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Murata GRM155R60J475ME87D Reference Sheet

Chip monolithic ceramic capacitor for general

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Chip Monolithic Ceramic Capacitor for General
GRM155R60J684ME19_ (0402, X5R:EIA, 0.68uF, DC6.3V)
_: packaging code
1.Scope
This product specification is applied to Chip Monolithic Ceramic Capacitor used for General Electronic equipment.
  
2.MURATA Part NO. System
(Ex.)
GRM
15
(1)L/W
Dimensions
3. Type & Dimensions
(1)-1 L
(1)-2 W
1.0±0.05
0.5±0.05
4.Rated value
(3) Temperature Characteristics
(Public STD Code):X5R(EIA)
Temp. coeff
or Cap. Change
-15 to 15 %
5.Package
mark
(8) Packaging
f180mm Reel
D
PAPER W8P2
f180mm Reel
W
PAPER W8P1
f330mm Reel
J
PAPER W8P2
Product specifications in this catalog are as of Mar.8,2016,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
GRM155R60J684ME19-01
5
R6
(2)T
(3)Temperature
Dimensions
Characteristics
(2) T
e
0.5±0.05
0.15 to 0.35
(4)
Rated
Temp. Range
Voltage
(Ref.Temp.)
-55 to 85 °C
DC 6.3 V
(25 °C)
Packaging Unit
10000 pcs./Reel
20000 pcs./Reel
50000 pcs./Reel
0J
684
(4)Rated
(6)Capacitance
(5)Nominal
Voltage
Capacitance
(Unit:mm)
g
0.3 min.
Specifications and Test
(6)
(5) Nominal
Capacitance
Capacitance
Tolerance
0.68 uF
±20 %
1
Reference Sheet
M
E19
(7)Murata's Control
(8)Packaging Code
Tolerance
Code
Methods
(Operating
Temp. Range)
-55 to 85 °C
D

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Summarization of Contents

Specifications and Test Methods
Rated Voltage
Specifies the maximum voltage that can be applied to the capacitor.
Appearance
Describes visual inspection criteria for defects.
Dimension
Details the physical dimensions of the capacitor.
Voltage Proof
Outlines the test method for voltage proof.
Insulation Resistance (I.R.)
Specifies minimum insulation resistance and test method.
Capacitance
Details capacitance measurement conditions and values.
Dissipation Factor (D.F.)
Specifies maximum dissipation factor and measurement conditions.
Temperature Characteristics of Capacitance
Describes how capacitance changes with temperature, listing codes.
Adhesive Strength of Termination
Tests for the adhesive strength of the capacitor's terminations.
Tape Carrier Packaging
Minimum Quantity(pcs./reel)
Specifies the minimum quantity of capacitors per reel for different packaging types.
Dimensions of Tape
Details the dimensions and specifications for tape packaging.
Caution
Limitation of Applications
Lists applications requiring high reliability and caution.
Storage and Operation condition
Provides guidelines for storing and operating the capacitors.
Rating
Discusses temperature-dependent characteristics of capacitors.
Soldering and Mounting
Mounting Position
Guidance on optimal capacitor placement to minimize stress.
Information before Mounting
Key checks and considerations before starting the mounting process.
Printed Circuit Board Cropping
Jig and Separator Examples
Provides examples of jigs and separators for PCB cropping.
Assembly
Handling
General precautions for handling assembled boards.
Attachment of Other Components
Guidelines for mounting components on the reverse side.
Inserting Components with Leads into Boards
Procedures for inserting leaded components to prevent board bending.
Attaching/Removing Sockets
Advice on attaching/removing sockets without damaging the board.
Tightening Screws
Precautions for tightening screws to avoid board stress.
Others
Under Operation of Equipment
Safety guidelines for operating equipment with capacitors.
Others
Emergency procedures, disposal, circuit design, and remarks.
Rating
Operating Temperature
Defines operating temperature limits and considerations.
Atmosphere Surroundings (gaseous and liquid)
Restrictions on environmental conditions for capacitor operation.
Piezo-electric Phenomenon
Describes vibration-induced noise in high dielectric constant capacitors.
PCB Design for Soldering and Mounting
Notice for Pattern Forms
Guidelines for PCB land patterns to prevent chip cracking.
Board Design Considerations
Relationship with amount of strain
Explains how board design affects strain on components.
Adhesive Application
Details adhesive requirements for proper chip bonding.
Adhesive Curing
Importance of proper adhesive curing for insulation resistance.
Flux (for Flow soldering)
Guidelines for flux usage in flow soldering to prevent corrosion.
Soldering Processes and Coating
Flow Soldering
Conditions and precautions for flow soldering.
Reflow Soldering
Precautions for reflow soldering, flux, and cleaning.
Washing
Procedures for evaluating cleaning solvent and conditions.
Coating
Resin selection criteria for coating to prevent cracks and moisture absorption.
Others (Transportation & Evaluation)
Transportation
Conditions and precautions for transporting capacitors.
Characteristics Evaluation in the Actual System
Importance of evaluating capacitor performance in the actual system.