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Intel® Desktop Board
DG965MS
Technical Product Specification
®
The Intel
Desktop Board DG965MS may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current
characterized errata are documented in the Intel Desktop Board DG965MS Specification Update.
August 2006
Order Number: D56016-001US
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Table of Contents
Related Manuals for Intel DG965MS
Summary of Contents for Intel DG965MS
- Page 1 Order Number: D56016-001US ® The Intel Desktop Board DG965MS may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board DG965MS Specification Update.
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Page 2: Revision History
Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order. -
Page 3: Intended Audience
Intended Audience The TPS is intended to provide detailed, technical information about the Desktop Board DG965MS and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences. - Page 4 Intel Desktop Board DG965MS Technical Product Specification Other Common Notation Used after a signal name to identify an active-low signal (such as USBP0#) Gigabyte (1,073,741,824 bytes) GB/sec Gigabytes per second Gbit Gigabit (1, 073,741,824 bits) Kilobyte (1024 bytes) Kbit Kilobit (1024 bits)
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Page 5: Table Of Contents
1.4 System Memory ................16 1.4.1 Memory Configurations ............18 1.5 Intel ® G965 Express Chipset ............. 23 1.5.1 Intel G965 Graphics Subsystem..........23 1.5.2 USB ................... 26 1.5.3 Serial ATA Interfaces ............26 1.5.4 Parallel IDE Interface ............27 1.5.5... - Page 6 Intel Desktop Board DG965MS Technical Product Specification 2.6 PCI Interrupt Routing Map ..............47 2.7 Connectors and Headers..............48 2.7.1 Back Panel Connectors ............49 2.7.2 Component-side Connectors and Headers ........ 50 2.8 Jumper Block .................. 59 2.9 Mechanical Considerations ..............60 2.9.1...
- Page 7 Contents 5 Regulatory Compliance and Battery Disposal Information 5.1 Regulatory Compliance..............83 5.1.1 Safety Regulations..............83 5.1.2 European Union Declaration of Conformity Statement ....84 5.1.3 Product Ecology Statements........... 86 5.1.4 EMC Regulations ..............89 5.1.5 Product Certification Markings (Board Level)......90 5.2 Battery Disposal Information.............
- Page 8 32. DC Loading Characteristics ............... 62 33. Fan Header Current Capability............62 34. Thermal Considerations for Components ..........66 35. Desktop Board DG965MS Environmental Specifications ......67 36. BIOS Setup Program Menu Bar............70 37. BIOS Setup Program Function Keys............ 70 38.
- Page 9 Product Description What This Chapter Contains Overview....................10 Online Support ...................15 Processor ....................15 System Memory ..................16 Intel ® G965 Express Chipset ...............23 Legacy I/O Controller ..................28 Audio Subsystem..................29 LAN Subsystem ..................30 Hardware Management Subsystem ...............32 1.10 Power Management ..................34...
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Page 10: Overview
Intel Desktop Board DG965MS Technical Product Specification Overview 1.1.1 Feature Summary Table 1 summarizes the major features of the Desktop Board DG965MS. Table 1. Feature Summary Form Factor microBTX Form Factor (10.40 inches by 10.50 inches [264.16 millimeters by 266.70 millimeters]) -
Page 11: Product Description
• Thermal sense to detect out of range thermal values • Three fan headers • Three fan sense inputs used to monitor fan activity For information about Refer to Available configurations for the Desktop Board DG965MS Section 1.2, page 15... -
Page 12: Board Layout
Intel Desktop Board DG965MS Technical Product Specification 1.1.2 Board Layout Figure 1 shows the location of the major components. F G H OM18428 Figure 1. Major Board Components Table 2 lists the components identified in Figure 1. -
Page 13: Board Components Shown In Figure 1
High Definition Audio header Remote thermal sensor Serial ATA connectors [4] Front panel USB headers [2] Intel 82801HB I/O Controller Hub (ICH8) Chassis intrusion header PCI Express x16 connector PCI Express x1 connector PCI Conventional bus add-in card connectors [2]... -
Page 14: Block Diagram
Intel Desktop Board DG965MS Technical Product Specification 1.1.3 Block Diagram Figure 2 is a block diagram of the major functional areas. Gigabit Ethernet PCI Express x1 Interface Controller Connector PCI Express x1 Slot 1 Back Panel/Front Panel USB Ports Parallel ATA... -
Page 15: Online Support
Processor The board is designed to support the following processors: • Intel Core 2 Duo processor in an LGA775 socket with a 1066 or 800 MHz system bus • Intel Pentium D processor in an LGA775 processor socket with an 800 or 533 MHz system bus •... -
Page 16: System Memory
Intel Desktop Board DG965MS Technical Product Specification System Memory The board has four DIMM sockets and supports the following memory features: • 1.8 V (only) DDR2 SDRAM DIMMs with gold-plated contacts • Unbuffered, single-sided or double-sided DIMMs with the following restriction: Double-sided DIMMS with x16 organization are not supported. -
Page 17: Memory Operating Frequencies
Product Description NOTE Regardless of the DIMM type used, the memory frequency will either be equal to or less than the processor system bus frequency. For example, if DDR2 800 memory is used with a 533 MHz system bus frequency processor, the memory will operate at 533 MHz. -
Page 18: Memory Configurations
Intel Desktop Board DG965MS Technical Product Specification 1.4.1 Memory Configurations The Intel 82G965 GMCH supports the following types of memory organization: • Dual channel (Interleaved) mode. This mode offers the highest throughput for real world applications. Dual channel mode is enabled when the installed memory capacities of both DIMM channels are equal. -
Page 19: Dual Channel (Interleaved) Mode Configuration With Two Dimms
Product Description INTEGRATOR’S NOTE Regardless of the memory configuration used (dual channel, single channel, or flex mode), DIMM 0 of Channel A must always be populated. This is a requirement of the ICH8 Manageability Engine feature. 1.4.1.1 Dual Channel (Interleaved) Mode Configurations Figure 4 shows a dual channel configuration using two DIMMs. -
Page 20: Dual Channel (Interleaved) Mode Configuration With Four Dimms
Intel Desktop Board DG965MS Technical Product Specification Figure 6 shows a dual channel configuration using four DIMMs. In this example, the combined capacity of the two DIMMs in Channel A equal the combined capacity of the two DIMMs in Channel B. Also, the DIMMs are matched between DIMM0 and DIMM1 of both channels. -
Page 21: Single Channel (Asymmetric) Mode Configuration With One Dimm
Product Description 1.4.1.2 Single Channel (Asymmetric) Mode Configurations NOTE Dual channel (Interleaved) mode configurations provide the highest memory throughput. Figure 7 shows a single channel configuration using one DIMM. In this example, only the DIMM0 (blue) socket of Channel A is populated. Channel B is not populated. Channel A, DIMM 0 512 MB Channel A, DIMM 1... -
Page 22: Flex Mode Configuration With Two Dimms
Intel Desktop Board DG965MS Technical Product Specification 1.4.1.3 Flex Mode Configuration NOTE The use of flex mode requires DIMMs to be installed in both channels. Figure 9 shows a flex mode configuration using two DIMMs. The operation is as follows: •... -
Page 23: Intel ® G965 Express Chipset
G965 Express Chipset ® The Intel G965 Express chipset consists of the following devices: • Intel 82G965 Graphics and Memory Controller Hub (GMCH) with Direct Media Interface (DMI) interconnect • Intel 82801HB I/O Controller Hub (ICH8) with DMI interconnect The GMCH component provides interfaces to the CPU, memory, PCI Express, and the DMI interconnect. - Page 24 Intel Desktop Board DG965MS Technical Product Specification • 3D Graphics Rendering enhancements ⎯ 1.3 dual texture GigaPixel/sec fill rate ⎯ 16 and 32 bit color ⎯ Maximum 3D supported resolution of 1600 x 1200 x 32 at 85 Hz ⎯ Vertex cache ⎯...
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Page 25: Configuration Modes
NOTE The use of DVMT requires operating system driver support. 1.5.1.3 Configuration Modes A list of supported modes for the Intel GMA X3000 graphics controller is available as a downloadable document. For information about Refer to Supported video modes for the board Section 1.2, page 15... -
Page 26: Usb
Intel Desktop Board DG965MS Technical Product Specification 1.5.2 The board supports up to 10 USB 2.0 ports, supports UHCI and EHCI, and uses UHCI- and EHCI-compatible drivers. The ICH8 provides the USB controller for all ports. The port arrangement is as follows: •... -
Page 27: Parallel Ide Interface
Product Description 1.5.4 Parallel IDE Interface The Parallel ATA IDE controller has one bus-mastering Parallel ATA IDE interface. The Parallel ATA IDE interface supports the following modes: • Programmed I/O (PIO): processor controls data transfer. • 8237-style DMA: DMA offloads the processor, supporting transfer rates of up to 16 MB/sec. -
Page 28: Legacy I/O Controller
Intel Desktop Board DG965MS Technical Product Specification Legacy I/O Controller The I/O controller provides the following features: • One serial port • One parallel port with Extended Capabilities Port (ECP) and Enhanced Parallel Port (EPP) support • Serial IRQ interface compatible with serialized IRQ support for PCI systems •... -
Page 29: Audio Subsystem
Back panel – Blue Back panel – Green Back panel – Pink 1.7.1 Audio Subsystem Software Audio software and drivers are available from Intel’s World Wide Web site. For information about Refer to Obtaining audio software and drivers Section 1.2, page 15... -
Page 30: Audio Connectors And Headers
• LAN connect interface between ICH8 and LAN controller • PCI Conventional bus power management ⎯ Supports ACPI technology ⎯ Supports LAN wake capabilities ⎯ LAN Subsystem Software LAN software and drivers are available from Intel’s World Wide Web site. -
Page 31: Intel ® 82566Dc Gigabit Ethernet Controller
Full device driver compatibility • PCI Express Power Management Support 1.8.2 LAN Subsystem Software LAN software and drivers are available from Intel’s World Wide Web site. For information about Refer to Obtaining LAN software and drivers Section 1.2, page 15 1.8.3... -
Page 32: Hardware Management Subsystem
Thermally monitored closed-loop fan control, for all three fans, that can adjust the fan speed or switch the fans on or off as needed 1.9.2 Fan Monitoring Fan monitoring can be implemented using Intel Desktop Utilities or third-party software. For information about Refer to The functions of the fan headers Section 1.10.2.2, page 37... -
Page 33: Thermal Monitoring
Product Description 1.9.4 Thermal Monitoring Figure 12 shows the locations of the thermal sensors and fan headers. OM18431 Item Description Thermal diode, located on processor die Thermal diode, located on the GMCH die Thermal diode, located on the ICH8 die Remote thermal sensor Processor fan Front chassis fan... -
Page 34: 1.10 Power Management
Intel Desktop Board DG965MS Technical Product Specification 1.10 Power Management Power management is implemented at several levels, including: • Software support through Advanced Configuration and Power Interface (ACPI) • Hardware support: ⎯ Power connector ⎯ Fan headers ⎯ LAN wake capabilities ⎯... -
Page 35: Power States And Targeted System Power
Product Description 1.10.1.1 System States and Power States Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. Devices that are not being used can be turned off. -
Page 36: Hardware Support
Intel Desktop Board DG965MS Technical Product Specification 1.10.1.2 Two-Watt Standby In 2001, the U.S. government issued an executive order requiring a reduction in power for appliances and personal computers. This board meets that requirement by operating at 1.5 W (or less) in S5 (Standby) mode. Two-Watt operation applies only to the S5 state when the computer is turned off, but still connected to AC power. -
Page 37: Power Connector
Product Description • LAN wake capabilities • Instantly Available PC technology • Resume on Ring • Wake from USB • Wake from PS/2 keyboard • PME# signal wake-up support • WAKE# signal wake-up support LAN wake capabilities and Instantly Available PC technology require power from the +5 V standby line. -
Page 38: Lan Wake Capabilities
Intel Desktop Board DG965MS Technical Product Specification 1.10.2.3 LAN Wake Capabilities CAUTION For LAN wake capabilities, the +5 V standby line from the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing LAN wake capabilities can damage the power supply. -
Page 39: Resume On Ring
Product Description 1.10.2.5 Resume on Ring The operation of Resume on Ring can be summarized as follows: • Resumes operation from ACPI S3 state • Detects incoming call similarly for external and internal modems • Requires modem interrupt be unmasked for correct operation 1.10.2.6 Wake from USB USB bus activity wakes the computer from ACPI S3 state. -
Page 40: Location Of The Standby Power Indicator Led
Intel Desktop Board DG965MS Technical Product Specification 1.10.2.10 +5 V Standby Power Indicator LED The +5 V standby power indicator LED shows that power is still present even when the computer appears to be off. Figure 13 shows the location of the standby power indicator LED. -
Page 41: Technical Reference
Technical Reference What This Chapter Contains Memory Map ....................41 DMA Channels....................43 Fixed I/O Map ....................44 PCI Configuration Space Map ...............45 Interrupts....................46 PCI Interrupt Routing Map ................47 Connectors and Headers................48 Jumper Block .....................59 Mechanical Considerations ................60 2.10 Electrical Considerations ................62 2.11 Thermal Considerations ................64 2.12 Reliability ....................66 2.13 Environmental....................67 Memory Map... -
Page 42: Detailed System Memory Address Map
Intel Desktop Board DG965MS Technical Product Specification The amount of installed memory that can be used will vary based on add-in cards and BIOS settings. Figure 14 shows a schematic of the system memory map. All installed system memory can be used when there is no overlap of system addresses. -
Page 43: Dma Channels
Technical Reference Table 10 lists the system memory map. Table 10. System Memory Map Address Range Address Range (decimal) (hex) Size Description 1024 K - 8388608 K 100000 - 1FFFFFFFF 8191 MB Extended memory 960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS 896 K - 960 K... -
Page 44: Fixed I/O Map
Table 12. I/O Map Address (hex) Size Description 0000 - 00FF 256 bytes Used by the Desktop Board DG965MS. Refer to the ICH8 data sheet for dynamic addressing information. 01F0 - 01F7 8 bytes Primary Parallel ATE IDE channel command block (Note 1) -
Page 45: Pci Configuration Space Map
Table 13. PCI Configuration Space Map Device Function Number (hex) Number (hex) Number (hex) Description Memory controller of Intel 82G965 component (Note 1) PCI Express x16 graphics port Integrated graphics controller Intel High Definition Audio Controller PCI Express port 1... -
Page 46: Interrupts
Intel Desktop Board DG965MS Technical Product Specification Interrupts The interrupts can be routed through either the Programmable Interrupt Controller (PIC) or the Advanced Programmable Interrupt Controller (APIC) portion of the ICH8 component. The PIC is supported in Windows 98 SE and Windows ME and uses the first 16 interrupts. -
Page 47: Pci Interrupt Routing Map
Technical Reference PCI Interrupt Routing Map This section describes interrupt sharing and how the interrupt signals are connected between the PCI bus connectors and onboard PCI devices. The PCI specification specifies how interrupts can be shared between devices attached to the PCI bus. In most cases, the small amount of latency added by interrupt sharing does not affect the operation or throughput of the devices. -
Page 48: Connectors And Headers
Intel Desktop Board DG965MS Technical Product Specification Connectors and Headers CAUTION Only the following connectors have overcurrent protection: Back panel and front panel USB, PS/2, and VGA. The other internal connectors/headers are not overcurrent protected and should connect only to devices inside the computer’s chassis, such as fans and internal peripherals. -
Page 49: Back Panel Connectors
Technical Reference 2.7.1 Back Panel Connectors Figure 15 shows the locations of the back panel connectors. OM18427 Item Description VGA port PS/2 mouse port PS/2 keyboard port USB ports [2] IEEE-1394a USB ports [2] USB ports [2] Audio line in Mic in Audio line out Figure 15. -
Page 50: Component-Side Connectors And Headers
Intel Desktop Board DG965MS Technical Product Specification 2.7.2 Component-side Connectors and Headers Figure 16 shows the locations of the component-side connectors and headers. OM18433 Figure 16. Component-side Connectors and Headers... -
Page 51: Component-Side Connectors And Headers Shown In Figure 16
Technical Reference Table 16 lists the component-side connectors and headers identified in Figure 16. Table 16. Component-side Connectors and Headers Shown in Figure 16 Item/callout from Figure 16 Description High Definition Audio Link header Serial ATA connectors [4] Front panel USB headers [2] Chassis intrusion header PCI Express x16 add-in card connector PCI Express x1 add-in card connector... -
Page 52: High Definition Audio Link Header
Intel Desktop Board DG965MS Technical Product Specification Table 17. High Definition Audio Link Header Signal Name Signal Name BCLK Ground 3.3 V/1.5 V I/O SYNC Ground 3.3V_CORE +12 V No connect Key (no pin) No connect 3.3 V/1.5V STBY No connect Ground Table 18. -
Page 53: Parallel Port Header
Technical Reference Table 21. Parallel Port Header Signal Name Signal Name STROBE# AUTOFD# FAULT# INIT# SLCTIN# Ground Ground Ground Ground Ground ACK# Ground BUSY Ground PERROR Ground SELECT Key (no pin) Table 22. Front and Rear Chassis Fan Headers Signal Name Control +12 V Tach... -
Page 54: Add-In Card Connectors
Intel Desktop Board DG965MS Technical Product Specification 2.7.2.1 Add-in Card Connectors The board has the following add-in card connectors: • PCI Express x16: one connector supporting simultaneous transfer speeds up to 4 GBytes/sec of peak bandwidth per direction and up to 8 GBytes/sec concurrent bandwidth •... -
Page 55: Processor Core Power Connector
Main power – a 2 x 12 connector. This connector is compatible with 2 x 10 connectors previously used on Intel Desktop boards. The board supports the use of ATX12V power supplies with either 2 x 10 or 2 x 12 main power cables. When... -
Page 56: Connection Diagram For Front Panel Header
Intel Desktop Board DG965MS Technical Product Specification 2.7.2.3 Front Panel Header This section describes the functions of the front panel header. Table 27 lists the signal names of the front panel header. Figure 17 is a connection diagram for the front panel header. -
Page 57: States For A One-Color Power Led
Technical Reference 2.7.2.3.2 Reset Switch Header Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type switch that is normally open. When the switch is closed, the board resets and runs the POST. 2.7.2.3.3 Power/Sleep LED Header Pins 2 and 4 can be connected to a one- or two-color LED. -
Page 58: Connection Diagram For Front Panel Usb Headers
Intel Desktop Board DG965MS Technical Product Specification 2.7.2.5 Front Panel USB Headers Figure 18 is a connection diagram for the front panel USB headers. INTEGRATOR’S NOTES • The +5 V DC power on the front panel USB headers is fused. -
Page 59: Jumper Block
Technical Reference Jumper Block CAUTION Do not move the jumper with the power on. Always turn off the power and unplug the power cord from the computer before changing a jumper setting. Otherwise, the board could be damaged. Figure 20 shows the location of the jumper block. The jumper determines the BIOS Setup program’s mode. -
Page 60: Mechanical Considerations
Intel Desktop Board DG965MS Technical Product Specification Mechanical Considerations 2.9.1 Form Factor The board is designed to fit into a BTX-form-factor chassis. Figure 21 illustrates the mechanical form factor of the board. Dimensions are given in inches [millimeters]. The outer dimensions are 10.40 inches by 10.50 inches [264.16 millimeters by 266.70 millimeters]. -
Page 61: I/O Shield
I/O shields relative to chassis requirements are described in the BTX specification. NOTE The I/O shield drawing is for reference only. I/O shields compliant with the BTX specification are available from Intel. 172.93 REF [6.808] 13.00 TYP [0.512]... -
Page 62: 2.10 Electrical Considerations
Intel Desktop Board DG965MS Technical Product Specification 2.10 Electrical Considerations 2.10.1 DC Loading Table 32 lists the DC loading characteristics of the board. This data is based on a DC analysis of all active components within the board that impact its power delivery subsystems. -
Page 63: Add-In Board Considerations
Technical Reference 2.10.3 Add-in Board Considerations The board is designed to provide 2 A (average) of +5 V current for each add-in board. The total +5 V current draw for add-in boards for a fully loaded board (all three expansion slots and the PCI Express x16 connector filled) must not exceed 8 A. 2.10.4 Power Supply Considerations CAUTION... -
Page 64: 2.11 Thermal Considerations
Failure to ensure appropriate airflow may result in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the board. For a list of chassis that have been tested with Intel desktop boards please refer to the following website: http://developer.intel.com/design/motherbd/cooling.htm... -
Page 65: Localized High Temperature Zones
Technical Reference Figure 23 shows the locations of the localized high temperature zones. OM18437 Item Description Intel 82G965 GMCH Intel 82801HB ICH8 1.5 V core and front side bus voltage regulator areas Processor Processor voltage regulator area Figure 23. Localized High Temperature Zones... -
Page 66: 2.12 Reliability
Intel Desktop Board DG965MS Technical Product Specification Table 34 provides maximum case temperatures for the board components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board. -
Page 67: 2.13 Environmental
Technical Reference 2.13 Environmental Table 35 lists the environmental specifications for the board. Table 35. Desktop Board DG965MS Environmental Specifications Parameter Specification Temperature Non-Operating -40 ° C to +70 ° C Operating 0 ° C to +55 ° C Shock... - Page 68 Intel Desktop Board DG965MS Technical Product Specification...
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Page 69: Overview Of Bios Features
3.10 BIOS Security Features ................76 Introduction The board uses an Intel BIOS that is stored in the Serial Peripheral Interface Flash Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash contains the BIOS Setup program, POST, the PCI auto-configuration utility, and Plug and Play support. -
Page 70: Bios Flash Memory Organization
Intel Desktop Board DG965MS Technical Product Specification Table 36 lists the BIOS Setup program menu features. Table 36. BIOS Setup Program Menu Bar Maintenance Main Advanced Security Power Boot Exit Configures Selects Saves or Clears Displays Configures Sets passwords and... -
Page 71: Pci Ide Support
Overview of BIOS Features 3.3.2 PCI IDE Support If you select Auto in the BIOS Setup program, the BIOS automatically sets up the PCI IDE connector with independent I/O channel support. The IDE interface supports hard drives up to ATA-66/100/133 and recognizes any ATAPI compliant devices, including CD-ROM drives, tape drives, and Ultra DMA drives. -
Page 72: Legacy Usb Support
Intel Desktop Board DG965MS Technical Product Specification Legacy USB Support Legacy USB support enables USB devices to be used even when the operating system’s USB drivers are not yet available. Legacy USB support is used to access the BIOS Setup program, and to install an operating system that supports USB. By default, Legacy USB support is set to Enabled. -
Page 73: Language Support
The Integrator’s Toolkit that is available from Intel can be used to create a custom splash screen. NOTE If you add a custom splash screen, it will share space with the Intel branded logo. Refer to For information about The Intel World Wide Web site Section 1.2, page 15... -
Page 74: Boot Options
Intel Desktop Board DG965MS Technical Product Specification Boot Options In the BIOS Setup program, the user can choose to boot from a diskette drive, hard drives, CD-ROM, or the network. The default setting is for the diskette drive to be the first boot device, the hard drive second, and the ATAPI CD-ROM third. -
Page 75: Adjusting Boot Speed
It is possible to optimize the boot process to the point where the system boots so quickly that the Intel logo screen (or a custom logo splash screen) will not be seen. Monitors and hard disk drives with minimum initialization times can also contribute to a boot time that might be so fast that necessary logo screens and POST messages cannot be seen. -
Page 76: 3.10 Bios Security Features
Intel Desktop Board DG965MS Technical Product Specification 3.10 BIOS Security Features The BIOS includes security features that restrict access to the BIOS Setup program and who can boot the computer. A supervisor password and a user password can be set for the BIOS Setup program and for booting the computer, with the following restrictions: •... -
Page 77: Error Messages And Beep Codes
Error Messages and Beep Codes What This Chapter Contains Speaker ....................77 BIOS Beep Codes ..................77 BIOS Error Messages ..................77 Port 80h POST Codes ..................78 Speaker The board-mounted speaker provides audible error code (beep code) information during POST. For information about Refer to The location of the onboard speaker Figure 1, page 12... -
Page 78: Port 80H Post Codes
Intel Desktop Board DG965MS Technical Product Specification Port 80h POST Codes During the POST, the BIOS generates diagnostic progress codes (POST-codes) to I/O port 80h. If the POST fails, execution stops and the last POST code generated is left at port 80h. This code is useful for determining the point where an error occurred. -
Page 79: Port 80H Post Codes
Error Messages and Beep Codes Table 44. Port 80h POST Codes POST Code Description of POST Operation Host Processor Power-on initialization of the host processor (Boot Strap Processor) Host processor Cache initialization (including APs) Starting Application processor initialization SMM initialization Chipset Initializing a chipset component Memory... - Page 80 Intel Desktop Board DG965MS Technical Product Specification Table 44. Port 80h POST Codes (continued) POST Code Description of POST Operation Keyboard (PS2 or USB) Resetting keyboard Disabling keyboard Detecting presence of keyboard Enabling the keyboard Clearing keyboard input buffer Instructing keyboard controller to run Self Test (PS2 only)
- Page 81 Error Messages and Beep Codes Table 44. Port 80h POST Codes (continued) POST Code Description of POST Operation DXE Drivers Waiting for user input Checking password Entering BIOS setup Calling Legacy Option ROMs Runtime Phase/EFI OS Boot Entering Sleep state Exiting Sleep state EFI boot service ExitBootServices ( ) has been called EFI runtime service SetVirtualAddressMap ( ) has been called...
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Page 82: Typical Port 80H Post Sequence
Intel Desktop Board DG965MS Technical Product Specification Table 45. Typical Port 80h POST Sequence POST Code Description Initializing a chipset component Reading SPD from memory DIMMs Detecting presence of memory DIMMs Configuring memory Testing memory Loading recovery capsule Entered DXE phase... -
Page 83: Regulatory Compliance And Battery Disposal Information
• Electromagnetic Compatibility (EMC) regulations • Product certification markings 5.1.1 Safety Regulations Desktop Board DG965MS complies with the safety regulations stated in Table 46 when correctly installed in a compatible host system. Table 46. Safety Regulations Regulation Title UL 60950-1:2003/ Information Technology Equipment –... -
Page 84: European Union Declaration Of Conformity Statement
European Union Declaration of Conformity Statement We, Intel Corporation, declare under our sole responsibility that the product Intel ® Desktop Board DG965MS is in conformity with all applicable essential requirements necessary for CE marking, following the provisions of the European Council Directive 89/336/EEC (EMC Directive) and Council Directive 73/23/EEC (Safety/Low Voltage Directive). - Page 85 Regulatory Compliance and Battery Disposal Information Malti Dan il-prodott hu konformi mal-provvedimenti tad-Direttivi Ewropej 89/336/EEC u 73/23/EEC. Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet 89/336/ EEC & 73/23/EEC. Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej 89/336/EWG i 73/23/EWG.
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Page 86: Product Ecology Statements
请参考 了解此计划的详情，包括涉及产品之范围、回收地点、运送指导、条款和条件等。 Deutsch Als Teil von Intels Engagement für den Umweltschutz hat das Unternehmen das Intel Produkt-Recyclingprogramm implementiert, das Einzelhandelskunden von Intel Markenprodukten ermöglicht, gebrauchte Produkte an ausgewählte Standorte für ordnungsgemäßes Recycling zurückzugeben. Details zu diesem Programm, einschließlich der darin eingeschlossenen Produkte, verfügbaren Standorte, Versandanweisungen, Bedingungen usw., finden Sie auf der... - Page 87 Regulatory Compliance and Battery Disposal Information Français Dans le cadre de son engagement pour la protection de l'environnement, Intel a mis en œuvre le programme Intel Product Recycling Program (Programme de recyclage des produits Intel) pour permettre aux consommateurs de produits Intel de recycler les produits usés en les retournant à...
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Page 88: Lead-Free Board Markings
Intel Desktop Board DG965MS Technical Product Specification Türkçe Intel, çevre sorumluluğuna bağımlılığının bir parçası olarak, perakende tüketicilerin Intel markalı kullanılmış ürünlerini belirlenmiş merkezlere iade edip uygun şekilde geri dönüştürmesini amaçlayan Intel Ürünleri Geri Dönüşüm Programı’nı uygulamaya koymuştur. Bu programın ürün kapsamı, ürün iade merkezleri, nakliye talimatları, kayıtlar ve şartlar v.s dahil bütün ayrıntılarını... -
Page 89: Emc Regulations
Regulatory Compliance and Battery Disposal Information 5.1.4 EMC Regulations Desktop Board DG965MS complies with the EMC regulations stated in Table 48 when correctly installed in a compatible host system. Table 48. EMC Regulations Regulation Title FCC Class B Title 47 of the Code of Federal Regulations, Parts 2 and 15, Subpart B, Radio Frequency Devices. -
Page 90: Product Certification Markings (Board Level)
EMC requirements. You may use this equipment in residential environments and other non-residential environments. 5.1.5 Product Certification Markings (Board Level) Desktop Board DG965MS has the product certification markings shown in Table 49: Table 49. Product Certification Markings Description Mark UL joint US/Canada Recognized Component mark. -
Page 91: Battery Disposal Information
Regulatory Compliance and Battery Disposal Information Battery Disposal Information CAUTION Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled where possible. Disposal of used batteries must be in accordance with local environmental regulations. PRECAUTION Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. - Page 92 Intel Desktop Board DG965MS Technical Product Specification PRECAUCIÓN Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del fabricante.
- Page 93 Regulatory Compliance and Battery Disposal Information AWAS Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan. OSTRZEŻENIE Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu baterii.
- Page 94 Intel Desktop Board DG965MS Technical Product Specification...