Sony CFD-S22L Service Manual page 22

CFD-S22L/S32L
Q Q
3 7 6 3 1 5 1 5 0
6-7. PRINTED WIRING BOARD — CD SECTION — • Refer to page 18 for Circuit Boards Location.
1 2 3
A
B
C
D
TP
(RF)
E
T E
L 1 3 9 4 2 2 9 6 5 1 3
F
G
H
I
w w w
J
04
4 5 6
x a o
y
. i
– 27 –
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8
7 8 9
• Semiconductor
Location
Ref. No.
IC701
IC702
IC703
Q701
Q702
C763
C764
C766 C773
(Page 33)
Q Q
3 7 6 3
u 1 6 3
.
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2 4
9 9 8
10
Location
H-7
E-5
B-5
F-8
J-7
1 5 1 5 0 8 9 2 4
m
c o
Note on Printed Wiring Boards:
• X : parts extracted from the component side.
• b : Pattern from the side which enables seeing.
– 28 –
2
9 9
• Waveforms (MODE: PLAY)
100mV/div 20nsec/div
1
2.2Vp-p
16.9344MHz
IC702 yj (XTAO)
2 100mV/div 2µsec/div
2Vp-p
7.6µsec
IC702 wh (MDP)
3 50mV/div 500nsec/div
1.2±0.3Vp-p
IC701 qg (RFO)
4 100mV/div 1µsec/div
2.5V
Approx. 200mVp-p
IC701 qd (FE)
100mV/div 1µsec/div
5
2.5V
9 8 2 9 9
Approx. 100mVp-p
IC701 qa (TE)