C-Ceramic, Chip 0.002 Nf, 0.25 Pf, 50 V, Np0,; C-Ceramic, Chip 0.082 Nf, 5 %, 50 V, Np0,; C-Ceramic, Chip 680 Pf, 10 %, 50 V, X7R,; C-Ceramic, Chip 10 Nf, 10 %, 16 V, X7R, - Samsung SGH-Q200 Service Manual

Level SEC Code
2 GH75-01103A
3 GH70-00038A
3 GH71-00475A
3 GH72-02485A
3 GH72-02486A
3 GH73-00702A
3 GH74-02044A
3 GH74-02067A
3 GH74-02068A
1 GH99-02458A
2 GG68-10705A
2 GH68-00518B
2 GH68-01778A
2 GH68-02107A
2 GH68-02190A
2 GH69-00842A
2 GH69-00963A
2 GH69-00966A
2 GH69-01066A
2 3002-001121 AU501
2 2404-001239 C1001
2 2404-001239 C1002
2 2404-001239 C1003
2 2203-001239 C1005
2 2203-000696 C1006
2 2203-000254 C1008
2 2203-000254 C1009
2 2203-005571 C101
2 2203-005050 C1010
2 2203-000995 C1011
2 2203-000233 C1012
2 2203-000812 C1013
2 2203-001072 C1014
2 2203-001239 C1015
2 2203-000696 C1016
2 2203-001124 C1017
2 2203-000254 C1019
2 2203-005065 C102
2 2203-000696 C1020
SAMSUNG Proprietary-Contents may change without notice
Design LOC
MEC-REAR COVER SGH-Q200, -, -, -, W/SIL, -, -
IPR-SPRING LOCKER SPH-A1004, STS304, -, PI2.4 X 6, -, -, -, -, -
NPR-ANT BUSHING SGH-Q200, ZN GOLD PLT, -, AU, -
PMO-REAR COVER SGH-Q200, -, PC, W/SIL, -, -, -
PMO-BATT LOCKER SGH-Q200, -, PC, W/SIL, -, -, -
RMO-EAR JACK COVER SGH-Q200, RUBBER, -, W/SIL, -, -
MPR-BUZZER SGH-Q200, HIMERON, 6.8 X 4 X T0.4, -, -, -, -, -
MPR-REAR SPONGE SGH-Q200, SPONGE, 10 X 9.1 X T2, BLK, -, -, -, -
MPR-REAR SHIELD SPONGE SGH-Q200, SHIELD SPONGE, 5.5 X 10 X T2, SIL,
PAA MAIN-GERM SGH-Q200, DTM, GERM, -, -, -
LABEL(P)-SEAL SP-R912, CRP, 65.0 x 95.0, -, ORG
LABEL(P)-SEAL SGH-A100, ART, 100G, 46, 34, -, WHT, -, -, -
LABEL(P)-BARCODE SHIPPING SGH-A100, ART, 100G, 250, 100, -, WHT, -, -, -
LABEL(R)-MAIN SGH-Q200, MAT, T0.05, 41, 33, -, SIL, -, -, -
LABEL(P)-IMEI BARCODE(GERM) SGH-Q100, ART, 100G, 100, 90, -, WHT, -, -, -
BAG-VINYL HANDSET SGH-A300, LDPE, T0.06, 80, 170, TRP, -
BOX (P)-UNIT MAIN STND SGH-Q200, SC300+E(KOL), -, -, -, -, -, 210 X 160 X 97
CUSHION-CASE SGH-Q200, PULP, T1.3, -, -, -, -, -, 193 X 155 X 71
BOX (P)-MASTER MAIN SGH-Q200, SW5, -, -, -, -, -, 505 X 329 X 206
BUZZER-MAGNETIC 88DB, 3.6 V, 120MA, 2700HZ, TP
C-TA, CHIP 100 UF, 20 %, 6.3 V, WT, TP, 3.3 X 2.7 X 1.7 MM
C-TA, CHIP 100 UF, 20 %, 6.3 V, WT, TP, 3.3 X 2.7 X 1.7 MM
C-TA, CHIP 100 UF, 20 %, 6.3 V, WT, TP, 3.3 X 2.7 X 1.7 MM
C-CERAMIC, CHIP 0.082 nF, 5 %, 50 V, NP0, TP, 1005
C-CERAMIC, CHIP 0.002 nF, 0.25 pF, 50 V, NP0, TP, 1005
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
C-CERAMIC, CHIP 10000 NF, +80-20 %, 6.3 V, Y5 V, TP, 2012
C-CERAMIC, CHIP 0.0018 nF, 0.25 pF, 50 V, NP0, TP, 1005
C-CERAMIC, CHIP 0.047 nF, 5 %, 50 V, NP0, TP, 1005
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
C-CERAMIC, CHIP 0.033 nF, 5 %, 50 V, NP0, TP, 1005
C-CERAMIC, CHIP 0.056 nF, 5 %, 50 V, NP0, TP, 1005
C-CERAMIC, CHIP 0.082 nF, 5 %, 50 V, NP0, TP, 1005
C-CERAMIC, CHIP 0.002 nF, 0.25 pF, 50 V, NP0, TP, 1005
C-CERAMIC, CHIP 680 pF, 10 %, 50 V, X7R, TP, 1005, -
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
C-CERAMIC, CHIP 1000 nF, +80-20 %, 10 V, Y5 V, TP, 1608
C-CERAMIC, CHIP 0.002 nF, 0.25 pF, 50 V, NP0, TP, 1005
DESCRIPTIONS
1-3
SGH-Q200 Electrical Parts List