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B860M-STX Chapter 1 Introduction Thank you for purchasing B860M-STX motherboard. In this documentation, Chapter 1 and 2 contains the introduction of the motherboard and step-by-step installation guides. Chapter 3 contains the operation guide of the software and utilities. Chapter 4 contains the configuration guide of the BIOS setup.
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B860M-STX • 1 x Intel® Thunderbolt 4, supports HDCP 2.3 and max. resolution up to 8K 60Hz / 5K 120Hz* * Only the CPU's embedded graphics can be displayed through Thunderbolt ports. If you want to display to a Thunderbolt monitor, please use CPU models with embedded graphics.
Storage • 2 x SATA3 6.0 Gb/s Connectors • 1 x Blazing M.2 Socket (M2_1, Key M), supports type 2280 PCIe Gen5x4 (128 Gb/s) mode* • 1 x Hyper M.2 Socket (M2_2, Key M), supports type 2280 PCIe Gen4x4 (64 Gb/s) mode* * Supports Intel®...
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B860M-STX Please realize that there is a certain risk involved with overclocking, including adjusting the setting in the BIOS, applying Untied Overclocking Technology, or using third-party overclocking tools. Overclocking may affect your system’s stability, or even cause damage to the components and devices of your system. It should be done at your own risk and expense.
B860M-STX 1.4 Front Panel No. Description No. Description Headphone/Headset Jack (AUDIO1) USB 3.2 Gen2x2 Type-C Port (USB_2) USB 3.2 Gen1 Type-A Port (USB_1) Microphone Input (AUDIO2)
1.5 Rear Panel No. Description No. Description DC Jack* HDMI Port (Supports 19V DC Power Adapters) USB 3.2 Gen1 Type-A Ports DisplayPort 1.4 (DP2) (USB_34) Thunderbolt 4 Type-C Port (USB4_1) 2.5G LAN RJ-45 Port** DisplayPort 1.4 (DP_1) *Specification for DC plug 5.5 mm 2.5 mm * There are two LEDs on each LAN port.
B860M-STX Chapter 2 Installation This is a Mini-STX form factor motherboard. Before you install the motherboard, study the configuration of your chassis to ensure that the motherboard fits into it. Pre-installation Precautions Take note of the following precautions before you install motherboard components or change any motherboard settings.
2.1 Installing the CPU 1. Before you insert the 1700-Pin CPU into the socket, please check if the PnP cap is on the socket, if the CPU surface is unclean, or if there are any bent pins in the socket. Do not force to insert the CPU into the socket if above situation is found.
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Please save and replace the cover if the processor is removed. The cover must be placed if you wish to return the motherboard for after service.
2.3 Installing Memory Modules (SO-DIMM) This motherboard provides two 260-pin DDR5 (Double Data Rate 5) SO-DIMM slots, and supports Dual Channel Memory Technology. 1. For dual channel configuration, you always need to install identical (the same brand, speed, size and chip-type) DDR5 SO-DIMM pairs. 2.
2.4 Jumpers Setup The illustration shows how jumpers are setup. When the jumper cap is placed on the pins, the jumper is “Short”. If no jumper cap is placed on the pins, the jumper is “Open”. Clear CMOS Jumper Short: Clear CMOS (CLRCMOS1) Open: Default 2-pin Jumper...
B860M-STX 2.5 Onboard Headers and Connectors Onboard headers and connectors are NOT jumpers. Do NOT place jumper caps over these headers and connectors. Placing jumper caps over the headers and connectors will cause permanent damage to the motherboard. System Panel Header...
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MONO Speaker Header Please connect the chassis Front_L- speaker to this header. (4-pin SPEAKER1) Front_L+ Front_R+ (see p.6, No. 6) Front_R- Serial ATA3 Connectors These two SATA3 (see p.7, No. 9 and 10) connectors support SATA data cables for internal storage devices with up to Signal Name Signal Name...
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B860M-STX Audio Header This Audio header allows you to (5-pin AUDIO3) connect the audio cable for head- Audio-R (see p.6, No. 7) phone. Audio-L Jack detect...
2.6 M.2 WiFi/BT Module and Intel® CNVi (Integrated WiFi/BT) Installation Guide The M.2 is a small size and versatile card edge connector that aims to replace mPCIe and mSATA. The M.2 Socket (Key E) supports type 2230 WiFi/BT module and Intel® CNVi (Integrated WiFi/BT).
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B860M-STX Step 3 Gently insert the WiFi/BT module or Intel® CNVi (Integrated WiFi/ BT) into the M.2 slot. Please be aware that the module only fits in one orientation. Step 4 Tighten the screw with a screwdriver to secure the module into place.
2.7 M.2 SSD Installation Guide The M.2 is a small size and versatile card edge connector that aims to replace mPCIe and mSATA. The Blazing M.2 Socket (M2_1, Key M) supports type 2280 PCIe Gen5x4 (128 Gb/ s) mode. The Hyper M.2 Socket (M2_2, Key M) supports type 2280 PCIe Gen4x4 (64 Gb/s) mode.
Chapter 3 Auto Driver Installer After you install the Windows OS and boot into the system, a notification will pop up to help you to install and update required drivers.
B860M-STX Chapter 4 UEFI SETUP UTILITY 4.1 Introduction This section explains how to use the UEFI SETUP UTILITY to configure your system. You may run the UEFI SETUP UTILITY by pressing <F2> or <Del> right after you power on the computer, otherwise, the Power-On-Self-Test (POST) will continue with its test routines.
4.2 EZ Mode The EZ Mode screen appears when you enter the BIOS setup program by default. EZ mode is a dashboard which contains multiple readings of the system’s current status. You can check the most crucial information of your system, such as CPU speed, DRAM frequency, SATA information, fan speed, etc.
B860M-STX 4.3 Advanced Mode The Advanced Mode provides more options to configure the BIOS settings. Refer to the following sections for the detailed configurations. To access the EZ Mode, press <F6> or click the "EZ Mode" button at the upper right corner of the screen.
4.3.2 Navigation Keys Use < > key or < > key to choose among the selections on the menu bar, and use < > key or < > key to move the cursor up or down to select items, then press <Enter>...
B860M-STX 4.4 Main Screen When you enter the UEFI SETUP UTILITY, the Main screen will appear and display the system overview. The availability and location of BIOS settings can be different for different models and BIOS versions. My Favorite Display your collection of BIOS items. Press F5 to add/remove your favorite items.
4.3 OC Tweaker Screen In the OC Tweaker screen, you can set up overclocking features. Base Frequency Boost Allows you to enjoy the base frequency boost with the hidden power of processors immediately. This item appears depending on the motherbod model you use. CPU Configuration CPU Turbo Ratio Information Press [Enter] to view the CPU Turbo Ratio information.
B860M-STX CPU E-Core Ratio The E-Core speed is determined by the E-Core Ratio multiplied with the BCLK. Increasing the E-Core Ratio will increase the internal E-Core clock speed without affecting the clock speed of other components. Configuration options: [Auto] [All Core] [Per Core] [Specific Per Core] CPU Cache Ratio The CPU Internal Bus Speed Ratio.
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Configuration options: [Max Battery] [Max Non-Turbo Performance] [Turbo Performance] CPU BGREF Mode Allows you to select CPU Bandgap Reference Mode between Normal and Bandgap By- passed. CPU Bandgap Reference Mode - the default voltage is Normal. Configuration options: [Normal] [Bandgap Bypassed] VCCIA Boot Voltage Allows you to select VCCIA boot voltage between Nominal and High Voltage.
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B860M-STX Intel SpeedStep Technology Intel SpeedStep technology allows processors to switch between multiple frequencies and voltage points for better power saving and heat dissipation. CPU turbo ratio can be fixed when Intel SpeedStep Technology is set to Disabled and Intel Turbo Boost Technology is set to Enabled.
default threshold on supported products. Recommended to disable it for overclocking. This item appears depending on the CPU you use on your motherboard. Configuration options: [Auto] [Enabled] [Disabled] CPU Tj Max Allows you to set CPU Tj Max to adjust TCC Target Temperature. It supports Tj Max in the range of 62 to 115 deg Celsius.
B860M-STX P-core Power Density Throttle Throttling for overclocking purpose. Once disabled, BIOS cannot enable it in the same reset cycle. A warm or cold reset is required to enable protection again. DRAM Configuration Memory Information Allows you to browse the serial presence detect (SPD) and Intel extreme memory profile (XMP) for memory modules.
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2nd Point Frequnecy Allows you to specify the frequency for the given point. 2nd Point Gear Gear ratio for this SAGV point. Configuration options: [Auto] [2] [4] 3rd Point Frequnecy Allows you to specify the frequency for the given point. 3rd Point Gear Gear ratio for this SAGV point.
B860M-STX RAS# Cycle Time (tRC) Allows to configure the minimum active to active/Refresh Time. Command Rate (CR) The delay between when a memory chip is selected and when the first active command can be issued. Secondary Timing Write Recovery Time (tWR) The amount of delay that must elapse after the completion of a valid write operation, before an active bank can be precharged.
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to the same internal bank. RAS to RAS Delay (tRRD_L) The number of clocks between two rows activated in different banks of the same rank. RAS to RAS Delay (tRRD_S) The number of clocks between two rows activated in different banks of the same rank. Read to Precharge (tRTP) The number of clocks that are inserted between a read command to a row pre-charge command to the same rank.
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B860M-STX Allows you to configure tCSH. tCSH Allows you to configure tCSH. tCSL Allows you to configure tCSL. tCA2CS Allows you to configure tCA2CS. tPRPDEN Allows you to configure tPRPDEN. tOSCO Allows you to configure tOSCO. tMRR Allows you to configure tMRR.
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AddTcwl Allows you to configure AddTcwl. tCCDByteCasDelta Allows you to configure tCCDByteCasDelta. tPrefRi Allows you to configure tOrefRi. RefreshHpWm Allows you to configure RefreshHpWm. RefreshPanicWm Allows you to configure RefreshPanicWm. RefreshPanicWm Allows you to configure RefreshAbrRelease. tRFM Allows you to configure tRFM. tXSR Allows you to configure tXSR.
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B860M-STX tMRD Allows you to configure tMRD. Turn Around Timing TAT Training Value tRDRD_sg Configure between module read to read delay. Configuration options: [Auto] [0] - [127] tRDRD_dg Configure between module read to read delay. Configuration options: [Auto] [0] - [127] tRDRD_dr Configure between module read to read delay.
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tWRRD_sg Configure between module write to read delay. Configuration options: [Auto] [0] - [511] tWRRD_dg Configure between module write to read delay. Configuration options: [Auto] [0] - [511] tWRRD_dr Configure between module write to read delay. Configuration options: [Auto] [0] - [127] tWRRD_dd Configure between module write to read delay.
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B860M-STX Configuration options: [Auto] [0] - [127] tRDRD_dg Configure between module write to read delay. Configuration options: [Auto] [0] - [127] tRDRD_dr Configure between module write to read delay. Configuration options: [Auto] [0] - [255] tRDRD_dd Configure between module write to read delay.
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Configuration options: [Auto] [0] - [511] tWRRD_dr Configure between module write to read delay. Configuration options: [Auto] [0] - [127] tWRRD_dd Configure between module write to read delay. Configuration options: [Auto] [0] - [127] tWRWR_sg Configure between module write to write delay. Configuration options: [Auto] [0] - [127] tWRWR_dg Configure between module write to write delay.
Restart MRC in Cold mode after disabling failing channel. Default option is set to Disabled. Exit On Failure (MRC) Exit On Failure for MRC training steps. Force ColdReset Force ColdReset OR Choose MrcColdBoot Mode, which Coldboot is required during MRC execution.
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B860M-STX System Agent Voltage Input voltage for the processor by the external voltage regulator. Configuration options: [Auto] [Offset Mode] [Fixed Mode] System Agent Load-Line Calibration System Agent Load-Line Calibration helps prevent System Agent voltage droop when the system is under heavy load.
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VDD Voltage Range JEDEC Standard ranges from 0.800V to 1.435V. OC Demand ranges from 0.800V to 2.070V. OC Demand may not be applied if PMIC OC CAP is JEDEC PMIC. You can check it via the Memory Information tool. Configuration options: [JEDEC Standard] [OC Demand] VDDQ Voltage Allows you to configure the VDDQ Voltage supported by PMIC at DRAM side.
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B860M-STX Configuration options: [Auto] [0.5 A] [1.0 A] [Reserved] [Max TDC] PLL Voltage Configuration P-Core PLL Voltage Offset PLL Voltage Offset value ranges from 0 to 15 bins, and each bin is 17.5mV. E-Core PLL Voltage Offset PLL Voltage Offset value ranges from 0 to 15 bins, and each bin is 17.5mV.
Configure Max voltage limits. The max voltage should be 200mV greater than Vfused P0. E-Core Max Voltage Limits Configure Max voltage limits. The max voltage should be 200mV greater than Vfused P0. Ring Max Voltage Limits Configure Max voltage limits. The max voltage should be 200mV greater than Vfused P0. GT Max Voltage Limits Configure Max voltage limits.
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B860M-STX Configuration options: [OC Mode] : Larger tange voltage for overclocking. [Stable Mode] : Smaller range voltage for stable system. Core Input Voltage Allows you to configure Input voltage for the processor by the external voltage regulator. Configuration options: [Auto] [Offset Mode] [Fixed Mode]...
4.4 Advanced Screen In this section, you may set the configurations for the following items: CPU Configuration, Chipset Configuration, Storage Configuration, Intel(R) Thunderbolt, ACPI Configuration, USB Configuration , Trusted Computing, Network Stack Configuration and Intel(R) Rapid Storage Technology. Setting wrong values in this section may cause the system to malfunction. UEFI Configuration UEFI Setup Style Allows you to select the default mode when entering the UEFI setup utility.
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B860M-STX Full HD UEFI [Auto] When [Auto] is selected, the resolution will be set to 1920 x 1080 if the monitor sup- ports Full HD resolution. If the monitor does not support Full HD resolution, then the resolution will be set to 1024 x 768.
4.4.1 CPU Configuration Processor P-Core Information Press [Enter] to view P-Core Information. Processor E-Core Information Press [Enter] to view E-Core Information. Active P-Cores Allows you to select the number of cores to enable in each processor package. Note: Number of P-Cores and E-Cores are lokked at together. When both are {0,0}, Pcode will enable all cores.
B860M-STX Configuration options: [Enabled] [Disabled] C-State Auto Demotion Allows you to configure C-State Auto Demotion. Configuration options: [C1] [Disabled] CState Un-demotion Allows you to configure C-State Un-demotion. Configuration options: [C1] [Disabled] Package C-State Demotion Allows you to enable or disable Package C-State Demotion.
Configuration options: [Enabled] [Disabled] Intel Virtualization Technology Intel Virtualization Technology allows a platform to run multiple operating systems and applications in independent partitions, so that one computer system can function as multiple virtual systems. Configuration options: [Enabled] [Disabled] X2APIC Enable Allows you to enable or disable X2APIC Operating Mode.\nWhen this option is config- ured as ‘Enabled’, ‘VT-d’...
B860M-STX 4.4.2 Chipset Configuration Modern Standby Allows you to set Modern Standby. Re-Size BAR Support If system has Resizable BAR capable PCIe Devices, this option Enables or Disables Resizable BAR Support. VT-d Intel® Virtualization Technology for Directed I/O helps your virtual machine monitor better utilize hardware by improving application compatibility and reliability, and providing additional levels of manageability, security, isolation, and I/O performance.
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Configuration options: [Gen1] [Gen2] [Gen3] [Gen4] PCI Express Native Control Select Enabled for enhanced PCI Express power saving in OS. Configuration options: [Enabled] [Disabled] PCIE ASPM Support This option controls the ASPM support for all CPU downstream devices. Configuration options: [Disabled] [L0s] [L1] [L0sL1] [Auto] PCH PCIE ASPM Support This option controls the ASPM support for all PCH downstream devices.
B860M-STX Allows you to enable or disable audio for the onboard digital outputs. This item appears when you've installed a graphics card on your motherboard. Configuration options: [Enabled] [Disabled]. Realtek 2.5G Ethernet Controller Allows you to enable or disable Onboard LAN.
4.4.3 Storage Configuration SATA Controller(s) Enable/disable the SATA controllers. SATA Aggressive Link Power Management SATA Aggressive Link Power Management allows SATA devices to enter a low power state during periods of inactivity to save power. It is only supported by AHCI mode. Configuration options: [Enabled] [Disabled]...
B860M-STX 4.4.4 Intel(R) Thunderbolt PCIE Tunneling over USB4 Allows you to enable or disable PCIE Tunneling over USB4. Configuration options: [Enabled] [Disabled] Integrated Thunderbolt(TM) Enable Allows you to enable or disable the Intergrated Thunderbolt(TM). Configuration options: [Enabled] [Disabled] Discrete Thunderbolt(TM) Enable Allows you to enable or disable Discrete Thunderbolt(TM).
4.4.5 ACPI Configuration Suspend to RAM Allows you to select [Disabled] for ACPI suspend type S1. It is recommended to select [Auto] for ACPI S3 power saving. Configuration options: [Auto] [Disabled] PCIE Devices Power On Allows the system to be waked up by a PCIE device and enable wake on LAN. Configuration options: [Enabled] [Disabled] RTC Alarm Power On Allows the system to be waked up by the real time clock alarm.
B860M-STX 4.4.6 USB Configuration XHCI Hand-off This is a workaround for OSes without XHCI hand-off support. The XHCI ownership change should be claimed by XHCI driver. Configuration options: [Enabled] [Disabled]...
4.4.7 Trusted Computing NOTE: Options vary depending on the version of your connected TPM module. Security Device Support Allows you to enable or disable BIOS support for security device. O.S. will not show Security Device. TCG EFI protocol and INT1A interface will not be available. Configuration options: [Enabled] [Disabled] Active PCR banks This item displays active PCR Banks.
B860M-STX SM3_256 PCR Bank Allows you to enable or disable SM3_256 PCR Bank. Configuration options: [Enabled] [Disabled] Pending Operation Allows you to schedule an Operation for the Security Device. NOTE: Your computer will reboot during restart in order to change State of the Device.
4.4.8 Network Stack Configuration Network Stack This allows you to enable or disable UEFI Network Stack. Configuration options: [Enabled] [Disabled]...
B860M-STX 4.4.9 Intel(R) Rapid Storage Technology This formset allows the user to manage RAID volumes on the Inter(R) RAID Controller. The page displays the disk information when there are disks connected to the system. Create RAID Volume Press [Enter] to enter the page that allows you to create a RAID volume.
4.5 Tools Media Sanitization Use this tool to securely erase SSD. This tool only lists the SSDs that support the Secure Erase function. After you Sanitize SSD, all user data will be permanently destroyed on the SSD and cannot be recovered. Auto Driver Installer Allows you to download and install all necessary drivers automatically.
B860M-STX 3.6 Hardware Health Event Monitoring Screen This section allows you to monitor the status of the hardware on your system, including the parameters of the CPU temperature, motherboard temperature, fan speed and voltage. NOTE: Options vary depending on the features of your motherboard.
4.7 Security Screen In this section you may set or change the supervisor/user password for the system. You may also clear the user password. Supervisor Password Set or change the password for the administrator account. Only the administrator has authority to change the settings in the UEFI Setup Utility. Leave it blank and press enter to remove the password.
B860M-STX 4.8 Boot Screen This section displays the available devices on your system for you to configure the boot settings and the boot priority. Fast Boot Fast Boot speeds up your computer's boot time; however, you won't be able to boot from an USB storage device.
Configuration options: [On] [Off] Boot Beep Allows you to select whether the Boot Beep should be turned on or off when the system boots up. Please note that a buzzer is needed. Configuration options: [Enabled] [Disabled] Full Screen Logo [Enabled] Select this item to display the boot logo. [Disabled] Select this item to show normal POST messages.
B860M-STX 4.9 Exit Screen Save Changes and Exit When you select this option the following message, “Save configuration changes and exit setup?” will pop out. Press <F10> key or select [Yes] to save the changes and exit the UEFI SETUP UTILITY.
ASRock does not provide warranty of any kind, either expressed or implied, including but not limited to the implied warranties or conditions of merchantability or fitness for a particular purpose. In no event shall ASRock, its directors, officers, employees, or agents be liable for any indirect, special, incidental, or consequential...
FCC Compliance Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
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ASRock follows the green design concept to design and manufacture our products, and makes sure that each stage of the product life cycle of ASRock product is in line with global environmental regulations. In addition, ASRock disclose the relevant information based on regulation requirements.
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If you require assistance please call ASRock Tel : +886-2-28965588 ext.123 (Standard International call charges apply)
DECLARATION OF CONFORMITY Per FCC Part 2 Section 2.1077(a) Responsible Party Name: ASRock Incorporation 13848 Magnolia Ave, Chino, CA91710 Address: Phone/Fax No: +1-909-590-8308/+1-909-590-1026 hereby declares that the product Product Name : Motherboard B860M-STX Model Number : Conforms to the following speci cations:...
EU Declaration of Conformity For the following equipment: Motherboard (Product Name) B860M-STX (Model Designation / Trade Name) EMC Directive – 2014/30/EU EN 55032: 2015 / A11: 2020, EN 55035: 2017 / A11: 2020 EN IEC 61000-3-2: 2019, EN 61000-3-3: 2013...
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EU Declaration of Conformity Product: Product Motherboard Model B860M-STX Authorized Representative (UK-GB): Name: Gary Tsui Address: Bijsterhuizen 11-11, 6546 AR Nijmegen,The Netherlands Contact person: Gary Tsui This declaration is issued under the sole responsibility of the mentioned Manufacturer. The subject equipment under declaration is in conformity with the UK-GB Regulation(s) below: e Electromagnetic Compatibility Regulations 2016 (S.I.
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