Intel BOXD875PBZLK Technical Product Specification page 6

Product specification
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Intel Desktop Board D875PBZ Technical Product Specification
2.1
Introduction.................................................................................................................49
2.2
Memory Resources ....................................................................................................49
2.2.1
Addressable Memory ...................................................................................49
2.2.2
Memory Map ................................................................................................51
2.3
DMA Channels ...........................................................................................................51
2.4
Fixed I/O Map.............................................................................................................52
2.5
PCI Configuration Space Map ....................................................................................53
2.6
Interrupts ....................................................................................................................54
2.7
PCI Interrupt Routing Map ..........................................................................................55
2.8
Connectors .................................................................................................................57
2.8.1
Back Panel Connectors................................................................................58
2.8.2
Internal I/O Connectors ................................................................................60
2.8.3
External I/O Connectors ...............................................................................68
2.9
Jumper Blocks............................................................................................................72
2.9.1
Front Panel Audio Connector/Jumper Block.................................................72
2.9.2
BIOS Setup Configuration Jumper Block......................................................73
2.10 Mechanical Considerations.........................................................................................74
2.10.1
D875PBZ Form Factor .................................................................................74
2.10.2
I/O Shield .....................................................................................................75
2.11 Electrical Considerations ............................................................................................77
2.11.1
DC Loading ..................................................................................................77
2.11.2
Add-in Board Considerations........................................................................77
2.11.3
Fan Connector Current Capability ................................................................77
2.11.4
Power Supply Considerations ......................................................................78
2.12 Thermal Considerations..............................................................................................79
2.13 Reliability ....................................................................................................................81
2.14 Environmental ............................................................................................................81
2.15 Regulatory Compliance ..............................................................................................82
2.15.1
Safety Regulations .......................................................................................82
2.15.2
EMC Regulations .........................................................................................82
2.15.3
European Union Declaration of Conformity Statement .................................83
2.15.4
Product Ecology Statements ........................................................................83
2.15.5
Product Certification Markings (Board Level) ...............................................84
3.1
Introduction.................................................................................................................85
3.2
BIOS Flash Memory Organization ..............................................................................85
3.3
Resource Configuration ..............................................................................................86
3.3.1
PCI Autoconfiguration ..................................................................................86
3.3.2
PCI IDE Support...........................................................................................86
3.4
System Management BIOS (SMBIOS) .......................................................................87
3.5
Legacy USB Support ..................................................................................................88
3.6
BIOS Updates ............................................................................................................88
3.6.1
Language Support........................................................................................89
3.6.2
Custom Splash Screen.................................................................................89
3.7
Recovering BIOS Data ...............................................................................................89
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