Intel BOXD945GBOLKR Technical Product Specification page 6

Product specification
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Intel Desktop Board D945GBO Technical Product Specification
2.1
Memory Resources ...................................................................................................... 45
2.1.1
Addressable Memory..................................................................................... 45
2.1.2
Memory Map.................................................................................................. 47
2.2
DMA Channels ............................................................................................................. 47
2.3
Fixed I/O Map............................................................................................................... 48
2.4
PCI Configuration Space Map...................................................................................... 49
2.5
Interrupts ...................................................................................................................... 50
2.6
PCI Conventional Interrupt Routing Map ..................................................................... 51
2.7
Connectors................................................................................................................... 52
2.7.1
Back Panel Connectors ................................................................................. 52
2.7.2
Component-side Connectors......................................................................... 54
2.8
Jumper Block ............................................................................................................... 62
2.9
Mechanical Considerations .......................................................................................... 63
2.9.1
Form Factor ................................................................................................... 63
2.9.2
I/O Shield....................................................................................................... 64
2.10 Electrical Considerations.............................................................................................. 66
2.10.1
DC Loading.................................................................................................... 66
2.10.2
Add-in Board Considerations......................................................................... 66
2.10.3
Fan Connector Current Capability ................................................................. 67
2.10.4
Power Supply Considerations ....................................................................... 67
2.11 Thermal Considerations ............................................................................................... 68
2.12 Reliability...................................................................................................................... 70
2.13 Environmental .............................................................................................................. 71
2.14 Regulatory Compliance................................................................................................ 72
2.14.1
Safety Regulations ........................................................................................ 72
2.14.2
European Union Declaration of Conformity Statement.................................. 72
2.14.3
Product Ecology Statements ......................................................................... 74
2.14.4
EMC Regulations........................................................................................... 77
2.14.5
Product Certification Markings (Board Level) ................................................ 78
3.1
Introduction .................................................................................................................. 79
3.2
BIOS Flash Memory Organization ............................................................................... 80
3.3
Resource Configuration ............................................................................................... 80
3.3.1
PCI Autoconfiguration.................................................................................... 80
3.3.2
PCI IDE Support ............................................................................................ 80
3.4
System Management BIOS (SMBIOS) ........................................................................ 81
3.5
Legacy USB Support.................................................................................................... 81
3.6
BIOS Updates .............................................................................................................. 82
3.6.1
Language Support ......................................................................................... 82
3.6.2
Custom Splash Screen.................................................................................. 82
3.7
Boot Options ................................................................................................................ 83
3.7.1
CD-ROM Boot ............................................................................................... 83
3.7.2
Network Boot ................................................................................................. 83
3.7.3
Booting Without Attached Devices ................................................................ 83
3.7.4
Changing the Default Boot Device During POST .......................................... 83
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