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Chip Monolithic Ceramic Capacitor for General
GRM155R60J224ME01_ (0402, X5R:EIA, 0.22uF, DC6.3V)
_: packaging code
1.Scope
This product specification is applied to Chip Monolithic Ceramic Capacitor used for General Electronic equipment.
2.MURATA Part NO. System
(Ex.)
GRM
15
(1)L/W
Dimensions
3. Type & Dimensions
(1)-1 L
(1)-2 W
1.0±0.05
0.5±0.05
4.Rated value
(3) Temperature Characteristics
(Public STD Code):X5R(EIA)
Temp. coeff
or Cap. Change
-15 to 15 %
5.Package
mark
(8) Packaging
f180mm Reel
D
PAPER W8P2
f180mm Reel
W
PAPER W8P1
f330mm Reel
J
PAPER W8P2
Product specifications in this catalog are as of Mar.8,2016,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
GRM155R60J224ME01-01
5
R6
(2)T
(3)Temperature
Dimensions
Characteristics
(2) T
e
0.5±0.05
0.15 to 0.35
(4)
Rated
Temp. Range
Voltage
(Ref.Temp.)
-55 to 85 °C
DC 6.3 V
(25 °C)
Packaging Unit
10000 pcs./Reel
20000 pcs./Reel
50000 pcs./Reel
0J
224
(4)Rated
(6)Capacitance
(5)Nominal
Voltage
Capacitance
(Unit:mm)
g
0.3 min.
Specifications and Test
(6)
(5) Nominal
Capacitance
Capacitance
Tolerance
0.22 uF
±20 %
1
Reference Sheet
M
E01
(7)Murata's Control
(8)Packaging Code
Tolerance
Code
Methods
(Operating
Temp. Range)
-55 to 85 °C
D
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Related Manuals for Murata GRM155R60J106ME15D
Summarization of Contents
1.Tape Carrier Packaging (Packaging Code:D/E/W/L/J/F/K)
1.1 Minimum Quantity(pcs./reel)
Details minimum quantities for tape carrier packaging options.
1.2 Dimensions of Tape
Provides dimensional specifications for tape carriers.
Rating
1.Operating Temperature
Defines operating temperature limits and considerations for capacitors.
5. DC Voltage and AC Voltage Characteristic
6. Capacitance Aging
Explains capacitance decrease over time for high dielectric constant capacitors.
7.Vibration and Shock
Details handling precautions related to vibration and mechanical shock.
Soldering and Mounting
1.Mounting Position
Guides on optimal component placement to minimize stress during board flexure.
2.Information before Mounting
Lists essential checks and confirmations before proceeding with component mounting.
8. Assembly
2-1. Mounting of Other Components
Precautions for mounting components on the reverse side of the PCB.
2-2. Inserting Components with Leads into Boards
Advice on inserting leaded components to prevent board bending and damage.
2-3. Attaching/Removing Sockets
Guidance on handling sockets to avoid board bending and component stress.
2-4. Tightening Screws
Precautions for screw tightening to prevent board bending and stress on components.
Others
1.Under Operation of Equipment
Specifies environmental conditions to avoid during equipment operation.
2. Others
General notes on emergencies and waste disposal.
1.PCB Design
1. Notice for Pattern Forms
Illustrates correct and incorrect pattern forms for component placement.
3. Board Design
2.Adhesive Application
Details adhesive application requirements for proper bonding during soldering.
3.Adhesive Curing
Advises on controlling adhesive curing for insulation resistance and chip security.
4.Flux (for Flow soldering)
Provides guidelines on flux selection and application for flow soldering.
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