Diagrams - Sony D-NE320SP Service Manual

D-NE320SP/NE329LIV/NE329SP
Ver. 1.3
QQ
3 7 63 1515 0
• Note for Printed Wiring Boards and Schematic Diagrams
Note on Printed Wiring Board:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
•
z : Through hole.
•
: internal component.
f
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from
(Conductor Side) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Component Side) the parts face are indicated.
Caution:
Pattern face side: Parts on the pattern face side seen from
(Side B) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Side A) the parts face are indicated.
• EGL board is multi-layer printed board.
However, the patterns of intermediate-layer have not been in-
cluded in diagram.
• Lead Layouts
Lead layout of conventional IC
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SECTION 4

DIAGRAMS

surface
CSP (chip size package)
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Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and
1
/
4
specified.
•
: internal component.
f
• C : panel designation.
Note: Note:
The components identi- Les composants identifiés par
fied by mark 0 or dotted une marque 0 sont critiques
line with mark 0 are criti-
pour la sécurité.
cal for safety. Ne les remplacer que par une
Replace only with part pièce por tant le numéro
number specified.
spécifié.
• A : B+ Line.
• Power voltage is dc 1.5 V and fed with regulated dc power
supply from battery teminal.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : CD PLAY
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
J
: CD PLAY
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
Q Q
3 6 7 1 3 1 5
form that of conventional IC.
• Abbreviation
E18 : Asian area in E model
EE : East European and Russian model
JE : Tourist model
co
.
9 4 2 8
W or less unless otherwise
0 5 8 2 9 9 4 2 8
m
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