLET ASSY APLY0001204 PALLET ASSY(for TDR_2_Body_GSM) Color Without MBEC00 BOX,CARTON MBEC0000209 1136*716*935(TDR2-1200*800) Color Without...
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10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark MHFD00 HINGE,FOLDER MHFD0008801 MMAA00 MAGNET,SWITCH MMAA0001601 7100 magnetic Silver Without MPBG00 PAD,LCD MPBG0031601 Color Without MPBM00 PAD,RECEIVER MPBM0008901 Color Without MTAA00 TAPE,DECO MTAA0074101 Color Without MTAD00 TAPE,WINDOW MTAD0034401...
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10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark Without MSGY00 STOPPER MSGY0010601 Color Without ACGN00 COVER ASSY,CAMERA ACGN0003301 Color COVER ASSY, Without ACGP00 ACGP0002101 CAMERA(FRONT) Color ATBZ00 TERMINAL ASSY ATBZ0000801 Without MCJP00 COVER,CAMERA(FRONT) MCJP0003501 Color Without...
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10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark Without MCCH03 CAP,SCREW MCCH0048301 Color Without MCCZ00 MCCZ0011501 Color Without MDAG00 DECO,FRONT MDAG0010801 Color Without MGAD01 GASKET,SHIELD FORM MGAD0081501 Color Without MIDA00 INSULATOR,LCD MIDA0015301 Color MIDZ00 INSULATOR MIDZ0051201...
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10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark GMEY00 SCREW MACHINE,BIND GMEY0005901 1.4 mm,3.5 mm,MSWR3(BK) ,B ,+ ,HEAD D=2.7MM Without MCCC00 CAP,EARPHONE JACK MCCC0023201 Color Without MCCF00 CAP,MOBILE SWITCH MCCF0023601 Color Without MCCH00 CAP,SCREW MCCH0048401 Color...
10. EXPLODED VIEW & REPLACEMENT PART LIST 10.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC <Main component> Location Level Description Part Number Specification Color Remark SVCY02 CAMERA SVCY0005701 CMOS ,MEGA ,1.3M Omnivision Sensor CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP...
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10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark RES,ARRAY,R ERNR0000403 10000 ohm, ohm,8 PIN,J ,1/32 W ,SMD ,R/TP VA10 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 VA14 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005...
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10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark SAFF00 PCB ASSY,MAIN,SMT SAFF0053104 PCB ASSY,MAIN,SMT SAFC00 SAFC0056301 BOTTOM ANT400 ANTENNA,MOBILE,FIXED SNMF0015901 2.1 ,-3.2 dB,Chip_Bluetooth_Ceramic(9*2.5*2) C102 CAP,CERAMIC,CHIP ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP C115 CAP,CERAMIC,CHIP ECCH0000179...
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10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C300 CAP,CERAMIC,CHIP ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP C301 CAP,CERAMIC,CHIP ECCH0000142 820 pF,50V,K,X7R,HD,1005,R/TP C302 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C303 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C304 CAP,CERAMIC,CHIP ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP C305 CAP,CERAMIC,CHIP ECCH0000155...
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10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C411 CAP,CERAMIC,CHIP ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C412 CAP,CERAMIC,CHIP ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C413 CAP,CERAMIC,CHIP ECCH0005801 2.2 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP C414 CAP,CERAMIC,CHIP ECCH0000155...
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10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C535 CAP,CERAMIC,CHIP ECCH0005801 2.2 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP C536 CAP,CERAMIC,CHIP ECCH0005801 2.2 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP C537 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP C538 CAP,CERAMIC,CHIP ECCH0006201...