JVC GZ-MG150US Schematic Diagrams page 19

CCD,OPE,MONITOR AND BATT TERMINAL CIRCUIT BOARDS
Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade)
<02>CCD
LYB10092-001A
COMPONENT SIDE(A)
<04>OPE
LYB10089-001A
COMPONENT SIDE(A)
FOIL SIDE(B)
22
1
C5004
C5002
C5001
Q5002 Q5001
R5007 C5006
R5006
CN402
FOIL SIDE(B)
S402
(No.YF181)2-35
<05>MONITOR
LYB10089-001A
COMPONENT SIDE(A)
S7501
3 1 2
IC7601 IC7602
2 1 3 C7624
TL7607
C7625 TL7608
TL7609
C7626
C7627
TL7602
TL7604
TL7601
TL7606
TL7605
R7605
Q7601
R7606
<06>BATT TERMINAL
LYB10089-001A
COMPONENT SIDE(A)
BT651
2-36(No.YF181)
FOIL SIDE(B)
C7602
5 4
C7601 L7602
C7615 IC7603
L7603
C7614
1 3
R7611 R7608
R7603 C7623
C7616 R7613 R7610
R7602 R7612 R7609
TL7603
CN7602
FOIL SIDE(B)
D651
1
CN651
6