HP dx2200 Specifications page 8

QuickSpecs
System Details
Unit Environment and Unit Environment and Unit Environment and Unit Environment and
Operating Conditions Operating Conditions Operating Conditions Operating Conditions
System Board System Board System Board System Board
General Unit Operating Guidelines General Unit Operating Guidelines General Unit Operating Guidelines General Unit Operating Guidelines
Keep the computer away from excessive moisture, direct moisture and the extremes of heat and
cold, to ensure that unit is operated within the specified operating range.
Leave a 4 in (10.2 cm) clearance on all vented sides of the computer to permit the required
airflow.
Never restrict airflow into the computer by blocking any vents or air intakes.
Do not stack computers on top of each other or place computers so near each other that they are
subject to each other's re-circulated or preheated air.
Occasionally clean the air vents on the front, back, and any other vented side of the computer.
Lint, dust and other foreign matter can block the vents and limit the airflow.
If the computer is to be operated within a separate enclosure, intake and exhaust ventilation must
be provided on the enclosure, and the same operating guidelines listed above will still apply.
Temperature Range Temperature Range Temperature Range Temperature Range
Relative Humidity Relative Humidity Relative Humidity Relative Humidity
Maximum Altitude Maximum Altitude Maximum Altitude Maximum Altitude
(unpressurized)
NOTE: NOTE: Operating temperature is de-rated 1.0 deg C per 1000 ft (300 m) to 10,000 ft (3000 m) above NOTE: NOTE:
sea level, no direct sustained sunlight. Maximum rate of change is 10 deg C/Hr. The upper limit may be
limited by the type and number of options installed.
Processor Processor Processor Processor
PWM PWM PWM PWM
Chipset Chipset Chipset Chipset
Super I/O Super I/O Super I/O Super I/O
Front Side Bus Frequency Front Side Bus Frequency Front Side Bus Frequency Front Side Bus Frequency
Memory Memory Memory Memory
Clock Generator Clock Generator Clock Generator Clock Generator
Integrated Graphics Integrated Graphics Integrated Graphics Integrated Graphics
Audio Audio Audio Audio
LOM LOM LOM LOM
IDE IDE IDE IDE
Serial Serial Serial Serial
Expansion Slots Expansion Slots Expansion Slots Expansion Slots
BIOS BIOS BIOS BIOS
DA - 12426 North America — Version 14 — August 16, 2006
HP Compaq dx2200 Microtower Business PC HP Compaq dx2200 Microtower Business PC HP Compaq dx2200 Microtower Business PC HP Compaq dx2200 Microtower Business PC
Operating: 50° to 95° F (10° to 35° C)
Non-operating: -22° to 140° F( -30° to 60° C)
Operating: 10% to 90% (non-condensing at ambient)
Non-operating: 5% to 95% (non-condensing at ambient)
Operating: 10,000 ft (3048 m)
Non-operating: 30,000 ft (9000 m)
Socket T; LGA775 industry standard Micro ATX form factor
Support single Intel Pentium 4 or Celeron D
Intersil 6566 VRM 10.1
ATI RC410 (Northbridge), ATI SB450 (Southbridge)
W83627EHG
533/800 MHz
DDR2 SDRAM
2 x DIMM slots
NOTE: NOTE: NOTE: NOTE: The HP Compaq dx2200 Microtower memory frequency is clocked
at 630 MHz.
RTM865
Built-in ATI graphics processor derived from the Radeon X300
provided by the ATI Radeon Xpress 200 chipset
Realtek ALC861 HD Audio compatible codec with two channel audio
3D audio compliant with AC'97 rev. 2.3
Realtek 8100c Fast Ethernet 10/100
Support all PIO modes
1 x IDE ports support up to 2 devices
Support Ultra ATA 33/66/100
Two Serial ATA interfaces support data transfer rates up to 1.5 Gb/s
2 x PCI 2.3 slots
1 x PCI Express x1 slot
1 x PCI Express x16 slot
LPC EEPROM
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