IBM 60 Technical Overview And Introduction
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Also See for 60:
- Technical reference (60 pages) ,
- User manual (166 pages) ,
- Introduction and planning manual (102 pages)
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Table of Contents
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Summarization of Contents
Preface
The team that wrote this Whitepaper
Information about the authors and contributors to the document.
Comments welcome
Instructions on how to provide feedback and comments on the document.
1 General description
1.1 Minimum and optional features
Details the essential and additional hardware features included with the server models.
1.2 Physical package
Describes the physical dimensions, form factor, and weight of the server models.
1.3 Enterprise racks
Overview of IBM racks compatible with the Model 6C1 server for installation.
1.3.1 IBM RS/6000 7014 Model T00 Enterprise Rack.
Details the IBM 7014 Model T00 Enterprise Rack features and specifications.
1.3.2 IBM RS/6000 7014 Model T42 Enterprise Rack.
Details the IBM 7014 Model T42 Enterprise Rack features and specifications.
1.3.3 Rack mounting rules for Model 6C1
Guidelines and rules for mounting the Model 6C1 server into a rack.
1.3.4 Flat Panel Display Options
Information on flat panel display options for rack-mounted systems.
1.3.5 VGA switch
Description of the VGA switch for controlling multiple servers from a single console.
1.3.6 Cable management arm
Details the cable management arm included with the Model 6C1 for routing cables.
2 Architecture and technical overview
2.1 Processor and cache
In-depth look at the processor architecture, including L1, L2 cache, and clock speeds.
2.1.1 L1 and L2 cache
Details the L1 and L2 cache sizes, technology, and performance characteristics.
2.1.2 POWER3-II architecture
Explains the features and technical aspects of the POWER3-II processor.
2.1.3 Copper and CMOS technology
Discusses the use of copper and CMOS technology in processor manufacturing.
2.1.4 Processor deallocation
Information on options for deallocating processors within an SMP system.
2.1.5 Processor clock rate
Methods for identifying the processor clock speed for the server models.
2.1.6 Processor part numbers
Guidance on how to determine the part numbers for installed processor cards.
2.2 Memory
Details the memory subsystem, including capacity, ECC, and DIMM configuration.
2.2.1 Memory boot time deconfiguration
Explains deconfiguring memory segments or DIMMs at boot time for system stability.
2.2.2 Memory interchange with other systems.
Information on interchanging memory modules with other compatible IBM systems.
2.3 System bus
Overview of the system bus, its optimization for performance, and error checking.
2.3.1 Bus bandwidth
Theoretical maximum bandwidths for the system bus and memory interfaces.
2.4 PCI-bus, slots, and adapters
Details the PCI bus implementation, slots, and supported adapter cards.
2.4.1 32-bit versus 64-bit PCI slots
Comparison of 32-bit and 64-bit PCI slots and their impact on performance.
2.4.2 LAN adapters
Information on LAN connection options and supported network adapters for servers.
2.4.3 Graphics accelerators
Details the supported graphics accelerators for server workstation-like tasks.
2.5 Internal storage
Discusses internal storage options, attachments, and configurations.
2.5.1 Internal storage attachments
Details on default disk drives and options for tape or additional disk drives.
2.5.2 RAID configurations
Information on internal RAID configurations for data protection and storage solutions.
2.5.3 Boot options and limitations
Covers boot options and limitations for supported storage adapters.
2.6 Miscellaneous
Covers miscellaneous information including ISA, USB, NEBS, and HMT support.
2.7 Security
Methods to prevent unauthorized booting and secure the system.
2.8 Software requirements
Specifies the required AIX versions and maintenance packages for the systems.
3 Availability, investment protection, expansion, and accessibility
3.1 High availability solution
Details IBM HACMP software for disaster recovery and high availability clustering.
3.2 Reliability, availability, and serviceability (RAS) features
Explains key RAS features like Chipkill, hot-plug components, and service processors.
3.2.1 Light Path diagnostics.
Describes Light Path diagnostics technology for identifying failing components.
3.2.2 Service processor.
Information on the integrated service processor and its automatic reboot capabilities.
3.2.3 Hot plug power supplies
Details the hot-plug power supplies and their redundancy features.
3.2.4 Hot plug fans.
Information on hot-pluggable fans, their status LEDs, and thermal management.
3.2.5 Hot plug task.
Software functions for managing hot-plug devices, including SCSI hot swap.
3.3 Handheld based systems management
Discusses handheld systems management features and wireless management options.
3.4 Accessibility
Describes design considerations for system accessibility for users with impairments.
Related Publications
System Publications
Lists specific IBM manuals providing further details on system installation and use.
Referenced Web Sites
Provides links to relevant IBM Web sites for additional product and support information.
How to Get IBM Redbooks
Instructions on how to find, order, and download IBM Redbooks and related materials.
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