Intel BLKDX79SI Technical Product Specification page 9

5 Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance ..................................................................... 85
5.1.1 Safety Standards ................................................................. 85
5.1.2 European Union Declaration of Conformity Statement ................ 86
5.1.3 Product Ecology Statements .................................................. 87
5.1.4 EMC Regulations .................................................................. 89
5.1.5 ENERGY STAR* 5.0, e-Standby, and ErP Compliance ................. 92
5.1.6 Regulatory Compliance Marks (Board Level) ............................. 93
5.2 Battery Disposal Information ............................................................. 94
Figures
1. Major Board Components ................................................................. 13
2. Block Diagram ................................................................................ 15
3. Memory Channel and DIMM Configuration ........................................... 20
4. Back Panel Audio Connectors ............................................................ 25
5. LAN Connector LED Locations ............................................................ 27
6. Bluetooth/WiFi Module ..................................................................... 28
7. Thermal Sensors and Fan Headers ..................................................... 31
8. Location of Board Status LEDs ........................................................... 39
9. Location of the Onboard Power and Reset Buttons ................................ 41
10. Detailed System Memory Address Map ............................................... 44
11. Back Panel Connectors ..................................................................... 46
12. I/O Shield Reference Diagram ........................................................... 47
13. Component-side Connectors and Headers ........................................... 48
14. Connection Diagram for Front Panel Header ........................................ 55
15. Connection Diagram for Front Panel USB 2.0 Headers ........................... 57
16. Location of the Jumper Block ............................................................ 58
17. Board Dimensions ........................................................................... 60
18. Localized High Temperature Zones ..................................................... 64
Tables
1. Feature Summary ............................................................................ 11
2. Components Shown in Figure 1 ......................................................... 14
3. Supported Memory Configurations ..................................................... 18
4. Audio Jack Support .......................................................................... 24
5. LAN Connector LED States ................................................................ 27
6. Effects of Pressing the Power Switch .................................................. 32
7. Power States and Targeted System Power .......................................... 33
8. Wake-up Devices and Events ............................................................ 34
9. Board Status LEDs ........................................................................... 40
10. System Memory Map ....................................................................... 45
11. Component-side Connectors and Headers Shown in Figure 13 ................ 49
12. Front Panel Audio Header for Intel HD Audio ....................................... 50
13. Front Panel Audio Header for AC '97 Audio .......................................... 50
Contents
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