Block Diagram -Display Section - Sony CDX-MP40 Service Manual

3-5. BLOCK DIAGRAM — DISPLAY SECTION —
AEP,UK :S902,903,931,LSW901(1/2),904(1/2)-910(1/2)
US,CND:S901,903,931,LSW901(1/2)-907(1/2)
FUNCTION SWITCH
AEP,UK :S911,LSW912(1/2)-922(1/2)
US,CND:S902,LSW908(1/2)-917(1/2)
FUNCTION SWITCH
D809
Q803
KEY
DETECT
D807
CNP801
(REMOTE IN)
IC951(US,Canadian MODEL)
IC971(AEP,UK MODEL)
REMOTE
CONTROL 2
RECEIVER
S802
(NOSE DET)
X802
32.768kHz
IC901
LCD DRIVER
(US,Canadian MODEL)
IC801 (2/2)
(AEP,UK MODEL)
SYSTEM CONTROL
5 KEY IN0
1
S1
I
I
64
LCDSO 18 78 DATA S64
LCD901
LCDCKO 20 77 CLK
LIQUID
LCDCE CE
19 76
CRYSTAL
4 KEY IN1
DISPLAY
65
COM1
| |
COM4 68
26 KEY ACK
91 XKEYON DOOR
75
IND
LED930,931
DOOR IND
BATT
SW
Q923,924
98 RC IN1
6 RC IN0
ILL B+
Q919
ILLON ILL ON
92
SWITCH
AEP,UK :LED933,934
US,CND:LED910,911
Q918
( LCD BACK
BATT ILL B+
LIGHT
SWITCH
29 SIRCS
AEP,UK :LED903,911,951-954,LSW901(2/2),
904(2/2)-910(2/2),912(2/2)-922(2/2)
US,CND:LED901-906,LSW901(2/2)-917(2/2)
34 NOSE SW
(
ILLUMINATION
OSC OUT 12
15 XIN X801
18.432MHz
OSC IN
13
16 XOUT
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is
printed in each block.)
for schematic diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and 1
specified.
• % : indicates tolerance.
• : internal component.
f
• C : panel designation.
Note:
The components identi-
fied by mark 0 or dotted
line with mark 0 are criti-
cal for safety.
Replace only with part
number specified.
• A : B+ Line.
• Power voltage is dc 14.4V and fed with regulated dc power
supply from ACC and BATT cords.
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
)
• Signal path.
F : FM
f : AM/MW/LW
J : CD
c : CD-R/RW (MP3)
KEY
)
for printed wiring boards:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
• : parts mounted on the conductor side.
x
• : Through hole.
a
• : Pattern from the side which enables seeing.
(The other layer's patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from the
(Side B) pattern face are indicated.
Parts face side: Parts on the parts face side seen from the
(Side A) parts face are indicated.
23 23
• Waveforms
— SERVO Board —
(MODE: CD PLAY)
1
1V/DIV,20ns/DIV
/ W or less unless otherwise
4
59 ns
IC1 wd (XTAL)
2
500mV/DIV,1µs/DIV
Note:
Les composants identifiés par
une marque 0 sont critiques
pour la sécurité.
Ne les remplacer que par une
piéce portant le numéro
spécifié.
IC1 uj (RFO)
3
100mV/DIV,20µs/DIV
Approx. 200m Vp-p
IC1 oa (FEO)
4
100mV/DIV,20µs/DIV
Approx. 300m Vp-p
IC1 od (TEO)
5
1V/DIV,40ns/DIV
82 ns
IC3 yd (XTAL)
CDX-MP40
MAIN Board
— —
6 2V/DIV,100ns/DIV
2.8 Vp-p
5.5 Vp-p
230 ns
IC601 4 (OSCD)
7
2V/DIV,40ns/DIV
1.7 Vp-p 3.2 Vp-p
54 ns
IC801 qs (OSCOUT)
8
2V/DIV,20µs/DIV
3.8 Vp-p
30.5 µ s
IC801 qh (XOUT)
1.2 Vp-p