1.10 Hardware Management Subsystem; Fan Monitoring; 1.11 Power Management - Intel BLKD201GLYL Technical Product Specification

Product specification
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1.10 Hardware Management Subsystem

The hardware management features enable the board to be compatible with the Wired
for Management (WfM) specification. The Winbond W83627DHG-B I/O controller is
used to implement hardware monitoring and fan control. The features of this I/O
controller include:
Internal ambient temperature sensor
Two remote thermal diode sensors for direct monitoring of processor temperature
and ambient temperature sensing
Power supply monitoring of four voltages (+5 V, +V_1P8__CORE, +VCCP, and
+12 V) to detect levels above or below acceptable values
Thermally monitored closed-loop fan control, for system fan, that can adjust the
fan speed or switch the fans on or off as needed
SMBus interface
1.10.1

Fan Monitoring

Fan monitoring can be implemented using Intel
or third-party software.
For information about
The functions of the fan connectors

1.11 Power Management

Power management is implemented at several levels, including:
Software support through Advanced Configuration and Power Interface (ACPI)
Hardware support:
⎯ Power connector
⎯ Fan connectors
⎯ LAN wake capabilities
⎯ Instantly Available PC technology
⎯ Resume on Ring
⎯ Wake from USB
⎯ Wake from PS/2 devices
⎯ Power Management Event signal (PME#) wake-up support
Product Description
Desktop Utilities, LANDesk* software,
®
Refer to
Section 1.11.2.2, page 31
27

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