Specifications - ASROCK B75M-DGS User Manual

1.2 Specifications

Platform
CPU
Chipset
Memory
Expansion Slot
Graphics
- Micro ATX Form Factor: 8.9-in x 7.2-in, 22.6 cm x 18.3 cm
- All Solid Capacitor design
rd
- Supports 3 and 2
LGA1155 Package
- 3 + 1 Power Phase Design
®
- Supports Intel Turbo Boost 2.0 Technology
- Supports Hyper-Threading Technology (see CAUTION 1)
®
- Intel B75
®
- Supports Intel Small Business Advantage (see CAUTION 2)
®
- Supports Intel Rapid Start Technology and Smart Connect
Technology
- Dual Channel DDR3 Memory Technology (see CAUTION 3)
- 2 x DDR3 DIMM slots
- Supports DDR3 1600/1333/1066 non-ECC, un-buffered
memory (DDR3 1600 with Intel
®
1333 with Intel Sandy Bridge CPU)
- Max. capacity of system memory: 16GB (see CAUTION 4)
®
- Supports Intel Extreme Memory Profile (XMP)1.3/1.2
- 1 x PCI Express 3.0 x16 slot (PCIE1: x16 mode)
(see CAUTION 5)
* PCIE 3.0 is only supported with Intel
®
Intel Sandy Bridge CPU, it only supports PCIE 2.0.
- 1 x PCI Express 2.0 x1 slot
®
* Intel HD Graphics Built-in Visuals and the VGA outputs can
be supported only with processors which are GPU
integrated.
®
- Supports Intel HD Graphics Built-in Visuals: Intel
Sync Video 2.0, Intel
®
Technology, Intel
- Pixel Shader 5.0, DirectX 11 with Intel
Pixel Shader 4.1, DirectX 10.1 with Intel
- Max. shared memory 1760MB (see CAUTION 6)
- Dual VGA Output: support DVI and D-Sub ports by
independent display controllers
- Supports DVI with max. resolution up to 1920x1200 @ 60Hz
- Supports D-Sub with max. resolution up to 2048x1536 @
75Hz
- Supports HDCP function with DVI port
6
nd ®
Generation Intel
®
Ivy Bridge CPU, DDR3
®
® TM
InTru 3D, Intel
TM ®
Insider , Intel HD Graphics 2500/4000
TM
Core i7 / i5 / i3 in
Ivy Bridge CPU. With
®
Quick
®
Clear Video HD
®
Ivy Bridge CPU.
®
Sandy Bridge CPU