Speciications - ASROCK X99 Extreme6 User Manual

1.2 Speciications

Platform
CPU
Chipset
Memory
Expansion
Slot
2
• A TX Form Factor
• 2 oz Copper PCB
• H igh Density Glass Fabric PCB
• M ultiple Filter Cap (MFC) (Filter diferent noise by 3
diferent capacitors: DIP solid cap, POSCAP and MLCC)
TM
• S upports Intel® Core
Family for the LGA 2011-3 Socket
• D igi Power design
• 1 2 Power Phase design
• S upports Intel® Turbo Boost 2.0 Technology
• S upports Untied Overclocking Technology
• I ntel® X99
• Q uad Channel DDR4 Memory Technology
• 8 x DDR4 DIMM Slots
• S upports DDR4 3000+(OC)*/2933+(OC)/2800(OC)/2400
(OC)/2133/1866/ 1600/1333/1066 non-ECC, un-bufered
memory
* Please refer to Memory Support List on ASRock's website for
more information. (http://www.asrock.com/)
• S upports non-ECC RDIMM (Registered DIMM)
• S upports DDR4 ECC, un-bufered memory/RDIMM with
Intel® Xeon® processors E5 series in the LGA 2011-3 Socket
• M ax. capacity of system memory: 128GB (see CAUTION)
• S upports Intel® Extreme Memory Proile (XMP) 2.0
• 3 x PCI Express 3.0 x16 Slots (PCIE1 @ x16 mode; PCIE3 @
x16 mode; PCIE5 @ x8 mode)
* If you install CPU with 28 lanes, PCIE1/PCIE3/PCIE5 will run
at x16/x8/x4.
* If M.2 PCI Express module is installed, PCIE5 will be disabled.
• 2 x PCI Express 2.0 x1 Slots
• 1 x mini-PCI Express Slot: For WiFi + BT module (for X99
Extreme6/ac)
i7 and Xeon® 18-Core Processors