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Chip Monolithic Ceramic Capacitor for General
GRM1555C1H101JA01_ (0402, C0G:EIA, 100pF, DC50V)
_: packaging code
1.Scope
This product specification is applied to Chip Monolithic Ceramic Capacitor used for General Electronic equipment.
2.MURATA Part NO. System
(Ex.)
GRM
15
(1)L/W
Dimensions
3. Type & Dimensions
(1)-1 L
(1)-2 W
1.0±0.05
0.5±0.05
4.Rated value
(3) Temperature Characteristics
(Public STD Code):C0G(EIA)
Temp. coeff
or Cap. Change
0±30 ppm/°C
5.Package
mark
(8) Packaging
f180mm Reel
D
PAPER W8P2
f180mm Reel
W
PAPER W8P1
f330mm Reel
J
PAPER W8P2
Product specifications in this catalog are as of Mar.8,2016,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
GRM1555C1H101JA01-01
5
5C
(2)T
(3)Temperature
Dimensions
Characteristics
(2) T
e
0.5±0.05
0.15 to 0.35
(4)
Rated
Temp. Range
Voltage
(Ref.Temp.)
25 to 125 °C
DC 50 V
(25 °C)
Packaging Unit
10000 pcs./Reel
20000 pcs./Reel
50000 pcs./Reel
1H
101
(4)Rated
(6)Capacitance
(5)Nominal
Voltage
Capacitance
(Unit:mm)
g
0.3 min.
Specifications and Test
(6)
(5) Nominal
Capacitance
Capacitance
Tolerance
100 pF
±5 %
1
Reference Sheet
J
A01
(7)Murata's Control
(8)Packaging Code
Tolerance
Code
Methods
(Operating
Temp. Range)
-55 to 125 °C
D
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Related Manuals for Murata GRM1555C1H101JA01D
Summarization of Contents
2. MURATA Part NO. System
(1) L/W Dimensions
Physical dimensions of the chip's length and width.
(2) T Dimensions
Physical dimension of the chip's thickness.
(3) Temperature Characteristics
Describes the capacitor's behavior across different temperatures.
(4) Rated Voltage
Specifies the maximum DC voltage the capacitor can withstand.
(5) Nominal Capacitance
The standard capacitance value of the component.
(6) Capacitance Tolerance
The acceptable deviation from the nominal capacitance.
(7) Murata's Control Code
Internal code used by Murata for product control.
(8) Packaging Code
Code indicating the packaging method for the capacitor.
4. Rated Value
Temperature Characteristics & Coefficient
Details on temperature-related capacitance changes and coefficients.
Specifications and Test Methods Overview
Introduces the test methods used for verifying specifications.
5. Package Information
Marking and Packaging Unit
Information on capacitor markings and the quantity per packaging unit.
Specifications and Test Methods
1. Rated Voltage Test
Verification of the capacitor's rated voltage capability.
2. Appearance and Dimension Verification
Visual inspection and dimensional checks for quality assurance.
3. Voltage Proof Test
Method to confirm the capacitor's ability to withstand voltage.
4. Insulation Resistance (I.R.) Test
Procedure for measuring the capacitor's insulation resistance.
5. Capacitance and Q Factor Test
Methods for measuring capacitance and quality factor.
6. Temperature Characteristics Test
Evaluating capacitance changes across various temperatures.
7. Adhesive Strength of Termination Test
Assessing the adhesion quality of capacitor terminations.
1. Tape Carrier Packaging
1.1 Minimum Quantity per Reel
Specifies the minimum number of capacitors per reel for different packaging types.
Taping Diagram and Reel Dimensions
Tape Width (W, W1)
Specifies the width dimensions for tape packaging.
Tape Packaging Structure
Leader and Vacant Sections
Specifies minimum lengths for leader and vacant sections in tape packaging.
Peeling Off Force
Defines the force required to peel off the top tape.
Storage and Operation Conditions
Storage Environment Requirements
Specifies temperature, humidity, and atmosphere for storage.
Storage Prohibitions
Warnings against storing in corrosive gas or high humidity/sunlight.
Rating Parameters
Temperature Dependent Characteristics
Explains capacitance changes with temperature and provides examples.
Applied Voltage Guidelines
Exceeding Rated Voltage Prohibition
Strict prohibition against exceeding the rated voltage.
Superimposed Voltage Rules
Specifics on AC/pulse voltage superimposed on DC.
Over Voltage Consequences
Risks associated with applying over-voltage, like short circuits.
Voltage-Capacitance Characteristics
DC Voltage Impact on Capacitance
Details DC voltage impact on capacitance, with examples.
AC Voltage Impact on Capacitance
Details AC voltage impact on capacitance.
Soldering and Mounting Procedures
1. Mounting Position Optimization
Guidelines for optimal component placement to minimize stress.
2. Pre-Mounting Checks
Essential checks and considerations before commencing the mounting process.
4-3. Soldered Portion Correction
Soldering Iron Rework
Steps for correcting solder joints using a soldering iron.
Spot Heater Rework
Using a spot heater for rework and thermal management.
Optimal Solder Amount for Rework
Guidance on solder quantity for rework to ensure reliability.
6. Electrical Testing on PCB
Test Support and Handling
Importance of proper support and handling during testing.
7. Printed Circuit Board Cropping
Stress Avoidance During Cropping
Avoiding stress on capacitors during PCB cropping.
Cropping Method Verification
Recommends checking cropping methods to prevent stress.
PCB Separation Jig Examples
Jigs for Single-side Mounting
Jig recommendations for single-side mounted boards.
Separators for Double-sided Mounting
Recommendations for double-sided mounted boards and alternative separators.
Disc Separator Usage
Explanation and examples of disc separators for PCB cropping.
8. Assembly Precautions
Handling Precautions
Basic handling precautions for assembled boards.
Other Component Attachment
Considerations when mounting components on the opposite side of the board.
Operation Environment and Safety
Operating Environment Confirmations
Specifies environments to avoid during operation.
Emergency Procedures and Disposal
Actions for emergencies, circuit design, and capacitor disposal.
Rating Details
Operating Temperature Limits
Defines operating temperature limits and considerations.
Atmosphere Surroundings Restrictions
Restrictions and effects of gaseous and liquid environments.
Piezo-electric Phenomenon
Describes vibration and noise generation in certain capacitor types.
PCB Design for Soldering
Pattern Form Guidelines
Guidance on prohibited vs. correct pattern forms for chip components.
Board Design and Adhesive Application
Board Design for Strain Management
Design considerations for board thickness, length, and width to manage strain.
Adhesive Application and Curing
Details on adhesive application amount, viscosity, coverage, and curing.
Flux for Flow Soldering
Guidelines for flux usage in flow soldering to prevent corrosion and ensure solderability.
Soldering Process Parameters
Flow Soldering Parameters
Parameters for flow soldering to prevent termination leaching.
Reflow Soldering Precautions
Precautions regarding solder paste and flux in reflow soldering.
Washing and Coating
Washing Procedures
Procedures for evaluating and selecting cleaning solvents.
Coating Considerations
Considerations for resin coating to prevent cracks and ensure insulation resistance.
Transportation and System Evaluation
Transportation Conditions
Conditions and precautions for transporting capacitors.
Actual System Evaluation
Importance of evaluating capacitor performance in the final application.
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