C-Ceramic, Chip 0.033 Nf, 5 %, 50 V, Np0,; C-Ceramic, Chip 0.027 Nf, 5 %, 50 V, Np0, - Samsung SGH-Q200 Service Manual

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SGH-Q200 Electrical Parts List
Level
SEC Code
2
2203-000812
C962
2
2404-001088
C963
2
2203-000812
C964
2
2203-000254
C965
2
2404-001105
C966
2
2203-000812
C967
2
2203-000812
C968
2
2203-000812
C969
2
2203-000812
C970
2
2301-001213
C972
2
2301-001419
C973
2
2301-001530
C974
2
2301-001233
C975
2
2203-000679
C976
2
2203-002525
C977
2
2203-000812
C978
2
2203-000438
C979
2
2203-000254
C980
2
2203-000438
C983
2
2203-000438
C984
2
2203-000438
C985
2
2203-000254
C988
2
3705-001239
CN1001
2
3711-004623
CN202
2
3711-004623
CN203
2
3710-001611
CN301
2
3722-001715
CN401
2
3711-004621
CN601
2
3709-001187
CN801
2
0401-001033
D101
2
1405-001082
D202
2
1405-001082
D203
2
1405-001082
D204
2
1405-001018
D302
2
1405-001018
D303
2
0407-000115
D501
2
0407-001002
D502
2
4709-001214
F1001
2
4709-001213
F1002
Design LOC
C-CERAMIC, CHIP 0.033 nF, 5 %, 50 V, NP0, TP, 1005
C-TA, CHIP 2.2 uF, 20 %, 6.3 V, GP, TP, 2012, -
C-CERAMIC, CHIP 0.033 nF, 5 %, 50 V, NP0, TP, 1005
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
C-TA, CHIP 10 UF, 20 %, 6.3 V, GP, TP, 2012
C-CERAMIC, CHIP 0.033 nF, 5 %, 50 V, NP0, TP, 1005
C-CERAMIC, CHIP 0.033 nF, 5 %, 50 V, NP0, TP, 1005
C-CERAMIC, CHIP 0.033 nF, 5 %, 50 V, NP0, TP, 1005
C-CERAMIC, CHIP 0.033 nF, 5 %, 50 V, NP0, TP, 1005
C-FILM, CHIP 6.8 nF, 5 %, 16 V, TP, 2012, -
C-FILM, CHIP 8.2 nF, 5 %, 16 V, TP, 2012, -
C-FILM, CHIP 0.27 NF, 5 %, 50 V, TP, 2012, -
C-FILM, CHIP 2.2 nF, 5 %, 50 V, TP, 2012, -
C-CERAMIC, CHIP 0.027 nF, 5 %, 50 V, NP0, TP, 1005
C-CERAMIC, CHIP 0.56 nF, 10 %, 50 V, X7R, TP, 1005
C-CERAMIC, CHIP 0.033 nF, 5 %, 50 V, NP0, TP, 1005
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
CONNECTOR-COAXIAL -, JAC K, 50 Mohm, 50 ohm, 0.3dB
CONNECTOR-HEADER BOX , 20P, 2R, 0.5 mm, SMD-S, AUF
CONNECTOR-HEADER BOX , 20P, 2R, 0.5 mm, SMD-S, AUF
CONNECTOR-SOCKET 18P, 1R, 0.5 mm, SMD-A, AUF
JACK-PHONE 6P, 2.3PI, AG, BLK, -
CONNECTOR-HEADER BOX , 14P, 2R, 0.5 mm, SMD-S, AUF
CONNECTOR-CARD EDGE 6P, 2.54 MM, SMD-A, -
DIODE-SWITCHING MCL4154, 25 V, 200mA, M-MELF, TP
VARISTOR 5.6 V, 20A, 1 x 0.5 x 0.6 mm, TP
VARISTOR 5.6 V, 20A, 1 x 0.5 x 0.6 mm, TP
VARISTOR 5.6 V, 20A, 1 x 0.5 x 0.6 mm, TP
VARISTOR 14 V, -, 1.6 x 0.8 mm, TP
VARISTOR 14 V, -, 1.6 x 0.8 mm, TP
DIODE-ARRAY DAN202U, 80 V, 100mA, CA2-3, SC-70,
DIODE-ARRAY DAN222, 80 V, 300mA, CA2-3, EM3, TP
COUPLER-DIRECTION 880-915MHz, 19.5+-1dB, 13dB, 2.0 X 1.25 X 0.7 mm, TP
COUPLER-DIRECTION 1710-1785MHz, 14+-1dB, 12dB, 2.0 X 1.25 X 0.7 mm, TP
SAMSUNG Proprietary-Contents may change without notice
DESCRIPTIONS
1-8

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