Fan/Heat-Sink Assembly - AlphaPC 164LX User Manual

Figure 5-1 shows the Fan/Heat-Sink Assembly on AlphaPC 164LX.
Figure 5–1 Fan/Heat-Sink Assembly
Airflow
a. Put the GRAFOIL thermal pad in place. The GRAFOIL pad is used to
improve the thermal conductivity between the chip package and the heat
sink by replacing micro air pockets with a less insulative material. Perform
the following steps to position the GRAFOIL pad:
1. Perform a visual inspection of the package slug to ensure that it is free of
contamination.
2. Wearing clean gloves, pick up the GRAFOIL pad. Do not perform this
with bare hands because skin oils can be transferred to the pad.
Increasing Microprocessor Speed
Screw
Qty 4
Guard, Fan
Fan
Clip, Heat Sink/Chip/Fan
Nut, Hex, 1/4-20, 2011-T3
Aluminum, 0.438 in Across
Flats, Qty 2
Torque to 20 +/- 2 in-lbs
Heat Sink, with Fan
Mounting Holes
Thermal Pad
Alpha 21164
Memory and Microprocessor Configuration
FM-06013.AI4
5–5