Sony MZ-R501 Service Manual page 33

Common note on Printed Wiring Board:
• Y : parts extracted from the conductor side.
• : Pattern from the side which enables seeing.
(The other layer's patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from the
(Side B) pattern face are indicated.
Parts face side: Parts on the parts face side seen from the
(Side A) parts face are indicated.
• Main board is four-layer printed board.
However, the patterns of layers 2 and 3 have not been in-
cluded in this diagrams.
Replacement of IC801 on main board
*
requires a special tool.
• Lead Layouts
surface
Lead layout of conventional IC CSP (chip size package)
Common note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and 1 / W or less unless otherwise
4
specified.
• % : indicates tolerance.
• C : panel designation.
Note: Note:
The components identi- Les composants identifiés par
une marque 0 sont critiques
fied by mark 0 or dotted
line with mark 0 are criti- pour la sécurité.
cal for safety. Ne les remplacer que par une
Replace only with part piéce por tant le numéro
number specified. spécifié.
• A : B+ Line.
• Total current is measured with Minidisc installed.
• Power voltage is dc 3V and fed with regulated dc power
supply from external power voltage jack.
• Voltage and waveforms are dc with respect to ground
under no-signal conditions.
no mark : PB
( ) : REC
∗ : Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
E
: PB
k : REC (ANALOG)
l : REC (DIGITAL)
• Abbreviation
CND : Canadian model
33 33
MZ-R501/R501PC
Ver 1.1
• Waveforms
1 100mV/DIV, 1µs/DIV
Approx.
220mVp-p
IC501 8 (IY) (PB mode)
2 100V/DIV, 1µs/DIV
Approx.
220mVp-p
IC501 9 (IX) (PB mode)
3 100mV/DIV, 1µs/DIV
Approx.
220mVp-p
IC501 q; (JX) (PB mode)
4 100mV/DIV, 1µs/DIV
Approx.
220mVp-p
IC501 qa (JY) (PB mode)
5 20mV/DIV, 500ns/DIV
Approx.
35mVp-p
IC501 1 (TE) (PB mode)
6 500mV/DIV, 500ns/DIV
Approx.
1.3Vp-p
ed
IC501 (RF OUT) (PB mode)
7 10mV/DIV, 500ns/DIV
Approx.
20mVp-p
rs
IC501 (FE) (PB mode)
1V/DIV, 2µs/DIV
8
2.4Vp-p
5.8µs
IC601 4 (CLK)
1V/DIV, 2µs/DIV
9
2.4Vp-p
5.8µs
IC901 th (CLK)