Doc. Title
1. INTRODUCTION ......................................................................................................................................................4
1.1
Product overview ...............................................................................................................................................6
2.1
Tools List..........................................................................................................................................................10
2.2
Disassembling procedure ................................................................................................................................11
2.3
Assembling procedure ......................................................................................................................................17
3. ROM RE-FLASH PROCEDURE ............................................................................................................................23
3.1
Internal storage pre-load .................................................................................................................................23
3.2
3.3
4. DIAGNOSTIC PROGRAM .....................................................................................................................................31
4.1
5. POWER MEASUREMENT TEST...........................................................................................................................45
5.1
5.2
Battery rundown test procedure ......................................................................................................................48
6.1
6.2
Display inspection............................................................................................................................................55
6.3
Main unit inspection.........................................................................................................................................55
7. GENERIC TROUBLESHOOTING..........................................................................................................................56
8. GENERIC LABELING PLAN ..................................................................................................................................61
9.1
SPL for Repair .................................................................................................................................................65
9.2
Board Level 2.5 Repairs ..................................................................................................................................70
9.3
10. RF ANTENNA SPECIFICATION ..........................................................................................................................74
HTC CONFIDENTIAL
HTC Corporation
.
QUARTZ Service Manual
Table of Contents
Doc. No.
DOC-00046130
Issued Date
2008/9/1
Revised Date
2008/12/10
Page
3 of 80
REV.
A05