Advertisement
3. Basic
9. COF (Chip On Film)
: supply a waveform which made from X B/D to panel and select
a output pin that is controlled by COF when be on or off.
96 output pin per IC.
the more the resolution higher, the less spare space where
can set IC on it in B/D. without using IC PACKAGE,
we can use a BARE IC , so we can get IC with LOW COST
because we do not solder IC on PCB directly,
a soldering defect rate decrease.
* composition
1) FPC + Heat /Sink
⇒ FPC for COF must have a Low Spec decline with getting damp
2) CHIP resistor + CHIP CAPACITOR
3) BARE IC (STV7610A/WAF) + GOLD WIRE/AL WIRE
4) EPOXY MOLDING
Bare IC
* 42 V6 COF is the same as 42V5.
Advertisement
