Additional Information - HP xw8400 Quickspecs

QuickSpecs
Technical Specifications

Additional Information

Material Usage
This product is in compliance with the Restrictions of Hazardous Substances (RoHS) directive -
2002/95/EC.
This HP product is designed to comply with the Waste Electrical and Electronic Equipment (WEEE)
Directive - 2002/96/EC.
Plastics parts weighing over 25 grams used in the product are marked per ISO 11469 and ISO1043.
This product contains 0% recycled materials (by wt.)
This product is >90% recycle-able when properly disposed of at end of life.
Packaging Materials
External
Internal
This product does not contain any of the following substances in excess of regulatory limits (refer to the
HP General Specification for the
Environment at
http://www.hp.com/hpinfo/globalcitizenship/environment/supplychain/gen_specifications.html):
Asbestos
Certain Azo Colorants
Certain Brominated Flame Retardants - may not be used as flame retardants in plastics
Cadmium
Chlorinated Hydrocarbons
Chlorinated Paraffins
Formaldehyde
Halogenated Diphenyl Methanes
Lead carbonates and sulfates
Lead and Lead compounds
Mercuric Oxide Batteries
Nickel - finishes must not be used on the external surface designed to be frequently handled or
carried by the user.
Ozone Depleting Substances
Polybrominated Biphenyls (PBBs)
Polybrominated Diphenyl Ethers (PBBEs)
Polybrominated Biphenyl Oxides (PBBOs)
Polychlorinated Biphenyl (PCB)
Polychlorinated Terphenyls (PCT)
Polyvinyl Chloride (PVC) - except for wires and cables, and certain retail packaging has been
voluntarily removed from most applications.
Radioactive Substances
Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)
DA - 12522 North America — Version 28 — February 22, 2008
Cardboard carton and insert
LDPE Foam
HP xw8400 Workstation
2.70 kg
0.35 kg
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