Product Description 1.1 Overview; Feature Summary - Intel DH61HO Specification

1 Product Description
1.1 Overview
1.1.1

Feature Summary

Table 2 summarizes the major features of the board.
Table 2. Feature Summary
Form Factor
Processor
Chipset
Memory
Graphics
Audio
MicroATX (8.86 inches by 7.50 inches [225 millimeters by 190 millimeters])
• 3 rd generation Intel ® Core processor family and 2
processor family processors with up to 65 W TDP in an LGA1155 socket
― PCI Express* 3.0 x16 graphics interface
― Integrated graphics processing (processors with Intel
Technology)
― External graphics interface controller
― Integrated memory controller with dual channel DDR3 memory support
Intel ® H61 Express Chipset consisting of the Intel
Hub (PCH)
• Two 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
• Support for DDR3 1333 MHz and DDR3 1066 MHz DIMMs
• Support for 1 Gb, 2 Gb, and 4 Gb memory technology
• Support for up to 16 GB of system memory with two DIMMs using 4 Gb
memory technology
• Support for non-ECC memory
• Integrated graphics support for processors with Intel
― VGA
• Support for PCI Express 3.0 x16 add-in graphics cards
Note: PCI Express 3.0 is only supported by 3
processor family processors
®
• Intel High Definition Audio:
― Realtek* ALC662 audio codec
― Front panel audio header for Intel HD Audio and AC '97 Audio support
nd generation Intel ®
®
Graphics
® H61 Platform Controller
® Graphics Technology
rd generation Intel Core
Core
continued
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