LG KU950 Service Manual
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LG KU950 Service Manual

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Service Manual
KU950
Date: December, 2006 / Issue 1.0

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Summary of Contents for LG KU950

  • Page 1 Service Manual KU950 Date: December, 2006 / Issue 1.0...

  • Page 2: Table Of Contents

    3.9 External memory interface .....41 3.10 Hardware sub system ......42 8. pcb layout ........176 3.11 DVB-H System........66 3.12 Main features of KU950 .......73 9. Calibration Program ....185 9.1 Configuration of HOT KIMCHI .....185 4. TROUBLE SHOOTING ....79 9.2 How to use HOT KIMCHI.....189 4.1 RF Component........79...
  • Page 3 - 4 -...

  • Page 4: Introduction

    1. INTRODUCTION 1. INTRODUCTION 1.1 Purpose This manual provides the information necessary to repair, calibration, description and download the features of this model. 1.2 Regulatory Information A. Security Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services.
  • Page 5 1. INTRODUCTION E. Notice of Radiated Emissions This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user. F.

  • Page 6: Performance

    2. PERFORMANCE 2. PERFORMANCE 2.1 System Overview Item Specification Shape GSM900/1800/1900 and WCDMA Folder Handset Size 100.6 x 50.6 x 21.4 mm Weight 110 g (with 950mAh Battery) Power 3.7V normal, 950 mAh Li-Polymer Talk Time Over 150 min (WCDMA, Tx=12 dBm, Voice) (with 1000mAh) Over 175 min (GSM, Tx=Max, Voice) Standby Time...

  • Page 7: Usable Environment

    2. PERFORMANCE 2.2 Usable environment 1) Environment Item Specification Voltage 3.7 V(Typ), [Shut Down : 3.22 V] Operation Temp -20 ~ +60°C Storage Temp -20 ~ +70°C Humidity 85 % (Max) 2) Environment (Accessory) Reference Spec. Typ. Unit TA Power Available power * CLA : 12 ~ 24 V(DC) 2.3 Radio Performance...
  • Page 8 2. PERFORMANCE Item DCS & PCS 30M~1GHz -36dBm 30M ~ 1GHz -36dBm MS allocated 1G~[A]MHz -30dBm Channel [A]M~[B]MHz -36dBm 1G ~ 4GHz -30dBm Radiated [B]M~4GHz -30dBm Spurious 30M ~ 880MHz -57dBm 30M~880MHz -57dBm Emission 880M ~ 915MHz -59dBm 880M~915MHz -59dBm 915M~1GHz -57dBm 915M~1GHz...
  • Page 9 2. PERFORMANCE Item DCS & PCS Frequency offset 800kHz Intermodulation product should Intermodulation attenuation – be Less than 55dB below the level of Wanted signal Power control Power Tolerance Power control Power Tolerance Level (dBm) (dB) Level (dBm) (dB) ±3 ±3 ±3 ±3...
  • Page 10 2. PERFORMANCE 2) Transmitter - WCDMA Mode Item Specification Maximum Output Power Class 3 : +24dBm(+1/-3dB) Class 4 : +21dBm(±2dB) Frequency Error ±0.1ppm Open Loop Power control in uplink ±9dB@normal, ±12dB@extreme Adjust output(TPC command) +0.5/1.5 +1/3 +1.5/4.5 Inner Loop Power control in uplink -0.5/+0.5 -0.5/+0.5 -0.5/+0.5 -0.5/-1.5 -1/-3...
  • Page 11 2. PERFORMANCE Item Specification 33dB@5MHz, ACP>-50dBm Adjacent Channel Leakage Ratio(ACLR) 43dB@10MHz, ACP>-50dBm -36dBm@f=9~150KHz, 1K BW -36dBm@f=50KHz~30MHz, 10K BW -36dBm@f=30MHz~1000MHz, 100K BW Spurious Emissions -30dBm@f=1~12.5GHz, 1M BW (*: additional requirement) (*)-41dBm@f=1893.5~1919.6MHz, 300K (*)-67dBm@f=925~935MHz, 100K BW (*)-79dBm@f=935~960MHz, 100K BW (*)-71dBm@f=1805~1880MHz, 100K BW -31dBc@5MHz,Interferer -40dBc Transmit Intermodulation -41dBc@10MHz, Interferer -40dBc...
  • Page 12 2. PERFORMANCE 4) Receiver - WCDMA Mode Item Specification Reference Sensitivity Level -106.7 dBm(3.84 MHz) -25dBm(3.84MHz) Maximum Input Level -44dBm/3.84MHz(DPCH_Ec) UE@+20dBm output power(Class3) 33dB Adjacent Channel Selectivity (ACS) UE@+20dBm output power(Class3) -56dBm/3.84MHz@10MHz In-band Blocking UE@+20dBm output power(Class3) -44dBm/3.84MHz@15MHz UE@+20dBm output power(Class3) -44dBm/3.84MHz@f=2050~2095 and 2185~2230MHz UE@+20dBm output power(Class3)

  • Page 13: Current Consumption

    2. PERFORMANCE 2.4 Current Consumption Stand by Voice Call Under 3.518 mA Under 335 mA Under 569mA WCDMA (DRX=2.56) (Tx=10dBm) (Tx=10dBm) Under 3.518 mA Under 292 mA Paging=5 period (PCL=7) (Stand by Test Condition : Bluetooth off, LCD backlight off) (Call Test Condition : Bluetooth off, LCD backlight dimming mode) (VT Test Condition : Speaker off, LCD backlight On) 2.5 RSSI BAR...

  • Page 14: Sound Pressure Level

    2. PERFORMANCE 2.7 Sound Pressure Level Test Item Specification Sending Loudness Rating (SLR) 8 ±3 dB -4 ± 3 dB Receiving Loudness Rating (RLR) -15 ± 3 dB Side Tone Masking Rating (STMR) 17 dB Echo Loss (EL) 40 dB Sending Distortion (SD) Refer to Table 30.3 Receiving Distortion (RD)

  • Page 15: Charging

    2. PERFORMANCE 2.8 Charging - Charging Method : CC & CV (Constant Current & Constant Voltage) - Maximum Charging Voltage : 4.2V - Maximum Charging Current : 650mA - Nominal Battery Capacity : 950 mAh - Charger Voltage : 4.8V - Charging time : Max 3 h (Except time trickle charging) - Full charge indication current (icon stop current) : 60mA - Low battery POP UP : 3.48V...

  • Page 16: Technical Brief

    3. TECHNICAL BRIEF 3. RF TECHNICAL BRIEF 3.1 General Description The KU950 supports UMTS-2100 DS-WCDMA, EGSM-900, DCS-1800, and PCS-1900. All receivers and the UMTS transmitter use the radio One Zero-IF architecture to eliminate intermediate frequencies, directly converting signals between RF and baseband. The EGSM, DCS1800 and PCS1900 transmitters use a baseband-to-IF up-conversion followed by an offset phase-locked loop that translates the GMSKmodulated signal to RF.
  • Page 17 3. TECHNICAL BRIEF A generic, high-level functional block diagram of KU950 is shown in Figure 1-1. One antenna collects base station forward link signals and radiates handset reverse link signals. The antenna connects with receive and transmit paths through a switch module (plus a duplexer for UMTS-2100 operation).
  • Page 18 3. TECHNICAL BRIEF KU950 power supply voltages are managed and regulated by the PM6250 Power Management IC. This versatile device integrates all wireless handset power management, general housekeeping, and user interface support functions into a single mixed signal IC. It monitors and controls the external power source and coordinates battery recharging while maintaining the handset supply voltages using low dropout, programmable regulators.

  • Page 19: Gsm Mode

    3.2 GSM Mode 3.2.1 GSM Receiver The Dual-mode KU950’s receiver functions are split between the two RFICs as follows: • UMTS-2100 operation uses the RFR6250 Receiver ICs to implement the receive signal path, accepting an RF input and delivering analog baseband outputs (I and Q).
  • Page 20 3. TECHNICAL BRIEF The amplifier outputs drive the RF ports of the quadrature RF-to-baseband downconverters. The downconverted baseband outputs are multiplexed and routed to lowpass filters (one I and one Q) having passband and stopband characteristics suitable for GMSK processing. These filter circuits include DC offset corrections.

  • Page 21: Gsm Transmitter

    3. TECHNICAL BRIEF 3.2.2. GSM Transmitter The shared GSM Low-band (EGSM900) and High-band (DCS1800, PCS1900) transmit path begins with the baseband inputs from the MSM6275 IC. These differential analog input signals are buffered, lowpass filtered, corrected for DC offsets then applied to the GSM quadrature upconverter. The upconverter LO signals are generated from the transceiver VCO signal by the LO distribution and generation circuits within RTR6250.

  • Page 22: Wcdma Mode

    3. TECHNICAL BRIEF The waveform at the dual Tx VCO output is the GMSK-modulated signal centered at the desired GSM channel frequency. A phase-locked loop circuit is used to translate the GMSK-modulated signal from IF to RF primarily for two reasons: 1.
  • Page 23 3. TECHNICAL BRIEF The amplifier output drives the RF port of the quadrature RF-to-baseband downconverter. The down- converted baseband outputs are routed to low-pass filters (one I and one Q) having pass-band and stop-band characteristics suitable for DS-WCDMA processing. The filter outputs are buffered and passed on to the MSM6275 IC for further processing.

  • Page 24: Lo Phase-Locked Loop

    The RTR6250 UMTS output is routed to its power amplifier through a bandpass filter, and delivers fairly high-level signals that are filtered and applied to the PA. The PA device used in KU950 is “Load Insensitive PA”- no need to use isolator - and routed to the duplexer Tx port directly. Transmit power is delivered from the duplexer to the antenna through the switch module.
  • Page 25 AC-couple the inactive pin to ground using an appropriately valued capacitor (12 pF is used in KU950). The 27 pF capacitor should be used to AC-couple the active pin to the VCO signal. Using only the selected VCO signal, the RFR6250 IC LO generation and distribution circuits create the necessary LO signals for the active quadrature downconverter.
  • Page 26 3. TECHNICAL BRIEF The closed loop will force FV to equal FR when locked. If the loop is not locked the error between FV and FR will create an error signal at the output of the charge pump. This error signal is filtered by the loop filter and applied to the VCO, tuning the output frequency such that the error is decreased.

  • Page 27: Off-Chip Rf Components

    A UMTS duplexer splits a single operating band into receive and transmit paths. Important performance requirements include: -. Insertion loss . this component is also in the receive and transmit paths; In the KU950 typical losses: UMTS Tx = 1.45 dB, UMTS Rx = 1.86 dB.
  • Page 28 3. TECHNICAL BRIEF -. Tx-band isolation . the transmit channel power also leaks into the receiver. In this case, the leakage is outside the receiver passband but at a relatively high level. It combines with Rx band jammers to create cross-modulation products that fall in-band to desensitize the receiver. The required Tx-band isolation depends on the PA channel power and Tx-band losses between the PA and LNA.
  • Page 29 Its detector coupling range and converted voltage is based on diode sensitivity and transmitter power level. The KU950 uses National Semiconductor ADL5500 power detector IC. In Figure 3.5.5-1, R129 is set to 68ohm&Coupler resulting in an attenuation of 31.4dB. The output voltage is proportional to the logarithm of the input power.
  • Page 30 3. TECHNICAL BRIEF 3.5.6 Dual band GSM power amplifier (U101) The SKY77328 is a high-power, high-efficiency power amplifier module with integrated power control that provides over 50dBof control range. The devices is a self-contained 6mm x 6mm module with 50Ω input and output terminals.
  • Page 31 3. TECHNICAL BRIEF 3.5.7 GSM transmit VCO (U102) The dual Tx VCO is a key component within the GSM OPLL. This VCO performance directly impacts PLL and transmitter performance. VCO specifications refer to muRata MQW5V0C869M datasheet. The dual Tx VCO outputs, one for Low-band GSM and one for high band, drive a resistive network that splits the active signal into two signals: 1) the input to the active PA .
  • Page 32 3. TECHNICAL BRIEF Of course, passband ripple and return loss are still important in all cases for the same reasons explained in the antenna switch module and duplexer sections. 3.5.9 VCTCXO (X100) The Voltage Controlled Temperature Compensated Crystal Oscillator (VCTCXO) provides the reference frequency for all RFIC synthesizers as well as clock generation functions within the MSM6275 IC.
  • Page 33 3.5.10 Bluetooth (M100 : LBDA254FJ0, ANT100 ) The MSM6275 includes BT baseband embedded BT 1.1 compliant baseband core, so the other bluetooth components are an bluetooth RF module and Antenna. Figure3.5.10-1 shows the bluetooth system architecture in the KU950. Figure3.5.10-1 Bluetooth system architecture - 34 -...

  • Page 34: Digital Baseband (Dbb / Msm6275)

    3. TECHNICAL BRIEF 3. BB Technical Description 3.6 Digital Baseband (DBB / MSM6275) 3.6.1 General features of MSM6275 device A. Features(MSM6275) • Support for multimode operation - WCDMA(UMTS), GSM/GPRS, EDGE • Support for high-speed downlink packet access (HSDPA) - 1.8 Mbps •...

  • Page 35: Hardware Architecture

    3. TECHNICAL BRIEF 3.7 Hardware Architecture PM6650 USIM BLUETOOTH 18pin MMI 18pin MMI Connector Connector GSM TX GSMQua Receiver Quadband / SPEAKER TX VCO GSM RX 900/1800/1900 1.3M RX FILTER RTR6250 CAMER WCDMA TX MSM6275 UMTS CAMER UMTS (2100) FILTER MAIN UMTS WCDMA RX...
  • Page 36 3. TECHNICAL BRIEF 3.7.1. MSM6275 and supported peripherals Figure. MSM6275 and supported peripherals - 37 -...

  • Page 37: Subsystem Of Msm6275

    3. TECHNICAL BRIEF 3.8. Subsystem of MSM6275 3.8.1. ARM Microprocessor Subsystem The MSM6275 device uses an embedded ARM926EJ-S microprocessor. This microprocessor, through the system software, controls most of the functionality for the MSM device, including control of the external peripherals such as the keypad, LCD, RAM, ROM, and EEPROM devices. Through a generic serial bus interface (SBI) the ARM926EJ-S configures and controls the functionality of the RFL6202, RFR6202, RTR6250, RTR6200, and PM6650 devices.

  • Page 38: Vocoder Subsystem

    3. TECHNICAL BRIEF 3.8.5. Serial Bus Interface (SBI) The MSM6275 device’s SBI is designed specifically to be a quick, low pin count control Protocol for QUALCOMM’s RFL6202, RFR6202, RTR6250, RTR6200, and PM6650 ASICs. Using the SBI, the RTR6250, RFR6200, RFL6200, and PM6650 devices can be configured for different operating modes and for minimum power consumption, extending battery life in standby mode.
  • Page 39 3. TECHNICAL BRIEF 3.8.10. UART There are three UARTs in the MSM6275 ASIC: • UART1 for data • UART2 (can be used for USIM interface) • UART3 (can be used for PM SBI interface) 3.8.11. USB The MSM6275 device integrates a universal serial bus(USB) controller that supports both unidirectional and bidirectional transceiver interfaces.

  • Page 40: External Memory Interface

    • 1GMb NAND flash memory + 512Mb SDRAM (1die) Interface Spec Device Part Name Maker Read Access Time Write Access Time FLASH TY9000A800EOGG Toshiba 35 ns/Bytes 50 ns/Bytes SDRAM TY9000A800EOGG Toshiba 107 ns/4Double Word 53 ns/4Double Word Table. External memory interface for KU950 - 41 -...

  • Page 41: Hardware Sub System

    3. TECHNICAL BRIEF 3.10. Hardware sub system 3.10.1. RF Interface 3.10.1.1. RTR6250 (WCDMA_Tx, GSM_Tx/Rx) MSM6275 controls RF part(RTR6250) using these signals. • SBST,SBDT,SBCK : SBI I/F signals for control Sub-chipset • PA_ON : Power AMP on RF part • RX_I/Q,TX_I/Q : I/Q for Tx/Rx of RF •...
  • Page 42 3. TECHNICAL BRIEF TX_AGC_ADJ TX_AGC_ADJ TRK_LO_ADJ TRK_LO_ADJ TP302 TCXO_EN_GPIO94 TCXO_EN PA_ON0 PA_ON Q_OUT_N TX_QM R318 Q_OUT TX_QP I_OUT_N TX_IM I_OUT TX_IP DAC_REF DAC_REF Q_IM_CH1 Q_IP_CH1 I_IM_CH1 VREG_MSMP_2.7V I_IP_CH1 AA25 Q_IM_CH0 RX_QM Q_IP_CH0 RX_QP AB25 I_IM_CH0 RX_IM AC25 R319 I_IP_CH0 RX_IP 100K GP_PDM2_PA_RANGE1 PA_R0...

  • Page 43: Msm Sub System

    3. TECHNICAL BRIEF 3.10.2. MSM sub system 3.10.2.1. SIM interface SIM interface scheme is shown in Figure. And, there control signals are followed • USIM_CLK : USIM Clock • USIM_Reset : USIM Reset • USIM_Data : USIM Data T/Rx USIM CLK VREG_USIM 2.85V USIM CLK USIM Reset...
  • Page 44 Revision 2.0. The USB Specification Revision 1.1 defines two speeds of operation, namely low-speed (1.5 Mbps) and full-speed (12 Mbps), both of which are supported by the MSM6275. KU950’s USB interface uses the PM6650 internal logic for USB Transceiver. Name...
  • Page 45 3. TECHNICAL BRIEF 3.10.2.4. HKADC (House Keeping ADC) The MSM6275 device has an on-chip 8-bit analog-to-digital converter (HKADC) which is tended to digitize DC signals corresponding to analog parameters such as battery voltage, temperature, and RF power levels. The MSM6275 device has six analog input pins which are multiplexed to the input of the internal HKADC. Figure.

  • Page 46: Power Block

    3. TECHNICAL BRIEF 3.10.3. Power Block 3.10.3.1. General MSM6275A, included RF, is fully covered by PM6650-1M(Qualcomm PMIC). PM6650-1M cover the power of MSM6275A, MSM memory, RF block, Bluetooth, Micro SD, USIM and TCXO. Major power components are : PM6650-1M (U600) : Phone power supply QST4 (Q600,Q601) : External charger supply switching SI3493DV-E3 (Q602) : Main Battery charging control MAX8631XETI (U802) : Camera power supply...
  • Page 47 3. TECHNICAL BRIEF Figure. PM6650-1M Functional Block Diagram - 48 -...
  • Page 48 These pins are connected to the Source (or emitter) and Drain (or collector) contacts of the pass transistor respectively. 3.48V~3.22V 3.71V~3.67V 3.66V~3.49V 4.2V~3.82V 3.81V~3.72V 3~0 (%) 33~16 (%) 16~3 (%) 100~61 (%) 61~33 (%) Figure. KU950 Battery Bar Display (Standby condition) - 49 -...
  • Page 49 3. TECHNICAL BRIEF 3.10.3.3.1 Trickle charging Trickle Charging of the main battery, enabled through SBI control and powered from V , is provided by the PM6650-1M IC, The trickle charger is on-chip programmable current source that supplies current from V to pin (VBAT).
  • Page 50 3. TECHNICAL BRIEF 3.10.3.3.2 Constant current charging The PM6650-1M IC supports constant current charging of the main battery by controlling the charger pass transistor and the battery transistor. The constant current charging continues until the battery reaches its target voltage, 4.2V. 3.10.3.3.3 Constant voltage charging Constant voltage charging begins when the battery voltage reaches a target voltage, 4.2V.
  • Page 51 3. TECHNICAL BRIEF 3.10.4. Keypad KU950 has 20 buttons, 5 tact switches and 3 side keys. Figure shows the Keypad circuit. ‘END’ Key is connected to PM_ON_SW_N to PM6650 and GPIO76 of MSM6275. COL0 COL1 COL2 COL3 COL4 COL5 HOT900...

  • Page 52: Camera Interface

    3. TECHNICAL BRIEF 3.10.5 Camera interface KU950 has two cameras : 1.3M Pixel CMOS and VGA Pixel CMOS Camera Below figures shows the camera board to board connector and camera I/F signal. 3.10.5.1 1.3 Mega Camera Interface VCAM_1.8V VCAM_2.8V C804 4.7u...
  • Page 53 3. TECHNICAL BRIEF The 1.3MCamera module is connected to main board with 26pin Board to Board connector (AXK826145). Actually, there is a linking FPCB to connect camera module to the main board. Its interface is dedicated camera interface port in MSM6275. The camera port supply 24MHz master clock to camera module and receive 12MHz pixel clock (30fps), vertical sync signal, horizontal sync signal, reset signal and 8bits data from camera module.
  • Page 54 3. TECHNICAL BRIEF 3.10.5.2 VGA Camera Interface VCAM_2.8V CN800 FB800 R800 VC_IO_OFF R801 FILTER_CAM_SYSCLK V_CAM_RESET_N FILTER_CAM_PCLK VGA_I2C_SCL C801 C802 CAM_DATA[0] VGA_I2C_SDA CAM_DATA[1] CAM_DATA[2] FILTER_CAM_HSYNC CAM_DATA[3] CAM_VSYNC CAM_DATA[4] CAM_DATA[7] CAM_DATA[5] CAM_DATA[6] VGA CAMERA CONNECTOR The VGA Camera module is connected to main board with 20pin Board to Board connector (AXK720145).
  • Page 55 3. TECHNICAL BRIEF 3.10.5.3 LCD backlight / Flash LED / Camera LDO U802(MAX8631XETI) is a charge pump and supply a power of mega camera, VGA camera and camera flash LED. U802 is controlled by GPIOs of MSM6275. +VPWR U802 MAX8631XETI C809 C810 R811...
  • Page 56 3. TECHNICAL BRIEF 3.10.6 Folder on/off operation There is a magnet to detect the folder status, opened or closed. If a magnet is close to the hall-effect switch, the voltage at pin1 of U901 goes to 0V. Otherwise, 2.7V. This folder signal is delivered to MSM6275 GPIO43. VREG_MSMP_2.7V R923 A3212EELLT-T...

  • Page 57: Keypad Backlight

    3. TECHNICAL BRIEF 3.10.7. Keypad backlight There are 10 White LEDs on Top side of Main PCB and 6 White LEDs on Top side of key PCB in board backlight circuit and, which are driven by KEYBD_BACKLIGHT line form PM6650. Key Pad backlight controlled by PM6650.

  • Page 58: Lcd Module

    3. TECHNICAL BRIEF 3.10.8. LCD module EBI2_ADDR[1] EBI2_ADDR[1] MSM_LCD_ADS_N MM_LCD_ADS_N MM_LCD_CS_N TCC_CS_N TCC_CS_N MM_LCD_WE_N EBI2_WE_N EBI2_WE_N EBI2_OE_N EBI2_OE_N MSM6275 TCC7820 MM_LCD_DATA[0:15] LCD_BYPASS_EN LCD_BYPASS_EN EBI2_DATA[0:15] EBI2_DATA[0:15] MM_LCD_RD_N MM_LCD_VSYNC MM_LCD_RESET Figure. LCD Module Block Diagram MAIN LCD MODULE 260K Color TFT 240 * 320 Pixel BD663474(Hitachi) Graphic Controller Driver Main LCD Panel Figure.
  • Page 59 3. TECHNICAL BRIEF 3.10.9. Display & LCD FPC Interface LCD module is connected to Main board with 40-pin Wire connector. The LCD is controlled by 16-bit EBI2 in MSM6275.The 16-bit EBI2 Data from LCD go into the SH-mobile chip(U300) and the SH-mobile chip transfer the data to MSM6275. EBI2_DATA[1:8] EBI2_DATA[1:8] TCC7820...

  • Page 60: Audio And Sound

    3. TECHNICAL BRIEF 3.10.10. Audio and sound 3.10.10.1 Overview of Audio & Sound path Head Set Jack Head_Set LCD Conn Receiver MSM6275A (U300-1) SPEAKE Speaker Head Set Headset MIC Jack Figure. Block diagram ofaAudio &sSound path - 61 -...
  • Page 61 3. TECHNICAL BRIEF 3.10.10.2. Audio signal processing & interface The MSM6275 device integrates a wideband audio CODEC into the mobile station modem. The wideband codec allows the MSM device to support stereo music/ringer Melody applications in addition to the 8 kHz voice band applications on the forward link.
  • Page 62 3. TECHNICAL BRIEF MSM6275A BLK MIC_Feedback MICFBP MICINN R303 C301 0.1u C302 0.1u MICOUTP 180K C300 R305 C305 0.015u R306 470K C306 0.015u R307 C307 C308 C309 R308 MICOUTN C314 C310 0.1u C311 0.1u 0.1u 180K Near to MSM MICINP MICFBN SDCC_DAT1_GPIO99 SDCC_DAT2_GPIO100...
  • Page 63 3. TECHNICAL BRIEF Handset main MIC BLK MICBIAS C102 C103 SP0204LE5-PB MIC1N C104 C106 C105 MIC1P MIC100 R116 R117 C107 C108 R118 C109 Audio Amp for loud Speaker +VPWR C718 1608 R707 C720 R708 U702 LM4898ITLX-NOPB FB701 SPEAKER+ => Speaker FB703 R710 3.9K...
  • Page 64 3. TECHNICAL BRIEF 3.10.11. Micro SD MSM6275 BLK SDCC_DAT1_GPIO99 SDCC_DAT2_GPIO100 LCD_IF_MODE_1 SDCC_DAT3_GPIO101 MMC_CD MDP_VSYNC_SECONDA_GPIO104 LCD_BYPASS_ENABLE R315 MDP_VSYNC_PRIMARY_GPIO105 MM_LCD_VSYNC Micro SD BLK <= from PM6650 VREG_MMC_3.0V S100 D100 DAT2_RSV CD_DAT3_CS MMC_CD CMD_DI MMC_CD MMC_CMD MMC_CMD CLK_SCLK MMC_CLK DAT0_DO MMC_DATA MMC_CLK MMC_DATA DAT1_RSV PLR0504F R109...

  • Page 65: Dvb-H System

    3. TECHNICAL BRIEF 3.11 DVB-H System 3.11.1. DVB-H Block Diagram DVB-H system block diagram is shown in the figure below. You can see the flow of DVB-H signal by the below figure. First of all, you can see the antenna &...
  • Page 66 3. TECHNICAL BRIEF DVB-H ANT GSM Rejection Filter MSM6275 DVB-H Tuner DVB-H Demodulator SRAM DVB-H Signal Path Figure. DVB-H Signal Path & Components - 67 -...
  • Page 67 3. TECHNICAL BRIEF 3.11.2. GSM Rejection Filter (FL200) GSM rejection filter is placed between antenna and tuner. The filter is a type of BPF(Band Pass Filter) and has pass-band from 470MHz to 702MHz. This filter is used protect DVB-H signal from GSM interference which is near by DVB-H band.
  • Page 68 3. TECHNICAL BRIEF 3.11.4. DVB-H Demodulator (U201) The DIB7000-H 2k/4k/8k COFDM demodulator Integrated Circuit (IC) uses the state of the art Signal Processing to offer high performance for mobile, portable and fixed reception of Digital Terrestrial Television signals compliant with DVB-H standard. Dual AGC BB/RF is implemented in order to offer very high dynamic range control through digital.
  • Page 69 3. TECHNICAL BRIEF Figure. DIB7000HB Functional Block Diagram - 70 -...
  • Page 70 3. TECHNICAL BRIEF 3.11.5. DVB-H interface DVB-H interface block diagram is shown in below Figure. In the DVB-H system, DSP & MSM both are related to control the demodulator, and demodulator control the operation of tuner. Each interface is shown in below figure. Each control signals are explained in table Name Note...
  • Page 71 3. TECHNICAL BRIEF 3.11.5.1. Radio performance of DVB-H receiver Item Specification Receive Frequency 470 ~ 702 MHz Reference BER < 2*10 when Î = -86.4 dBm / 7.61 MHz Sensitivity Level modulation = 16QAM code rate = , guard interval = Maximum BER <...

  • Page 72: Main Features Of Ku950

    3. TECHNICAL BRIEF 3.12 Main features of KU950 - Bar Swing Type - WCDMA(2100) + GSM(900,1800) + PCS(1900) Triple mode - Main LCD: 320*240, 262K (2.4”) - 1.3M Pixel CMOS Camera - VGA CMOS Camera - φ17 speaker - Stereo Headset - Video telephony in WCDMA with camera - HSDPA up to 1.8Mbps...
  • Page 73 3. TECHNICAL BRIEF 2. Main Components of KU950 MAIN Top Side MAIN Bottom Side KEY Top Side KEY Bottom Side VGA camera Intenna & Speaker 1.3M camera LCD & LCD BíD - 74 -...
  • Page 74 3. TECHNICAL BRIEF 2.1. Main Top Side U103 FL103 U101 FL100 U100 U102 LD900 Side Key U901 U702 CN901 U203 CN601 U703 U701 U602 Reference Description Reference Description U103 PAM (WCDMA) U701 AUDIO CODEC FL103 DUPLEXER U101 (QUAD BAND GSM AND GPRS) VCO (824MHz ~ 915MHz, FL100 SEPERATOR...
  • Page 75 3. TECHNICAL BRIEF 2.2. Main Bottom Side SW100 CN802 SW200 CN600 U107 FL802 CN800 U802 X100 U800 U600 CN801 X400 FL200 U300 U403 U200 X201 X200 J500 U500 U201 U400 U204 CN500 Reference Description Reference Description CN802 1.3M Camera Connector SW100 RF Switch CN600...
  • Page 76 3. TECHNICAL BRIEF 2.3. KEY Top Side Metal DOME SW100 2.4. KEY Bottom Side CN100 BAT100 S100 M100 D100 MIC100 ANT100 Reference Description Reference Description BAT100 Backup Battery SW100 Joy Stick M100 Bluetooth RF Module CN100 Main To KEY B To B Connector MIC100 Microphone ( SMD ) S100...
  • Page 77 3. TECHNICAL BRIEF 2.5. SUB_LCD Bottom Side Receiver PAD Vibrator PAD CN101 CN100 Reference Description Reference Description Main To LCD_SUB B To B Vibrator Vibrator PAD CN101 Connector LCD_SUB To LCD B To B Receiver Receiver PAD CN100 Connector - 78 -...

  • Page 78: Trouble Shooting

    4. TROUBLE SHOOTING 4. TROUBLE SHOOTING 4.1 RF Component U105 FL103 U103 U101 FL101 FL100 U106 U100 U102 RF component (Top) Reference Description Reference Description U103 WCDMA PAM U105 Coupler FL103 WCDMA Duplexer U101 GSM/D/PCS PAM FL101 WCDMA TX SAW U106 HDET FL100...
  • Page 79 4. TROUBLE SHOOTING SW100 FL102 U107 X100 RF component (Bottom) Reference Description SW100 RF ANT Conductor FL102 WCDMA RX SAW U107 RFR6250(WCDMA RX) X100 19.2M X-TAL - 80 -...

  • Page 80: Signal Path

    4. TROUBLE SHOOTING 4.2 SIGNAL PATH GSM/DCS/PCS Rx Tx PATH A. GSM/DCS/PCS Rx PATH B. GSM/DCS/PCS Tx PATH - 81 -...
  • Page 81 4. TROUBLE SHOOTING WCDMA RX/ TX PATH C. WCDMA Rx PATH D. WCDMA Tx PATH - 82 -...

  • Page 82: Checking Vcxo Block

    4. TROUBLE SHOOTING 4.3 Checking VCXO Block The reference frequency (19.2MHz) from X100 (VCXO) is used WCDMA TX part, GSM part and BB part. - 83 -...
  • Page 83 4. TROUBLE SHOOTING Check 1. Crystal part If you already check this crystal part, you can skip check 1. Test Point (Crystal Part) VREG_BT_2.85V VREG_TCXO_2.85V C157 C158 C159 1000p 1000p 0.1u R127 19.2MHz 100K X100 C162 1000p C163 R128 TCXO_BT TRK_LO_ADJ VCONT 1000p...
  • Page 84 4. TROUBLE SHOOTING Check TP1 VCC of VCXO VCC ≥ 2.8V Check PMIC Check TP2 TRK_LO_AD J 3V≥Voltage≥0V Check MSM Check TP3 With Oscilloscope Check soldering 19.2MHz Signal and components VCXO is OK Check other part - 85 -...

  • Page 85: Checking Ant. Switch Module Block

    4. TROUBLE SHOOTING 4.4 Checking Ant. Switch Module Block Antenna Switch Block(Top) ANT100 OUT100 ANT101 R101 KMS-507 L101 SW100 C102 R199 2.7nH L102 L103 C101 100nH FL100 LMSP54MA-543 GSM900_RX1 ANT_SEL0 GSM900_RX2 ANT_SEL1 ANT_SEL2 GSM1800_RX1 GSM1800_RX2 C105 C106 C107 GSM1900_RX1 GND1 GSM1900_RX2 GND2 GND3...
  • Page 86 4. TROUBLE SHOOTING Logic Table of the Antenna Switch Mode ANT_SEL0 ANT_SEL1 ANT_SEL2 EGSM TX HIGH HIGH EGSM RX HIGH DCS/PCS TX HIGH DCS RX HIGH HIGH PCS RX HIGH UMTS HIGH HIGH Checking Switch Block power source Check Soldering of ANT_SEL0, 1, 2 High Level Check VCC 2.5V <...

  • Page 87: Checking Wcdma Block

    4. TROUBLE SHOOTING 4.5 Checking WCDMA Block START 1. Check VCXO 19.2MHz 2. Check ANT. SW Module ANT_SEL0, 1, 2 3. Check RF Tx Level 4. Check PAM Block 5. Check RF Rx Level 6. Re-download SW & CAL. - 88 -...
  • Page 88 4. TROUBLE SHOOTING 4.5.1. Checking VCXO Block Refer to 4.3 4.5.2. Checking Ant. SW module Refer to 4.4 4.5.3. Checking RF TX Level Test Point (RF TX Level) - 89 -...
  • Page 89 4. TROUBLE SHOOTING ANT100 OUT100 ANT101 R101 L101 KMS-507 SW100 C102 R199 2.7nH L102 L103 C101 100nH FL100 LMSP54MA-543 GSM900_RX1 ANT_SEL0 GSM900_RX2 ANT_SEL1 ANT_SEL2 GSM1800_RX1 GSM1800_RX2 C105 C106 C107 GSM1900_RX1 GND1 GSM1900_RX2 GND2 GND3 GSM1800_1900TX GND4 GSM900TX VREG_RFRX_1_2.85V GND5 UMTS2 L111 10nH GND6...
  • Page 90 4. TROUBLE SHOOTING For testing, Max power output is needed. Set the Phone Tx is ON and PDM is 450 Check TP1 RF Tx Level is OK Over 21dBm ? Check TP2 Check FEM Over 19dBm ? Check TP3 Check Duplexer Over 16dBm ? Check TP4 Check PAM Block...
  • Page 91 4. TROUBLE SHOOTING 4.5.4. Checking PAM Block PAM control signal PA_ON : WCDMA Tx Power Detect IC(HDET) Enable PA_RO: WCDMA Tx Power Amp Gain Control PA_ON must be HIGH(over 2.5V) PA_FET_N must be LOW if the max Tx power is set (lower than 0.5V) - 92 -...
  • Page 92 4. TROUBLE SHOOTING PAM IN/OUT Signal PAM OUT must be over 16dBm PAM IN must be over -5dBm - 93 -...
  • Page 93 4. TROUBLE SHOOTING 4.5.5. Check RF Rx Level Test Point (RF Rx Level) - 94 -...
  • Page 94 4. TROUBLE SHOOTING ANT100 OUT100 ANT101 R101 L101 KMS-507 SW100 C102 R199 2.7nH L102 L103 C101 100nH FL100 LMSP54MA-543 GSM900_RX1 ANT_SEL0 GSM900_RX2 ANT_SEL1 ANT_SEL2 GSM1800_RX1 GSM1800_RX2 C105 C106 C107 GSM1900_RX1 GND1 GSM1900_RX2 GND2 GND3 GSM1800_1900TX GND4 GSM900TX VREG_RFRX_1_2.85V GND5 UMTS2 L111 10nH GND6...
  • Page 95 4. TROUBLE SHOOTING Set the Phone Rx is ON Check BIAS Check bias block Over 2V ? soldering Check TP1 Check RF s/w Signal exist? Check TP2 Check FEM Signal exist? Check TP3 Check Duplexer Signal exist? Check TP4 Check RFR6250 Signal exist? Change the board - 96 -...

  • Page 96: Checking Gsm Block

    4. TROUBLE SHOOTING 4.6 Checking GSM Block START 1. Check TXVCO Block 2. Check ANT. SW Module 3. Check Tx PAM Block 4. Check RF Rx Level 5. Re-download SW & CAL. - 97 -...

  • Page 97: Checking Vco Block

    4. TROUBLE SHOOTING 4.6.1. Checking VCO Block Test Point (TXVCO LEVEL) R109 (PPS) (2012) C125 C126 C127 120p 1000p 8200p R112 R114 R115 R116 C132 FB100 1005/600 ohm VREG_RFTX_2.85V 0.5p C134 U102 R117 100ohm GSM_TX_VCO_0_EN_N OUT_GSM GSM_TX_VCO_1_EN_N OUT_DCSPCS R118 100ohm R119 C136 C137...
  • Page 98 4. TROUBLE SHOOTING - 99 -...

  • Page 99: Checking Rf Tx Level

    4. TROUBLE SHOOTING 4.6.2 Checking Ant. SW Module Refer to chapter 3.4 4.6.3 Checking RF Tx level Test Point (RF Tx Level) ANT100 OUT100 ANT101 R101 L101 KMS-507 SW100 C102 R199 2.7nH L102 L103 C101 100nH FL100 LMSP54MA-543 GSM900_RX1 ANT_SEL0 GSM900_RX2 ANT_SEL1 ANT_SEL2...
  • Page 100 4. TROUBLE SHOOTING START Check TP1 GSM/DCS/PCS If GSM over 31dBm ? Tx is Ok If DCS/PCS over 28dBm ? Check other part Check TP2, TP3 Check ANT. SW If TP2 over 29dBm ? Module If TP3 over 25dBm ? Refer to chapter 3.4 Check PAM Block Check TXVCO...

  • Page 101: Checking Pam Block

    4. TROUBLE SHOOTING 4.6.4 Checking PAM Block PAM Control Signal TP1. GSM_PA_RAMP : Power Amp Gain Control. typically, 0.5V < Vapc < 2.6V, TP2. GSM_PA_EN : Power Amp Enable (Power ON : higher than 2.5V , Power OFF : lower than 0.7V) TP3.

  • Page 102: Checking Rf Rx Block

    4. TROUBLE SHOOTING 4.6.5 Checking RF Rx Block Test Point (RF Rx Level) PCS RX 1930-1990 MHz L106 1.8nH L108 1.2p L109 1.8nH VREG_RFTX_2.85V DCS RX C108 R102 R103 4.7K 4.3K L112 4.7nH 1805-1880 MHz C110 C111 680p 6.8n (PPS) (2012) L113 CP2_OUT...
  • Page 103 4. TROUBLE SHOOTING Set the Phone Rx is ON Check Resoldering soldering Check Change FEM & buffer FEM & buffer Change the board - 104 -...

  • Page 104: Bluetooth Rf Block

    : Enter Test Mode(7973845#*#) → Module Test Set → BT DUT → BT DUT ON 2. Connect phone to bluetooth tester 3. Set channel to 39 4. Measure output-power 5. Check TP1 : output-power > -6 dBm < KU950 Sub Key < KU950 Main Board Bluetooth Module > Bluetooth Buffer > - 105 -...
  • Page 105 4. TROUBLE SHOOTING VREG_BT_2.85V VREG_BT_2.85V C113 C114 C115 C116 C117 C118 0.01u 0.01u BLUETOOTH M100 LG INNOTEK LBDA254FJ0 ACS2450ICAU92 R119 SBST BT_SBST GND2 FEED SBCK BT_SBCK GND1 SBDT BT_SBDT ANT100 SYNC_DET_TX_EN BT_TX_RX_N R120 RX_BB_TX_BB BT_DATA C112 1000p LDO1 XTAL_IN TCXO_BT...
  • Page 106 4. TROUBLE SHOOTING Set the Phone Rx is ON Check BT Antenna TP1 < -6dBm soldering TP2 > 2.5V Replace PCB TP3 > 2.8V Replace PMIC @TP4 @TP5 Replace PCB 19.2MHz ? 19.2MHz ? Replace BT module Change U104 (M100) - 107 -...

  • Page 107: Power On Trouble

    4. TROUBLE SHOOTING 4. BB Trouble Shooting 4.8 Power on trouble Power on sequence of KU950 is : PWR(END) key press → PM_ON_SW_N go to low(VA100),PM6650-1M KPDPWR_N pin(24) → PM6650-1M Power Up → VREG_MSMC_1.25V(C627), VREG_MSME_1.8V(C628), VREG_MSMP_2.7V(C620), VREG_MSMA_2.6V(C619), VREG_TCXO_2.85V(C178) power up and system reset assert to MSM →...
  • Page 108 4. TROUBLE SHOOTING VREG_MSME_1.8V VREG_TCXO_2.85V VREG_MSMC_1.25V VREG_MSMA_2.6V (C628) (C178) (C627) (C619) X100 X600 PS_HOLD VREG_MEMP_2.7V (D601) (C620) - 109 -...

  • Page 109: Usb Trouble

    4. TROUBLE SHOOTING 4.9 USB trouble USB Initial sequence of KU950 is : USB connected to KU950 → USB_VBUS(D501 Pin_4) go to 5V → USB_D+(D501 Pin_1) go to 3.3V → 48M Crystal on → USB_DATA is triggered → USB work. Start...

  • Page 110: Sim Detect Trouble

    4. TROUBLE SHOOTING 4.10 SIM detect trouble USB Initial sequence of KU950 is : VREG_USIM_2.85V(C625 of PM6650) go to 2.85V → USIM clock, reset and data triggered → USIM IF work (Schematic and place are refer to SIM technical brief)

  • Page 111: Key Sense Trouble

    4. TROUBLE SHOOTING 4.11 Key sense trouble Key Sense sequence of KU950 is : Default condition ROW(0-2) is 2.7V → Press the key → Corresponding ROW(x) and COL(x) go to 0V → Key sensing START Check the R900,R901 R902 with no key press...

  • Page 112: Camera Trouble

    4. TROUBLE SHOOTING 4.12 Camera trouble Camera control signals are generated by MSM6275 and directly connected with MSM6275. KU950 has two cameras. The one is a 1.3 Mega Camera, the other is VGA camera. START Check the camera conn. and...

  • Page 113: Main Lcd Trouble

    4. TROUBLE SHOOTING 4.13 Main LCD trouble Main LCD control signals are generated by MSM6275. Those signal’s path are : MSM6275 → U403(TCC7820 MMC) → CN801 → Wire Ass’y → LCD PCB connector → LCD PCB & Module START Press END key to turn the power on Follow the Power ON Is the circuit powered?
  • Page 114 4. TROUBLE SHOOTING LCD Control data flow 40 pin Wire A'ssy LCD Module LCD Module 40 pin Wire A'ssy connector LCD control data flow LCD connection Main - 115 -...

  • Page 115: Keypad Backlight Trouble

    4. TROUBLE SHOOTING 4.14 Keypad backlight trouble Key Pad Back Light is on as below : Key pressing → KYPD_LED_EN go to Low → LED On Key Pad LED controlled by PM6650. Start Key press Check LD900~910 (Main) Signal VPWR is OK? and R100~103 (Key) Signal KYPD_LED_EN is OK?

  • Page 116: Folder On/Off Trouble

    4. TROUBLE SHOOTING 4.15 Folder on/off trouble Folder On/Off(Close/Open) is worked as below : Folder On/Off Event → Flip(U901 pin 1,key board) is triggered(Open : about 2.6V, Close : 0V) → MSM6275 Sense the Folder Flip Event. Sensing signal is directly connected to MSM6275. Start Check the magnet in Insert the magnet...

  • Page 117: Micro Sd Trouble

    4. TROUBLE SHOOTING 4.16 Micro SD trouble Micro SD is worked as below : Micro SD insertion → VREG_MMC_3.0V is 3.0V → MMC_CD go to High → Micro SD insertion detecting by GPIO101 of MSM6275 → go working Start Check the connector (MAIN TO KEY) Insert the Trans Flash Card Check the R101~R104 for VREG_MMC_3.0V,...

  • Page 118: Audio Trouble

    4. TROUBLE SHOOTING 4.17 Audio trouble 4.17.1. Receiver path Voice Receiver path as below: MSM6275A Ear1ON/Ear1OP → CN801(b’d to b’d connector for LCD Module) → CN101(LCD b’d to b’d connector of LCD FPCB) → R100, R101 → Receiver Start Connect the phone to network Equipment and setup call Setup 1KHz tone out Hear the tone to the receiver...
  • Page 119 4. TROUBLE SHOOTING Receiver LCD connector #3, #4 pin of CN801 R100, R101 - 120 -...
  • Page 120 4. TROUBLE SHOOTING 4.17.2. Voice and sound path for headset Voice and Multimedia Sound path for Head_Set as below: MSM6275A HPH_R, HPH_L → C709,C710 near the U701 (audio codec) → C719, C732 near the U703 ( Headphone AMP ) → FB702, FB704 → R709,R712 → #4, #5 pin of CN601 headset Jack Start Connect the phone to network Equipment and setup call...
  • Page 121 4. TROUBLE SHOOTING C732 C719 CN601 C710 C709 R712, R709 (receiver signal serial resistor) U703 (Headphone AMP) U701 Audio codec - 122 -...
  • Page 122 4. TROUBLE SHOOTING 4.17.3. Loud speaker path (voice speaker phone, VT, multimedia play, etc) Loud speaker path as below: MSM6275A HPH_R, HPH_L → C709,C710 → U701 ( audio codec) → R710, R711 → U702 (Speaker AMP) → FB701, FB703 → Speaker Start Connect the phone to network Equipment and setup call...
  • Page 123 4. TROUBLE SHOOTING U702 (Speaker Amp) FB703 FB701 R711 R710 C710 C709 C723 C722 Pads of Speaker - 124 -...
  • Page 124 4. TROUBLE SHOOTING 4.17.4. Microphone for main MIC Main Microphone path as below: MIC → C104,C105 → MSM6275A → MIC feed back gain logic → MSM internal CODEC MICBIAS C102 C103 SP0204LE5-PB MIC1N C104 C106 C105 MIC1P MIC100 R116 R117 C107 C108 R118...
  • Page 125 4. TROUBLE SHOOTING C104 C105 MIC100 (MIC for Handset) C102 (+) C308 C307 - 126 -...
  • Page 126 4. TROUBLE SHOOTING 4.17.5. Microphone for headset MIC for Head_Set path as below: Insert Headset → EAR_SENSE_N(pin8) go 0V → MSM6275A sense Head_Set insertion → MIC signal go to MSM(C304). MMI 18Pin CONNECTOR VREG_MSMP_2.7V CN601 EAR_MIC_P MIDI_EAR_L MIDI_EAR_R RMT_INT/USB_D+ RMT_ADC/USB_D- EAR_SENSE_N VBATT FL600...
  • Page 127 4. TROUBLE SHOOTING #8 pin of ear connector to check EAR_SENSE_N C633 Capacitor to check MIC bias (1.8V) C304 for MIC serial capacitor - 128 -...

  • Page 128: Charging Trouble

    4. TROUBLE SHOOTING 4.18 Charging trouble USB_VBUS Charging Current Flow USB Cable (5.0V) Q600 QST4 Pass control Tr (ON) Q600 USB Charging control USB_CNT_N +5V_PWR (4.6V) Q601 QST4 Pass control Tr (ON) Q601 TA Charging control CHG_CNT_N ICHARGE Charging current sensing +VPWR ICHARGEOUT...
  • Page 129 4. TROUBLE SHOOTING Start Check the pin and battery Connect terminals of I/O connector Connection OK? Change I/O connector Is the TA voltage 4.6V? Change TA/USB cable Is the USB voltage 5.0V? Check the Q600,Q601,Q602 Charging OK? Change the board - 130 -...
  • Page 130 4. TROUBLE SHOOTING VBAT Q602 Q601 Q600 - 131 -...

  • Page 131: Dvb-H Broadcasting Signal Reception Trouble

    4. TROUBLE SHOOTING 4.19 DVB-H broadcasting signal reception trouble Go into the Broadcasting Mode Check DVB-H Antenna Check the Antenna or replace Antenna contact point 1.6V<TP1 <2.0V 2.5V<TP2 <2.9V Check the LDO & replace 1.0V<TP3 <1.4V not working LDO 2.5V<TP4 <2.9V @TP5 Replace X200 30MHz?
  • Page 132 4. TROUBLE SHOOTING 4.19.1. Checking DVB-H Power Block +1.8V_SRAM +VPWR +VPWR +2.7V_DIB_RF U202 U203 VOUT VOUT DIB_PWR_EN DIB_PWR_EN R1114N181D-TR-F R1161N271D-TR-F R220 C259 C260 C261 C262 1608 1608 1608 +1.8V_SRAM +2.7V_DVB_RF TCC_1.8V_SDR +VPWR U205 U206 VOUT VOUT DIB_PWR_EN DIB_PWR_EN R1131N121D-TR-F R1114N271D-TR-F C264 C265 C266...
  • Page 133 4. TROUBLE SHOOTING 4.19.2. Checking DVB-H Demodulator R204 VDDXO 1608 1% VDDXI X200 XOUT PLL_VCC 30MHz PLL_GND EXXY0015502 C223 C224 CLK_SEL FA-238_30MHz IO_CLK C225 XENA VINNI 0.1u VINPI C232 VINNQ 0.1u VINPQ C233 VREFN VREFP C234 0.1u 0.1u +1.2V_DIB_A +2.7V_DIB_A C235 0.1u AVDD1...

  • Page 134: Vibrator Trouble

    4. TROUBLE SHOOTING 4.20 Vibrator trouble Vibrator control signal (MOTOR_PWR-) is generated by PM6650. That signal’s path is : Pin 25 of PM6650 → CN801 PIN 36 of Main PCB → CN101 PIN 36 of LCD Sub PCB → TP103 of LCD Sub PCB Start The vibrator Donít working?

  • Page 135: Download

    LGMDP is designed to be simple to use and easy enough for the beginner to upload executable images to the handset. LGMDP supports Windows 2000/XP where the LG (Ver 4.6 or later) USB modem driver is installed. 5.2 Downloading Procedure 5.2.1 Setup Preferences...

  • Page 136: Connecting To Pc

    5. DOWNLOAD 5.2.2 Connecting to PC Click on the Select Port and then Select Port window will be pop up. Check if state shows Enable for the port to be connected for downloading images. Then click on the Connect button. (The port number(COM14) shall be different from that of the port number in the snapshot.) - 137 -...
  • Page 137 5. DOWNLOAD The status Ready is displayed when the application is ready for downloading. While the images are transmitted from PC to the handset, a progressive bar indicating the degree of transmission of data is displayed. The following slide describes how to use or set options in detail. - 138 -...
  • Page 138 5. DOWNLOAD 1) Image Folder indicates root path where all image files are placed. To change location of the default image path, select Browse... button. The edit box shows the file path where new images are located. Please note that all images should be located in a selected folder. ( This program support the automatically loading image for some models based on MSM6275) 2) Click on the Browse...
  • Page 139 5. DOWNLOAD 5.2.3 Choosing image files Select the image folder, where all the image files are located, by clicking on the Browse... button. (The folder name shall be different from that of the folder name in the snapshot. The folder name indicates the path where the image files are located.) ★...
  • Page 140 5. DOWNLOAD ★ If you select the image folder, the program will automatically load images accordingly. Automatically load images ★ If you want to download the Flexible logo image, click the “Browse...” button and select image file - 141 -...
  • Page 141 5. DOWNLOAD ★ If NV restore is failed, then the NV data(*.nv2) is erased permantly. In this case, choose the desired NV file to be downloaded on the handset. If you want to download the NV data, click the “Browse...” button and select data file Caution) Error message will show if you choose improper folder like this.
  • Page 142 5. DOWNLOAD 5.2.4 Downloading • This message box informs that a new file for NV backup will be created in the displayed file name in the LGMDP installation directory. • Backing up NV data and backed up NV data will be stored in the LGMDP installation directory.
  • Page 143 5. DOWNLOAD • Writing the AMSS modem image from SDRAM to Flash memory. • Downloading Flexible logo. • Rebooting the handset and re-establishing the connection. • Restoring NV data which backed up in the Backing up process. User can also restore NV data using NV Default image selection.
  • Page 144 5. DOWNLOAD • Rebooting the handset and re-establishing the connection. • Erasing the existing directories and files before downloading the selected Media image. • Downloading Media image in progress. • Downloading Module image in progress. - 145 -...
  • Page 145 5. DOWNLOAD • Rebooting the handset and re-establishing the connection. • Downloading process has completed successfully. - 146 -...
  • Page 146 5. DOWNLOAD 5.2.4 Tools Device Manager allows to monitor current hardware that is installed on your PC. Device Manager is designed to monitor USB connectivity and check where the COM has been installed . Select Device Manager from the Tools of the file menu. - 147 -...
  • Page 147 5. DOWNLOAD Log Extractor is designed to extract log information from handset and store log related files in the selected root path in PC. This function is very useful for debugging. Select Log Extractor from the Tools of the file menu, and connect the phone with LGMDP by clicking on the Connect button. When clicking on the Connect button, this checks if the appropriate files such as LGAPP/RecMngr.bin, err directory, Debugging_Tip.txt, or Hidden_info.bin are placed on the handset.

  • Page 148: Troubleshooting Download Errors

    5. DOWNLOAD 5.3 Troubleshooting download errors 1) When the phone does not work ➜ Reboot the phone as the emergency mode (keep pressing “2” and “5” key while the phone is being booted). and then try to download the images again. ★...
  • Page 149 5. DOWNLOAD ➜ Select the image folder, where all the image files are located, by clicking on the Browse... button. And start downloading the selected images. - 150 -...
  • Page 150 5. DOWNLOAD 2) NV Restore Error ➜ Connect to the phone. - 151 -...
  • Page 151 5. DOWNLOAD ➜ Click on ‘Cancel’. ➜ Click on ‘NV Restore’ then several NV Backup files(*.nv2) are shown. ★ The files are saved every NV Backup. The name is based on the time when NV Backup is done.) - 152 -...
  • Page 152 5. DOWNLOAD ➜ Select the proper file and click on ‘Restore’. ➜ If you want image download and NV backup file restore at once, use the NV Default function. - 153 -...
  • Page 153 5. DOWNLOAD ➜ Start download the selected images. - 154 -...

  • Page 154: Caution

    5. DOWNLOAD 5.4 Caution 1) Multi-downloading using the USB hub is not recommendable. 2) If you see the message ‘cal mode’ after ‘completing download’, you must do NV restore and image (media and module) download. 3) In emergency mode, you can not download the media and module image. So if you want download media and module image, connect the phone normal mode after emergency mode download, and then you can do it.

  • Page 155: Block Diagram

    6. BLOCK DIAGRAM 6. BLOCK DIAGRAM 6.1 GSM & WCDMA RF Block Fig 2.1-1.UMTS-2100 + EGSM-900/DCS-1800/PCS-1900 RF Functional Block Diagram - 156 -...
  • Page 156 6. BLOCK DIAGRAM Table 2.1-1. RF Block Component - 157 -...

  • Page 157: Interface Diagram

    6. BLOCK DIAGRAM 6.2 Interface Diagram KU950 Interface Diagram - 158 -...
  • Page 158 6. BLOCK DIAGRAM Main RF signal (black) GSM TX : GSM Tx RF signal GSM RX : GSM Rx RF signal DCS TX : DCS Tx RF signal DCS RX : DCS Rx RF signal PCS TX : PCS Tx RF signal PCS RX : PCS Rx RF signal UMTS TX : UMTS Tx RF signal UMTS RX : UMTS Rx RF signal...
  • Page 159 6. BLOCK DIAGRAM *Top Side - 160 -...
  • Page 160 6. BLOCK DIAGRAM *Bottom Side - 161 -...
  • Page 161 - 162 -...

  • Page 162: Circuit Diagram

    R&D CHK: Size: Size: TITLE: TITLE: C196 TCXO_OUT DOC CTRL CHK: DOC CTRL CHK: 1000p KU950 Main 1.1 MFG ENGR CHK: MFG ENGR CHK: Changed by: Changed by: Date Changed: Date Changed: Time Changed: Time Changed: QA CHK: QA CHK:...
  • Page 163 DEVELOPMENT GROUP 1 R&D CHK: R&D CHK: Size: Size: TITLE: TITLE: DOC CTRL CHK: DOC CTRL CHK: KU950 Main 1.1 MFG ENGR CHK: MFG ENGR CHK: Changed by: Changed by: Date Changed: Date Changed: Time Changed: Time Changed: QA CHK:...
  • Page 164 DEVELOPMENT GROUP 1 R&D CHK: R&D CHK: Size: Size: TITLE: TITLE: DOC CTRL CHK: DOC CTRL CHK: KU950 Main 1.1 MFG ENGR CHK: MFG ENGR CHK: Changed by: Changed by: Date Changed: Date Changed: Time Changed: Time Changed: QA CHK:...
  • Page 165 DEVELOPMENT GROUP 1 R&D CHK: R&D CHK: Size: Size: TITLE: TITLE: DOC CTRL CHK: DOC CTRL CHK: KU950 Main 1.1 MFG ENGR CHK: MFG ENGR CHK: Changed by: Changed by: Date Changed: Date Changed: Time Changed: Time Changed: QA CHK:...
  • Page 166 DEVELOPMENT GROUP 1 R&D CHK: R&D CHK: Size: Size: TITLE: TITLE: DOC CTRL CHK: DOC CTRL CHK: KU950 MAIN 1.1 MFG ENGR CHK: MFG ENGR CHK: Changed by: Changed by: Date Changed: Date Changed: Time Changed: Time Changed: QA CHK:...
  • Page 167 DEVELOPMENT GROUP 1 R&D CHK: R&D CHK: Size: Size: TITLE: TITLE: DOC CTRL CHK: DOC CTRL CHK: KU950 Main 1.1 MFG ENGR CHK: MFG ENGR CHK: Changed by: Changed by: Date Changed: Date Changed: Time Changed: Time Changed: QA CHK:...
  • Page 168 DEVELOPMENT GROUP 1 R&D CHK: R&D CHK: Size: Size: TITLE: TITLE: DOC CTRL CHK: DOC CTRL CHK: KU950 Main 1.1 MFG ENGR CHK: MFG ENGR CHK: Changed by: Changed by: Date Changed: Date Changed: Time Changed: Time Changed: QA CHK:...
  • Page 169 DEVELOPMENT GROUP 1 R&D CHK: R&D CHK: Size: Size: TITLE: TITLE: DOC CTRL CHK: DOC CTRL CHK: KU950 Main 1.1 MFG ENGR CHK: MFG ENGR CHK: Changed by: Changed by: Date Changed: Date Changed: Time Changed: Time Changed: QA CHK:...
  • Page 170 DEVELOPMENT GROUP 1 R&D CHK: R&D CHK: TITLE: TITLE: Size: Size: DOC CTRL CHK: DOC CTRL CHK: KU950 Main 1.1 MFG ENGR CHK: MFG ENGR CHK: Changed by: Changed by: Date Changed: Date Changed: Time Changed: Time Changed: QA CHK:...
  • Page 171 DEVELOPMENT GROUP 1 R&D CHK: R&D CHK: TITLE: TITLE: Size: Size: DOC CTRL CHK: DOC CTRL CHK: KU950 KEY 1.1 MFG ENGR CHK: MFG ENGR CHK: Changed by: Changed by: Date Changed: Date Changed: Time Changed: Time Changed: QA CHK:...
  • Page 172 FPCB to MEGA CAMERA MODULE - FPCB Side VISION MARK Section Date Sign & Name Sheet/ Sheets MODEL KU950 9 / 7 Designer NH LEEM 2006 Checked DRAWING KU950 Mega Camera FPCB-1.0 NAME Approved DRAWING LG Electronics Inc. Rev. 1.0 - 173 -...
  • Page 173 DEVELOPMENT GROUP 1 R&D CHK: R&D CHK: TITLE: TITLE: Size: Size: DOC CTRL CHK: DOC CTRL CHK: KU950 LCD SUB 1.0 MFG ENGR CHK: MFG ENGR CHK: Changed by: Changed by: Date Changed: Date Changed: Time Changed: Time Changed: QA CHK:...
  • Page 174 TP100 TP101 TP102 SIDE_CAMERA_HOT_KEY SIDE_VOLUME_DOWN_KEY SIDE_VOLUME_UP_KEY SIDE KEY Keypad Section Date Sign & Name Sheet/ Sheets MODEL KU950 9 / 7 Designer CH SUNG 2006 Checked DRAWING SIDE KEY-1.0 NAME Approved DRAWING LG Electronics Inc. Rev. 1.0 - 175 -...

  • Page 175: Pcb Layout

    8. PCB LAYOUT - 176 -...
  • Page 176 8. PCB LAYOUT - 177 -...
  • Page 177 8. PCB LAYOUT - 178 -...
  • Page 178 8. PCB LAYOUT - 179 -...
  • Page 179 8. PCB LAYOUT - 180 -...
  • Page 180 8. PCB LAYOUT - 181 -...
  • Page 181 8. PCB LAYOUT - 182 -...
  • Page 182 8. PCB LAYOUT - 183 -...
  • Page 183 8. PCB LAYOUT - 184 -...

  • Page 184: Calibration Program

    9. Calibration Program 9. Calibration Program 9.1 Configuration of HOT KIMCHI 9.1.1 Configuration of directory HOT KIMCHI PROJECT Cal_Model KU950 At_Serial_Cmd.xml dacTable.cfg HOT_KIMCHI CmMqDll.dll Diag_NV6275_RevB.dll ComLMPLib_06.dll DLL_E5515CD.DLL Hot_KimchiD.exe DLL_PwrControlD.dll ShieldBox_DllD.dll Dll_SerialATD.dll Info_Db.txt Ezlooks.xml FTMLib.dll LG_RfCal_QuKU950Ag_099.dll ModelInfo.txt PwrSupply_Cmd.xml QLib.dll Setup_Cal_Test.xml : Directory...
  • Page 185 9. Calibration Program 9.1.2 Setup file (Info_Db.txt) /*cal*/[Default]=[KU950] /*cal*/[KU950]=[..\\Cal_Model\\KU950\\LG_RfCal_Qu KU950 Ag_099.dll] [ezlooks]=[off] [batcal]=[off] [svc]=[off] ‘on’ or ‘off’. (use only lower case) [standalone]=[off] [tescom]=[off] ‘auto’ or ‘cal’. (use only lower case) [process]=[cal] 1: Indication of ‘cal process’ or ‘auto process’ 2: Model name which is displayed on Hot Kimchi program 3: Relative path of Main Sequence dll file from Hot_KimchiD.exe...
  • Page 186 9. Calibration Program 9.1.3 Items of setup file [ezlooks] => The yes or no for using ezlooks Domestic: on, Overseas: off [batcal] => The yes or no for using battery calibration [svc] => The yes or no for using HOT KIMCHI at service center Domestic: off, Service Center: on [standalone] =>...
  • Page 187 9. Calibration Program 9.1.4 Example for setup file CAL Process Ex1) Service center [ezlooks]=[off] [batcal]=[off] [svc]=[on] [standalone]=[off] [tescom]=[off] [process]=[cal] Ex2) Overseas factory or Repair [ezlooks]=[off] [batcal]=[on] [svc]=[off] [standalone]=[on] [tescom]=[off] [process]=[cal] Ex3) Domestic factory [ezlooks]=[on] [batcal]=[on] [svc]=[off] [standalone]=[off] [tescom]=[off] [process]=[cal] In case of using Tescom S/B, set [tescom]=[on]. - 188 -...

  • Page 188: How To Use Hot Kimchi

    9. Calibration Program 9.2 How to use HOT KIMCHI KU950 KU950 * Flow 1. Select the model name which you want 2. Click APPLY button to load the ‘cal’ lib file 3. Click START button to run the procedure which you want...

  • Page 189: Example For Using Hot Kimchi

    9. Calibration Program 9.3 Example for using HOT KIMCHI Exe_QKU950Ver0.99A Choose Exe_QKU950Ver0.99A Exe_QKU950Ver0.99A Click APPLY button Click START button - KU950_Ver0.99A Calibration - - 190 -...
  • Page 190 9. Calibration Program 9.3.1 Example for Calibration ver097A - 191 -...
  • Page 191 - 192 -...

  • Page 192: Exploded View & Replacement Part List

    10. EXPLODED VIEW & REPLACEMENT PART LIST 10.1 EXPLODED VIEW 62 63 64 46 47 48 - 193 -...
  • Page 193 - 194 -...

  • Page 194: Replacement Parts

    10. EXPLODED VIEW & REPLACEMENT PART LIST 10.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC <Mechanic component> Location Level Description Part Number Specification Color Remark IMT-2000(SLIDE) TISL0000903 Silver AAAY00 ADDITION AAAY0197401 Silver...
  • Page 195 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark MCCH02 CAP,SCREW MCCH0090801 MOLD, Silicone Rubber K-770, , , , , Black MGAZ00 GASKET MGAZ0048901 COMPLEX, (empty), , , , , MHFZ00 HINGE MHFZ0009301 MKAC00 KEYPAD,FUNCTION MKAC0009301 COMPLEX, (empty), , , , ,...
  • Page 196 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark MPBZ03 MPBZ0147901 COMPLEX, (empty), , , , , MSDC00 SPRING,LOCKER MSDC0008301 MTAA01 TAPE,DECO MTAA0123901 COMPLEX, (empty), , , , , MTAA02 TAPE,DECO MTAA0124001 COMPLEX, (empty), , , , , MTAB01 TAPE,PROTECTION MTAB0138901...

  • Page 197: Main Component

    10. EXPLODED VIEW & REPLACEMENT PART LIST 10.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC <Main component> Location Level Description Part Number Specification Color Remark SAEY00 PCB ASSY,KEYPAD SAEY0052701 PCB ASSY, SAEB00 SAEB0018301...
  • Page 198 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R103 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP R104 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP R109 RES,CHIP,MAKER ERHZ0000487 470 Kohm,1/16W ,J ,1005 ,R/TP R110 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP...
  • Page 199 R126 RES,CHIP,MAKER ERHZ0000504 68 ohm,1/16W ,J ,1005 ,R/TP SW100 SWITCH,TACT ESCY0004001 15 V,0.02 A,VERTICAL ,1.3 G, SPEY00 PCB,KEYPAD SPEY0044901 FR-4 ,0.5 mm,BUILD-UP 4 ,KU950 , KEY SAJY00 PCB ASSY,SUB SAJY0020901 SAJE00 PCB ASSY,SUB,SMT SAJE0015301 PCB ASSY,SUB,SMT SAJC00 SAJC0013801 BOTTOM C100...
  • Page 200 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark SPKY00 PCB,SIDEKEY SPKY0039801 POLYI ,0.2 mm,MULTI-2 ,KU950, SIDEKEY SAFF00 PCB ASSY,MAIN,SMT SAFF0099501 MLAZ00 LABEL MLAZ0038301 PID Label 4 Array PCB ASSY,MAIN,SMT SAFC00 SAFC0081001 BOTTOM C101...
  • Page 201 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C208 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C209 CAP,CHIP,MAKER ECZH0001420 1 uF,10V ,K ,X5R ,HD ,1608 ,R/TP C210 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C211 CAP,CERAMIC,CHIP ECCH0000182...
  • Page 202 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C245 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C246 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C247 CAP,CHIP,MAKER ECZH0001216 220 nF,10V ,K ,X5R ,TC ,1005 ,R/TP C248 CAP,CERAMIC,CHIP ECCH0000147...
  • Page 203 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C325 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C326 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C327 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C328 CAP,CERAMIC,CHIP ECCH0000143...
  • Page 204 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C411 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C412 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C413 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C414 CAP,CERAMIC,CHIP ECCH0000182...
  • Page 205 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C604 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C605 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP C606 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP C607 CAP,CERAMIC,CHIP ECCH0000182...
  • Page 206 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C819 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C820 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C904 CAP,CHIP,MAKER ECZH0001421 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP C905 CAP,CERAMIC,CHIP ECCH0004904...
  • Page 207 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF), FL804 FILTER,EMI/POWER SFEY0007103 Pb-free SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF), FL805 FILTER,EMI/POWER SFEY0007103 Pb-free J500 CONN,SOCKET ENSY0001602 6 PIN,ETC ,5 IRECTIONAL ,2.54 mm,K(GC200) L101 INDUCTOR,CHIP...
  • Page 208 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R202 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP R203 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP R204 RES,CHIP ERHY0000391 1M ohm,1/16W,F,1608,R/TP R205 RES,CHIP,MAKER ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP R206 RES,CHIP,MAKER ERHZ0000402...
  • Page 209 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R401 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP R402 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP R405 RES,CHIP,MAKER ERHZ0000331 110 Kohm,1/16W ,F ,1005 ,R/TP R406 RES,CHIP ERHY0000147 56K ohm,1/16W,F,1005,R/TP...
  • Page 210 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R800 RES,CHIP,MAKER ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP R801 RES,CHIP,MAKER ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP R811 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP R812 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP...
  • Page 211 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark 48 MHz,.5 %,14 pF,SMD ,2.0*1.2*0.65 ,Outgoing X300 RESONATOR EXRY0002401 Tolerance 0.2%, 0.05% at -40'C ~ +85C, Built-In Cap 12 MHz,50 PPM,8 pF,80 ohm,SMD ,3.2*2.5*0.75 ,20ppm X400 X-TAL EXXY0017801...
  • Page 212 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C134 CAP,CERAMIC,CHIP ECCH0000127 82 pF,50V,J,NP0,TC,1005,R/TP C135 INDUCTOR,CHIP ELCH0001002 5.6 nH,J ,1005 ,R/TP ,chip inductor PBFREE C136 CAP,CERAMIC,CHIP ECCH0007901 10 uF,4V ,M ,X5R ,TC ,1608 ,R/TP C137 CAP,CHIP,MAKER ECZH0000830...
  • Page 213 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C262 CAP,CHIP,MAKER ECZH0001420 1 uF,10V ,K ,X5R ,HD ,1608 ,R/TP C264 CAP,CHIP,MAKER ECZH0001420 1 uF,10V ,K ,X5R ,HD ,1608 ,R/TP C265 CAP,CHIP,MAKER ECZH0001420 1 uF,10V ,K ,X5R ,HD ,1608 ,R/TP C266 CAP,CHIP,MAKER ECZH0001420...
  • Page 214 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C728 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP C729 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP C730 CAP,CHIP,MAKER ECZH0001420 1 uF,10V ,K ,X5R ,HD ,1608 ,R/TP C732 CAP,CHIP,MAKER ECZH0001420 1 uF,10V ,K ,X5R ,HD ,1608 ,R/TP C902 CAP,CERAMIC,CHIP ECCH0000182...
  • Page 215 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark L109 INDUCTOR,CHIP ELCH0005010 1.8 nH,S ,1005 ,R/TP , L110 INDUCTOR,CHIP ELCH0003813 47 nH,J ,1005 ,R/TP ,COIL TYPE L111 INDUCTOR,CHIP ELCH0003824 10 nH,J ,1005 ,R/TP ,chip inductor,PBFREE L112 INDUCTOR,CHIP ELCH0005013...
  • Page 216 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R118 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP R119 RES,CHIP,MAKER ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP R120 RES,CHIP ERHY0003501 220 ohm,1/16W ,J ,1005 ,R/TP R121 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP...
  • Page 217 47 Kohm,1/16W ,J ,1005 ,R/TP R926 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP SPFY00 PCB,MAIN SPFY0133301 FR-4 ,0.8 mm,STAGGERED-10 ,KU950,MAIN,PCB QFN ,56 PIN,R/TP ,GSM/WCDMA TRANSMITTER & U100 EUSY0203802 GSM RECEIVER 35 dBm,53 %,0.0000025 A, dBc,50 dB,6.0*6.0*1.2 ,SMD U101 SMPY0008301 ,FOR QUAD BAND GSM AND GPRS MHz, PPM, pF,SMD ,5.5*4.8*1.5 ,824MHz ~ 915MHz,...
  • Page 218 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark SC70-5 ,5 PIN,R/TP ,1.8V Low Voltage Comparator with U601 EUSY0077701 Rail-to-Rail Input, Pb Free U602 EUSY0271201 TQFN ,16 PIN,R/TP ,Quad Analog switch, Pb Free U700 EUSY0232808 SOT 23-5 ,5 PIN,R/TP ,3.0V,150mA LDO U701...

  • Page 219: Accessory

    SBOM standard on GCSC Location Level Description Part Number Specification Color Remark ADEY00 DATA KIT KU950 CD Ass'y for Vodafone, Italy ADEY0008401 MBAZ00 MBAZ0004701 CD Cover MCHZ0030501 Silver Snow MCHZ00 COMPACT DISK COMPLEX, (empty), , , , ,...
  • Page 220 Note...
  • Page 221 Note...

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