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AND DURING SERVICING TO AVOID EXPOSURE
TO EXCESSIVE MICROWAVE ENERGY
CHAPTER 1. WARNING TO SERVICE PERSON-
NEL
[1]
Before Servicing..................................... . .... 1-1
[2]
When the testing is completed,.............. . .... 1-1
[3]
After repairing......................................... . .... 1-1
[1]
Requirements:........................................ . .... 2-1
[2]
Preparation for testing:........................... . .... 2-1
[3]
Leakage test: ......................................... . .... 2-1
[1]
FOREWORD.......................................... . .... 3-1
[2]
WARNING.............................................. . .... 3-1
[3]
DANGER................................................ . .... 3-1
[1]
SPECIFICATIONS ................................. . .... 4-1
[1]
GROUNDING INSTRUCTIONS............. . .... 5-1
[2]
OVEN DIAGRAM ................................... . .... 5-1
[1]
QUENCE ............................................... . .... 6-1
[2]
OVEN SCHENATIC ............................... . .... 6-2
[3]
COMPONENTS ..................................... . .... 6-3
[1]
TROUBLESHOOTING CHART ............ . .... 7-1
[1]
A : MAGNETRON ASSEMBLY TEST .... . .... 8-1
[2]
B : POWER TRANSFORMER TEST ..... . .... 8-1
[3]
C : HIGH VOLTAGE RECTIFIER TEST. . .... 8-1
[4]
D : HIGH VOLTAGE CAPACITOR TEST ..... 8-2
[5]
E : THERMAL CUT-OUT (OVEN ) TEST ..... 8-2
[6]
TEST...................................................... . .... 8-2
[7]
TEST...................................................... . .... 8-2
[8]
TEST...................................................... . .... 8-3
[9]
G : MONITOR SWITCH TEST ............... . .... 8-3
[10] H : BLOWN MINITOR FUSE TEST ....... . .... 8-4
[11] I : NOISE FILTER TEST ....................... . .... 8-4
BLY TEST .............................................. . .... 8-4
CONTENTS
[13] K : KEY UNIT TEST............................... . .... 8-5
[14] L : RELAY TEST .................................... . .... 8-6
[15] M : DEFROST TEST.............................. . .... 8-6
WIRING BOARD TEST.......................... . .... 8-6
BLY
[1]
EL .......................................................... . .... 9-1
[2]
DESCRIPTION OF LSI .......................... . .... 9-1
[3]
PANEL ................................................... . .... 9-3
[1]
Employing lead-free solder .................... . .. 10-1
[2]
Using lead-free wire solder .................... . .. 10-1
[3]
Soldering................................................ . .. 10-1
AND ADJUSTMENT PROCEDURE
[1]
WARNING.............................................. . ...11-1
[2]
OUTER CASE REMOVAL ..................... . ...11-2
[3]
MAGNETRON REMOVAL ..................... . ...11-2
[4]
SEMBLY) ............................................... . ...11-2
[5]
POWER TRANSFORMER REMOVAL .. . ...11-2
[6]
CASE TYPE) REMOVAL ....................... . ...11-3
[7]
MOVAL................................................... . ...11-3
[8]
SWITCH REPLACEMENT ..................... . ...11-3
[9]
MENT..................................................... . ...11-4
[10] TURNTABLE MOTOR REMOVAL ......... . ...11-4
[11] COOLING FAN MOTOR REMOVAL...... . ...11-4
TOR SWITCH REMOVAL ...................... . ...11-5
TOR SWITCH ADJUSTMENT ............... . ...11-5
[14] DOOR REPLACEMENT ........................ . ...11-6
[1]
Pictorial Diagram (Figure S-1) ............... . .. 12-1
[2]
Control Panel Circuit (Figure S-2).......... . .. 12-2
[3]
Printed Wiring Board (Figure S-3).......... . .. 12-3
Parts Guide
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