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Fairchild PowerTrench MOSFET FDD6690A Specification Sheet

30v n-channel

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FDD6690A
30V N-Channel PowerTrench MOSFET
General Description
This N-Channel MOSFET is produced using Fairchild
Semiconductor's advanced PowerTrench process that
has been especially tailored to minimize the on state
resistance and yet maintain low gate charge for
superior switching performance.
Applications
DC/DC converter
Motor Drives
G
S

Absolute Maximum Ratings

Symbol
V
Drain-Source Voltage
DSS
V
Gate-Source Voltage
GSS
I
Continuous Drain Current @T
D
P
Power Dissipation
D
T
, T
Operating and Storage Junction Temperature Range
J
STG

Thermal Characteristics

R
Thermal Resistance, Junction-to-Case
JC
Thermal Resistance, Junction-to-Ambient
R
JA
R
JA
Package Marking and Ordering Information
Device Marking
FDD6690A
2003 Fairchild Semiconductor Corp.
D
D-PAK
TO-252
(TO-252)
o
T
=25
C unless otherwise noted
A
Parameter
=25°C
C
@T
=25°C
A
Pulsed
@T
=25°C
C
@T
=25°C
A
@T
=25°C
A
Device
Package
FDD6690A
D-PAK (TO-252)
Features
46 A, 30 V
R
DS(ON)
R
DS(ON)
Low gate charge
Fast Switching Speed
High performance trench technology for extremely
low R
DS(ON)
G
Ratings
(Note 3)
(Note 1a)
100
(Note 1a)
(Note 3)
(Note 1a)
(Note 1b)
–55 to +175
(Note 1)
(Note 1a)
(Note 1b)
Reel Size
13''
July 2003
= 12 m
@ V
= 10 V
GS
= 14 m
@ V
= 4.5 V
GS
D
S
Units
30
V
20
V
46
A
12
W
56
3.3
1.5
C
2.7
C/W
45
96
Tape width
Quantity
12mm
2500 units
FDD6690A Rev EW)

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Summary of Contents for Fairchild PowerTrench MOSFET FDD6690A

  • Page 1: Absolute Maximum Ratings

    FDD6690A 30V N-Channel PowerTrench MOSFET General Description This N-Channel MOSFET is produced using Fairchild Semiconductor’s advanced PowerTrench process that has been especially tailored to minimize the on state resistance and yet maintain low gate charge for superior switching performance. Applications...
  • Page 2: Electrical Characteristics

    Electrical Characteristics Symbol Parameter Drain-Source Avalanche Ratings Drain-Source Avalanche Energy Drain-Source Avalanche Current Off Characteristics Drain–Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate–Body Leakage On Characteristics (Note 2) Gate Threshold Voltage GS(th) Gate Threshold Voltage GS(th) Temperature Coefficient Static Drain–Source...
  • Page 3 Electrical Characteristics Symbol Parameter Drain–Source Diode Characteristics and Maximum Ratings Maximum Continuous Drain–Source Diode Forward Current Drain–Source Diode Forward Voltage V Diode Reverse Recovery Time Diode Reverse Recovery Charge Notes: 1. R is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins.
  • Page 4: Typical Characteristics

    Typical Characteristics = 10.0V 4.5V 6.0V 5.0V , DRAIN-SOURCE VOLTAGE (V) Figure 1. On-Region Characteristics = 12A = 10V , JUNCTION TEMPERATURE ( Figure 3. On-Resistance Variation withTemperature = 5V , GATE TO SOURCE VOLTAGE (V) Figure 5. Transfer Characteristics 4.0V 3.5V 3.0V...
  • Page 5 Typical Characteristics = 12 A , GATE CHARGE (nC) Figure 7. Gate Charge Characteristics 1000 LIMIT DS(ON) 100ms = 4.5V SINGLE PULSE = 96 = 25 0.01 , DRAIN-SOURCE VOLTAGE (V) Figure 9. Maximum Safe Operating Area D = 0.5 0.05 0.02 0.01...
  • Page 6 TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx™ FACT Quiet Series™ ActiveArray™ FAST Bottomless™ FASTr™ CoolFET™ FRFET™ CROSSVOLT™...

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