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- Page 1 BL-M7663BU3 802.11a/b/g/n/ac 867Mbps WLAN + Bluetooth v5.1 USB Combo Module SHENZHEN BILIAN ELECTRONIC CO., LTD Add: 10~11/F, Building 1A, Huaqiang idea park, Guangming district, Shenzhen. Guangdong, China Web: www.b-link.net.cn...
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Page 2: Revision History
Top view Bottom view Module Name: BL-M7663BU3 Module Type: 802.11a/b/g/n/ac 867Mbps WLAN + Bluetooth v5.1 USB Combo Module Revision: V1.0 Customer Approval: Company: Title: Signature: Date: BL-link Approval: Title: Signature: Date: Revision History Revision Summary Release Date Initial release 2021-08-21... - Page 3 1. Introduction The BL-M7663BU3 is a highly integrated 2T2R 802.11a/b/g/n/ac Wireless LAN (WLAN) network and bluetooth combo module. The module’s interface is USB 1.0/1.1/2.0. It combines a WLAN MAC, a 2T2R capable WLAN base band. Bluetooth support 5.1 performance. The BL-M7663BU3 module provides a complete solution for a high throughput performance integrated WLAN and BT device.
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Page 4: General Specifications
1.3 General Specifications Module Name BL-M7663BU3 Chipset MT7663BUN WLAN Standard IEEE 802.11 a/b/g/n/ac BT Specification Bluetooth Core Specification v5.1/4.2/4.1/2.1 Host Interface USB2.0 for WiFi and Bluetooth Antenna Connect to the external antennas through IPEX connectors Dimension SMD 32Pins --27.0*18.0*3.0mm (L*W*H), Tolerance: +/-0.15mm Power Supply DC 3.3V±0.2V @ 1500 mA (Max) -
Page 5: Pin Definition
2.1 Pin Definition Pin Name Type Module Pin Description USB_DP USB differential data line USB_DM USB differential data line BT_WAKE_HOST BT CHIP WAKES UP HOST 3.3V WLAN_WAKE_HOST WLAN CHIP WAKES UP HOST 3.3V System reset Input(active low，internal pull High by 10K RESET 3.3V resistor) -
Page 6: Electrical And Thermal Specifications
VDD33 Main Power supply CON1 BT_RF IPEX connector for BT RF to BT_ANT CON2 WLAN_RF0 IPEX connector for 2.4G / 5G RF to WLAN_ANT0 CON3 WLAN_RF1 IPEX connector for 2.4G / 5G RF to WLAN_ANT1 P: Power or Ground; I/O: In/Output; I: Input; O:Output; RF: Analog RF Port or RF Ground; 3. - Page 7 2.4G 11n HT40 MCS15 RX (2RX RF test) 5G 11a 6Mbps TX @ 18dBm (1TX RF test) 5G 11a 6Mbps RX (1RX RF test) 5G 11n HT20 MCS8 TX@15.5dBm (2TX RF test) 5G 11n HT20 MCS8 RX (2RX RF test) 5G 11n HT40 MCS15 TX@14dBm (2TX RF test) 5G 11n HT40 MCS15 RX (2RX RF test) 5G 11ac VHT80 MCS9 TX@14dBm (2TX RF test)
- Page 8 802.11ac (VHT40): MCS0~MCS9(2T2R)27~400Mbps; Frequency Tolerance ≦±15ppm 2.4G Receiver Specifications (WLAN_ANT0 & WLAN_ANT1) RX Rate Min Input Level（dBm） Max Input Level（dBm） 802.11b@1Mbps -92dBm < 8% 802.11b@11Mbps -86dBm < 8% 802.11g@6Mbps -90dBm < 10% 802.11g@54Mbps -74dBm < 10% 802.11n@HT20_MCS0 -88dBm < 10% 802.11n@HT20_MCS7 -70dBm <...
- Page 9 802.11a (OFDM): BPSK, QPSK, QAM16, QAM64; Modulation 802.11n (OFDM): BPSK, QPSK, QAM16, QAM64; 802.11ac (OFDM): BPSK, QPSK, QAM16, QAM64, QAM256; 802.11a: 6, 9, 12, 18, 24, 36, 48, 54Mbps; 802.11n (HT20): MCS0~MCS7(1T1R_SISO) 6.5~72.2Mbps; 802.11n (HT20): MCS8~MCS15(2T2R_MIMO) 13~144.4Mbps; 802.11n (HT40): MCS0~MCS7(1T1R) 13.5~150Mbps; 802.11n (HT40): MCS8~MCS15(2T2R) 27~300Mbps;...
- Page 10 4.3 Bluetooth RF Specification Conditions: VDD33=3.3V ; Ta:25℃ Features Description Bluetooth Core Specification v5.1/4.2/4.1/2.1 Bluetooth Specification Frequency Range 2.4~2.4835GHz (2.4GHz ISM Band) Bluetooth Classic: Ch0~Ch78 (For 1MHz Channels); Channels Bluetooth Low Energy: Ch0~Ch39 (For 2MHz Channels); Bluetooth Classic: Class1; Power Classes Bluetooth Low Energy: Class1.5;...
- Page 11 Δf1avg 140KHz 158.9.kHz 175KHz Δf2avg 159.15.kHz Δf2max 115KHz 154.3kHz Δf2avg/Δf1avg 0.89 Items EDR_3M(3DH5) EDR Carrier Frequency Stability and Modulation Accuracy ωi -75KHz -8.16kHz +75KHz ωi+ωo -75KHz -9.03kHz +75KHz ωo -10KHz -0.9kHz +10KHz 8DPSK RMS DEVM 0.026 0.13 8DPSK DEVM 0.059 0.25 Items LE_1M Modulation Characteristics...
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Page 12: Mechanical Specifications
5. Mechanical Specifications 5.1 Module Outline Drawing Top View Side View Module dimension: 27.0mm*18.0mm*3.0mm （L*W*H ; Tolerance: ±0.15mm） IPEX / MHF-1 connector dimension: 2.6*3.0*1.2mm (L*W*H, Ø2.0mm) Module Bow and Twist：≤0.1mm 11 http://www.b-link.net.cn... - Page 13 5.2 Mechanical Dimensions Top View Bottom View Side View 12 http://www.b-link.net.cn...
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Page 14: Application Information
6. Application Information 6.1 Recommend PCB Layout Footprint Bottom View 6.2 Reflow Soldering Standard Conditions Please use the reflow within 2 times. Set up the highest temperature within 250℃. 13 http://www.b-link.net.cn... -
Page 15: Package Dimensions
Parts Specification Manufacturer Note Chipset MT7663BUN MediaTek Inc. Shenzhen Tie Fa Technology CO. LTD BL-M7663BU3 Guangdong KINGSHINE ELECTRONICS CO., LTD Quzhou Sunlord Electronics CO., LTD Lucki Electronics Co., Ltd 40MHz-12pF-10ppm- Shenzhen Kaiyuexiang Electronics Co., Ltd Crystal 3225 Chengde Oscillator Electronic Technology Co., Ltd. -
Page 16: Storage Conditions
Package specification: 1、 700 modules per roll and 2,800 modules per box. 2、Outer box size: 37.5*36*29cm. 3、 The diameter of the blue environment-friendly rubber plate is 13 inches, with a total thickness of 48mm (with a width of 44mm carrying belt). 4、... - Page 17 FCC Statement This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions: (1) thi s device may not cause harmful interference, and (2) this device must accept any interference received, incl uding interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user’...
- Page 18 Integration instructions for host product manufacturers according to KDB 996369 D03 OEM Manual v01 2.2 List of applicable FCC rules CFR 47 FCC PART 15 SUBPART C has been investigated. It is applicable to the modular transmitter 2.3 Specific operational use conditions This module is stand-alone modular.
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