Samsung LA37C630 Series Service Manual page 23

Level Location No.
....4 AD480 2203-007176
....4 AD480 2203-007233
....4 AD480 2203-007270
....4 T0052 2703-000125
....4 T0052 2703-000158
....4 VL6 2703-000398
....4 T0052 2703-001239
....4 T0052 2703-002332
....4 T0052 2703-002557
....4 T0052 2703-003150
....4 2703-003296
....4 T0052 2703-003362
....4 T0052 2703-003713
....4 X202 2801-003326
....4 X202 2801-003773
....4 X202 2801-003954
....4 X202 2801-004629
....4 X202 2801-004734
....4 2804-001878
....4 F103 2901-001506
....4 DR32 3301-000314
....4 T0568 3301-001236
....4 T0568 3301-001404
....4 T0568 3301-001526
....4 T0568 3301-002039
....4 T0313 3404-001207
....4 3701-001591
....4 AC510 3708-002777
....4 CON_US 3711-005616
....4 HB01A 3711-007336
....4 BN41-01437A
....4 0202-001767
....4 1001-000164
....4 IC012 1203-006138
....4 2007-000946
....4 2007-001335
....4 T0052 2703-003790
....4 3701-001693
....4 AD480 2203-005393
....4 BN97-04394A
.....5 IC520 0903-001651
....4 BN97-04396A
.....5 1107-001868
...3 ET01 BN40-00183A
...3 JA333 3722-003040
...3 0202-001608
...3 CN906 3707-001096
...3 3722-003037
...3 JA330 3722-003038
...3 3722-003051
...3 3722-003058
Code No.
C-CER,CHIP;10000nF,10%,16V,X5R,TP,2012 (
C-CER,CHIP;22000nF,10%,16V,X5R,TP,3216
C-CER,CHIP;10000nF,10%,10V,X5R,TP,1608
INDUCTOR-SMD;10uH,10%,2012
INDUCTOR-SMD;1uH,10%,2012
INDUCTOR-SMD;10uH,10%,3225
INDUCTOR-SMD;3.3uH,10%,1608
INDUCTOR-SMD;330nH,5%,1608
INDUCTOR-SMD;270NH,5%,1608
INDUCTOR-SMD;4.7uH,20%,5050
INDUCTOR-SMD;47uH,10%,2012
INDUCTOR-SMD;4.7uH,20%,7070
INDUCTOR-SMD;1.5uH,20%,7366
CRYSTAL-SMD;24MHz,30ppm,28-ABX,20pF,50oh
CRYSTAL-SMD;12MHz,30ppm,28-AAN,20pF,50oh
CRYSTAL-SMD;27MHz,30ppm,28-AAN,16pF,50oh
CRYSTAL-SMD;27MHz,20ppm,12pF,50ohm,TP
CRYSTAL-SMD;25.000000MHz,20ppm,28-AAN,12
OSCILLATOR-CLOCK;49.152MHz,50ppm,10TTL/1
FILTER-EMI SMD;5V,0.13A,0pF,2x1x0.5mm,TP
BEAD-SMD;120ohm,1.6x0.8x0.8mm,-,-,-
BEAD-SMD;30ohm,2012,TP,15.9OHM/30MHz
BEAD-SMD;10ohm,1.6x0.8x0.8mm,1000mA,TP,,
SWITCH-TACT;12V,50mA,160gf,6.2X6.2,SPST
CONNECTOR-HDMI;19P,2ROW,FEMALE,SMD-S,AU
CONNECTOR-FPC/FFC/PIC;82P,0.5mm/0.75mm,S
HEADER-BOARD TO CABLE;BOX,10P,1R,2mm,SMD
HEADER-BOARD TO CABLE;B0X,4P,1R,2.5mm,SM
PCB MAIN;C650 CN,FR-4,4,1.2T,213*270,1
SOLDER-CREAM;LST-5710,D20~38,Sn-57Bi-1Ag
IC-ANALOG MULTIPLEX;74HC4052,CMOS,SOP,16
IC-POSI.ADJUST REG.;AP1117DGZ-13-89,TO-2
R-CHIP;47ohm,1%,1/10W,TP,1608
R-CHIP;36Kohm,5%,1/16W,TP,1005
INDUCTOR-SMD;4.7uH,20%,8080
CONNECTOR-HDMI;19P,2ROW,FEMALE,SMD-A
C-CER,CHIP;0.005nF,0.1pF,50V,NP0,TP,1005
ASSY MICOM;T-VALDEUS-3000,N84A,Sub LC650
IC-MICROCONTROLLER;61P802-RG480WT,LQFP,4
ASSY MICOM;T-VALDCNC-0024,N84A,LC650 CN,
IC-NAND FLASH;KFG8GH6U4M-AIB6,1GByte,512
TUNER;DNCS443VL161A(S),DTMB/PAL/NTSC,75o
JACK-PIN;3P W/L,SN,BLK/YEL/WHT/RED,ANGLE
SOLDER-WIRE FLUX;LFC7-107,D0.8,99.3Sn/0.
CONNECTOR-OPTICAL;STRAIGHT W/L,SPDIF
JACK-USB;4P/1C W/L,AU/NI,BLK,ANGLE,A
JACK-PHONE;7P/1C W/L,SN,BLK
JACK-PIN;3P W/L,NI/SN,YEL/WHT/RED,STRAIG
JACK-MODULAR;8P/8C W/L,Y,STRAIGHT,N,AU,1
Description & Specification
BEAD-SMD;60ohm,1608
BEAD-SMD;26ohm,1608,TP
5. Exploded View & Part List
Q'ty SA/SNA Remark
2 SNA
5 SA
61 SNA
8 SA
9 SA
1 SA
3 SA
1 SA
1 SNA
4 SNA
1 SNA
1 SA
1 SA
2 SA
1 SA
1 SA
1 SNA
1 SA
1 SA
2 SA
2 SNA
12 SNA
41 SA
20 SNA
9 SA
1 SA
3 SNA
1 SA
1 SNA
1 SA
1 SNA
7.5 SNA
1 SA
1 SA
4 SA
4 SA
3 SA
1 SA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SA
1 SA
1 SNA
1 SA
2 SA
2 SA
1 SA
1 SA
5-7