LB-Link BL-M7663BU2 Manual
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LB-Link BL-M7663BU2 Manual

Ieee 802.11a/b/g/n/ac 2t2r usb wifi+bluetooth 5.0 module
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BL-M7663BU2
IEEE 802.11a/b/g/n/ac 2T2R USB WiFi
+Bluetooth 5.0 Module Specification

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Summary of Contents for LB-Link BL-M7663BU2

  • Page 1 BL-M7663BU2 IEEE 802.11a/b/g/n/ac 2T2R USB WiFi +Bluetooth 5.0 Module Specification...

  • Page 2: Revision History

    Module Name: BL-M7663BU2 Module Type: IEEE 802.11a/b/g/n/ac 2T2R USB WiFi+Bluetooth 5.0 Module Revision: V1.0 Customer Approval: Company: Title: Signature: Date: BL-link Approval: Title: Signature: Date: Revision History Revision Summary Release Date Initial release 2021-07-30 Official version 2021-08-04 1http://www.b-link.net.cn...
  • Page 3 1. Introduction The BL-M7663BU2 is a highly integrated 2T2R 802.11a/b/g/n/ac Wireless LAN (WLAN) network and bluetooth combo module. The module’s interface is USB 1.0/1.1/2.0. It combines a WLAN MAC, a 2T2R capable WLAN base band. Bluetooth support 5.1 performance. The BL-M7663BU2 module provides a complete solution for a high throughput performance integrated wireless LAN and BT device.

  • Page 4: General Specifications

    1.3 General Specifications BL-M7663BU2 Module Name Chipset MT7663BUN WLAN Standard IEEE 802.11 a/b/g/n/ac BT Specification Bluetooth Core Specification v5.1/4.2/4.1/2.1 Host Interface USB2.0 for WiFi and Bluetooth Antenna Connect to the external antennas through IPEX connectors Dimension SMD 22Pins --27.0*17.7*3.1mm (L*W*H), Tolerance: +/-0.15mm Power Supply DC 3.3V±0.2V @ 1500 mA (Max)

  • Page 5: Electrical And Thermal Specifications

    USB_DP USB differential data line USB_DM USB differential data line RESET System reset Input(active low) 3.3V VDD33 Main Power supply WLAN_WAKE WLAN wake up host 3.3V NC（Reserved 2.4G / 5G RF PAD for WLAN_ANT1） NC（Reserved 2.4G / 5G RF PAD for WLAN_ANT0） NC（Reserved BT RF PAD）...

  • Page 6: Current Consumption

    3.2 Current Consumption Conditions : VDD33=3.3V ; Ta:25℃ ; VDD33 Current (average) Use Case Units WLAN Unassociated (Linux Driver, BT_Disable) 2.4G 11b 1Mbps TX @ 19dBm (1TX RF test) 2.4G 11b 1Mbps RX (1RX RF test) 2.4G 11g 6Mbps TX@18dBm (1TX RF test) 2.4G 11g 6Mbps RX (1RX RF test) 2.4G 11n HT20 MCS8 TX@14dBm (2TX RF test) 2.4G 11n HT20 MCS8 RX (2RX RF test)
  • Page 7 Features Description WLAN Standard IEEE 802.11b/g/n/ac, CSMA/CA Frequency Range 2.4~2.4835GHz (2.4GHz ISM Band) Channels Ch1~Ch13 (For 20MHz Channels) 802.11b (DSSS): CCK, DQPSK, DBPSK; 802.11g (OFDM): BPSK, QPSK, QAM16, QAM64; Modulation 802.11n (OFDM): BPSK, QPSK, QAM16, QAM64; 802.11ac (OFDM): BPSK, QPSK, QAM16, QAM64, QAM256; 802.11b: 1, 2, 5.5, 11Mbps;...
  • Page 8 802.11n@HT40_MCS0 -86dBm < 10% 802.11n@HT40_MCS7 -68dBm < 10% 802.11ac@VHT40_MCS9 -63dBm < 10% 4.2 5G WLAN RF Specification Conditions: VDD33=3.3V ; Ta:25℃ Features Description WLAN Standard IEEE 802.11a/n/ac, CSMA/CA 5.15~5.25GHz; 5.735~5.835GHz (5GHz ISM Band) Frequency Range Ch36, Ch40, Ch44, Ch48; Channels Ch149~Ch165 802.11a (OFDM): BPSK, QPSK, QAM16, QAM64;...
  • Page 9 802.11n@HT20_MCS0 ±2 16dBm ≦-10dB 802.11ac@VHT20_MCS0 802.11n@HT20_MCS7 ±2 16dBm ≦-28dB 802.11ac@VHT20_MCS7 802.11n@HT40_MCS0 ±2 16dBm ≦-10dB 802.11ac@VHT40_MCS0 ±2 802.11n@HT40_MCS7 16dBm ≦-28dB ±2 802.11ac@VHT80_MCS0 16dBm ≦-10dB ±2 802.11ac@VHT80_MCS9 16dBm ≦-32dB 5G Receiver Specifications (WLAN_ANT0 & WLAN_ANT1) Min Input Level（dBm） Max Input Level（dBm） RX Rate 802.11a@6Mbps <...
  • Page 10 BR_1Mbps: GFSK; EDR_2Mbps: π/4-DQPSK; EDR_3Mbps: 8DPSK; LE_125Kbps: GFSK (Coded_S=8); Date Rate & Modulation LE_500Kbps: GFSK (Coded_S=2); LE_1Mbps: GFSK (Uncoded); LE_2Mbps: GFSK (Uncoded); Bluetooth Transmitter Specifications Items Min（dBm） Typ（dBm） Max（dBm） TX Power BR_1M EDR_2/3M LE_125K/500K/1M/2M Items BR_1M (DH1) Modulation Characteristics Δf1avg 140KHz 158.9.kHz 175KHz...

  • Page 11: Mechanical Specifications

    Δf2avg/Δf1avg 0.93 Items LE_2M Modulation Characteristics Δf1avg 450KHz 501.3KHz 550KHz Δf2avg 234.2KHz Δf2max 370KHz 502.5KHz Δf2avg/Δf1avg 0.99 Bluetooth Receiver Specifications(BT_ANT) Sensitivity Maximum Input Level Items Input Level(Typ） Input Level(Typ） BR_1M (DH1) -91 dBm ≦ 0.1% -5 dBm ≦ 0.1% EDR_3M (3DH5) -80 dBm ≦...

  • Page 12: Mechanical Dimensions

    Module dimension: 27.0mm*17.7mm*3.0mm （L*W*H ; Tolerance: ±0.15mm） IPEX / MHF-1 connector dimension: 2.6*3.0*1.2mm (L*W*H, Ø2.0mm) Module Bow and Twist：≤0.1mm 5.2 Mechanical Dimensions Top View Bottom View 11http://www.b-link.net.cn...

  • Page 13: Application Information

    6. Application Information 6.1 Recommend PCB Layout Footprint Bottom View 12http://www.b-link.net.cn...
  • Page 14 Manufacturer Note Chipset MT7663BUN MediaTek Inc. Shenzhen Tie Fa Technology CO. LTD Guangdong KINGSHINE ELECTRONICS CO., BL-M7663BU2 V1.0 Quzhou Sunlord Electronics CO., LTD Lucki Electronics Co., Ltd Shenzhen Kaiyuexiang Electronics Co., Ltd Crystal 40MHz-12pF-10ppm-3225 Chengde Oscillator Electronic Technology Co., Ltd.

  • Page 15: Package Dimensions

    8. Package and Storage Information 8.1 Package Dimensions Package specification: 1. 1000 modules per roll and 5,000 modules per box. 2. Outer box size: 37.5*36*29cm. 3. The diameter of the blue environment-friendly rubber plate is 13 inches, with a total thickness of 48mm (with a width of 44mm carrying belt). 4.

  • Page 16: Storage Conditions

    8.2 Storage Conditions Absolute Maximum Ratings: Storage temperature: -40℃ to +85℃, Storage humidity: 10% to 95（Non-Condensing） Recommended Storage Conditions: Storage temperature: 5℃ to +40℃, Storage humidity: 20% to 90% RH Please use this Module within 12month after vacuum-packaged. The Module shall be stored without opening the packing. After the packing opened, the Module shall be used within 72hours.
  • Page 17 FCC Statement This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions: (1) thi s device may not cause harmful interference, and (2) this device must accept any interference received, incl uding interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user’...
  • Page 18 Integration instructions for host product manufacturers according to KDB 996369 D03 OEM Manual v01 2.2 List of applicable FCC rules CFR 47 FCC PART 15 SUBPART C has been investigated. It is applicable to the modular transmitter 2.3 Specific operational use conditions This module is stand-alone modular.

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