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Sunsea AIoT SIMcom SIM8070 Hardware Design

Wireless data module
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SIM8070
Hardware Design
Wireless Data Module
SIMCom Wireless Solutions Limited
SIMCom Headquarters Building, Building 3, No. 289 Linhong
Road, Changning District, Shanghai P.R. China
Tel: 86-21-31575100
support@simcom.com
www.simcom.com

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Summary of Contents for Sunsea AIoT SIMcom SIM8070

  • Page 1 SIM8070 Hardware Design Wireless Data Module SIMCom Wireless Solutions Limited SIMCom Headquarters Building, Building 3, No. 289 Linhong Road, Changning District, Shanghai P.R. China Tel: 86-21-31575100 support@simcom.com www.simcom.com...
  • Page 2 SIM8070 Hardware Design Document Title: SIM8070 Hardware Design Version: V1.01 Date: 2023-08-20 Status: Released GENERAL NOTES SIMCOM OFFERS THIS INFORMATION AS A SERVICE TO ITS CUSTOMERS, TO SUPPORT APPLICATION AND ENGINEERING EFFORTS THAT USE THE PRODUCTS DESIGNED BY SIMCOM. THE INFORMATION PROVIDED IS BASED UPON REQUIREMENTS SPECIFICALLY PROVIDED TO SIMCOM BY THE CUSTOMERS.
  • Page 3 SIM8070 Hardware Design Version History Date Version Description of change Author 2023-08-20 1.01 Original Junfeng Zhang www.simcom.com 3 / 103...
  • Page 4 SIM8070 Hardware Design Contents 1 Introduction ..........................11 Product Outline ..........................11 Functional Overview ........................12 2 Package Information ........................ 14 Hardware Block Diagram ......................14 Pin Assignment Overview ......................15 PIN Description..........................16 3 Interface Applications ........................36 Power Supply ..........................36 3.1.1 Pin Overview ........................
  • Page 5 SIM8070 Hardware Design 3.12.4 Handset Interface ......................61 3.13 UIM Card Interface ........................61 3.14 ADC ............................. 62 3.15 Sensor Interface .......................... 63 3.16 Motor Interface ..........................64 3.17 LED Interface ..........................64 3.18 Flash LED Interface ........................64 3.19 Forced Emergency Download Interface ..................
  • Page 6 SIM8070 Hardware Design Packaging ............................ 92 Recommend Devices ........................ 95 Appendix ..........................99 10.1 Relative Documents ........................99 10.2 Terms & Abbreviations ....................... 100 10.3 Safety Caution ........................... 102 www.simcom.com 6 / 103...
  • Page 7 SIM8070 Hardware Design Table Index Table 1: SIM8070x series module ........................11 Table 2: General features ..........................12 Table 3: Defination of the I/O Parameters ...................... 16 Table 4: Pin Properties ........................... 16 Table 5: Pin Description ..........................25 Table 6: Recommended TVS Diode ....................... 38 Table 7: KPD_PWR_N Features ........................
  • Page 8 SIM8070 Hardware Design Table 41: Absolute Maximum Value.......................... 83 Table 42: Temperature Range ........................83 Table 43: Operating Voltage ..........................83 Table 44: SDC2 Interface Electrical Feature (1.8V) ..................84 Table 45: SDC2 Interface Electrical Feature (2.96V) ..................84 Table 46: UIM Card Interface Electrical Feature (VREG_UIM = 1.8V or 2.95V) ..........84 Table 47: GPIO Electrical Feature........................
  • Page 9 SIM8070 Hardware Design Figure Index Figure 1: Module Block Diagram ........................14 Figure 2: Pin Assignment Overview ....................... 15 Figure 3: LDO Power Supply Reference Design.................... 36 Figure 4: DC-DC Power Supply Reference Design ..................37 Figure 5: VBAT Input Reference Design ......................37 Figure 6: Power On/Off Design with a Key ....................
  • Page 10 SIM8070 Hardware Design Figure 41: Top- and Bottom-View of the Module .................... 86 Figure 42: Three-Dimensional Size (Unit: mm) ....................87 Figure 43: Recommend Physical Outline Drawing (Unit: mm) ............... 88 Figure 44: Recommend Physical SMT Stencil Drawing (Unit: mm) ............... 89 Figure 45: Recommend Temperature Curve of Reflow Furnace ..............
  • Page 11 SIM8070 Hardware Design 1 Introduction SIM8070 module is a smart module newly released by SIMCom Wireless Solutions Co., Ltd. This module has the Android operating system, and the customers could use it for the development of their hardware devices. This document introduces the hardware interfaces of the SIM8070 module. The users could quickly understand the definition of the interfaces, the electrical performance, and the die size of the module.
  • Page 12 SIM8070 Hardware Design 1.2 Functional Overview Table 2: General features Feature Description Customized 64-bit ARM V-8 compatible application processor (Qualcomm® Kryo™ 260 CPU) Processor High Performance 4-Core frequency up to 2.0GHz,1MB L2 Low power consumption 4-Core frequency up to 1.8GHz,512KB L2 LPDDR4X RAM, (2 ×...
  • Page 13 SIM8070 Hardware Design EVRC, EVRC-B, EVRC-WB, G.711, G.729A/AB, Speech Codec GSM-FR, GSM-EFR, GSM-HR, AMR-NB, AMR-WB, AMR-eAMR, AMR-BeAMR Support USB 3.1 with DP interface, support USB2.0 Support USB Type-C Interface, Support MICRO-USB Interface USB1 support OTG. Support up to 6 Serial Ports A 2-Wire Serial Port for Debug UART Four 4-Wrie Serial Ports support hardware flow control, High-speed up to...
  • Page 14 SIM8070 Hardware Design 2 Package Information 2.1 Hardware Block Diagram 4-Lane DSI0 2520*1080 LCD 4-Lane CSI0 Primary Cam(25MP) 4-Lane CSI1 Primary Cam(25MP) 4-Lane CSI2 Second Cam(25MP) USB HS/USB_SS0+SS1/DP USB3.1/USB2.0 Modem Qualcomm Kryo™ ® UIM1 UIM Card1 260 CPU 4G/3G/2G MODEM UIM2 Core UIM Card2...
  • Page 15 SIM8070 Hardware Design 2.2 Pin Assignment Overview CAMERA POWER GPIO AUDIO LCD/TP Charge TP_I2C_SCL ANT_WIFI/BT CAM_MCLK0 CAM_MCLK1 VPH_OUT VREG_L21A_2P704 VPH_PWR MIPI_CSI0_CLK_P VREG_L21A_2P704 VREG_L15A_3P128 MIPI_CSI0_CLK_N VPH_PWR MIC_BIAS1 MIPI_CSI0_LANE0_P * 284 VREG_S6A_1P352 MIPI_CSI0_LANE0_N MIC_BIAS3 GPIO_92 MIC3_P MIPI_CSI0_LANE1_P PM_GPIO_01 USB0_SS_TX0_M VREG_L9A_1P8 MIPI_CSI0_LANE1_N MIC3_N VREG_L12A_1P8 MIPI_CSI0_LANE2_P ADC2...
  • Page 16 SIM8070 Hardware Design 2.3 PIN Description Table 3: Defination of the I/O Parameters Symble Description PIN Properties Power Input Power Output Analog Input Analog Output Digital Input Digital Output Digital Interface Pull Up and Pull Down No Pull Up or No Pull Down Pull Up Pull Down Table 4: Pin Properties...
  • Page 17 SIM8070 Hardware Design SPKR_OUT_N EAR_P EAR_N HPH_L HPH_REF HPH_R HS_DET √ GPIO_3 1.8V GPIO_3 B-PD GPIO_2 1.8V GPIO_2 B-PD MIC2_P MIC1_N MIC1_P PM6125_GPIO PWM1 PM6125_GPIO ADC1 0~ 1.875V RESERVED √ DEBUG_UART_RX 1.8V GPIO_17 DEBUG_UART_TX 1.8V GPIO_16 √ SENSOR_I2C_SCL 1.8V GPIO_29 B-PD SENSOR_I2C_SDA 1.8V...
  • Page 18 SIM8070 Hardware Design √ ACCEL_INT 1.8V GPIO_81 B-PD √ ALSP_INT_N 1.8V GPIO_91 B-PD √ MAG_INT_N 1.8V GPIO_82 B-PD ANT_TRX GPIO_113_PRI_MI2S_ 1.8V GPIO_113 B-PD GPIO_114_PRI_MI2S_ 1.8V GPIO_114 B-PD GPIO_115_PRI_MI2S_ 1.8V GPIO_115 B-PD DATA0 GPIO_116_PRI_MI2S_ 1.8V GPIO_116 B-PD DATA1 √ GPIO_95 1.8V GPIO_95 B-PD √...
  • Page 19 SIM8070 Hardware Design CAM_I2C0_SDA 1.8V GPIO_37 B-PD CAM_I2C0_SCL 1.8V GPIO_38 B-PD MIPI_CSI2_LANE1_N MIPI_CSI2_LANE1_P MIPI_CSI2_LANE0_N MIPI_CSI2_LANE0_P MIPI_CSI2_CLK_N MIPI_CSI2_CLK_P MIPI_CSI0_LANE3_N MIPI_CSI0_LANE3_P MIPI_CSI0_LANE2_N MIPI_CSI0_LANE2_P MIPI_CSI0_LANE1_N MIPI_CSI0_LANE1_P MIPI_CSI0_LANE0_N MIPI_CSI0_LANE0_P MIPI_CSI0_CLK_N MIPI_CSI0_CLK_P CAM_MCLK1 1.8V GPIO_35 B-PD CAM_MCLK0 1.8V GPIO_34 B-PD GPIO_7_TP_I2C_SCL 1.8V GPIO_7 B-PD TP_RST_N 1.8V GPIO_87 B-PD...
  • Page 20 SIM8070 Hardware Design MIPI_DSI0_CLK_P MIPI_DSI0_CLK_N MIPI_DSI0_LANE0_P MIPI_DSI0_LANE0_N MIPI_DSI0_LANE1_P MIPI_DSI0_LANE1_N MIPI_DSI0_LANE2_P MIPI_DSI0_LANE2_N MIPI_DSI0_LANE3_P MIPI_DSI0_LANE3_N USB_DP USB_DM VREG_L22A_2P96 2.96V √ SDCARD_DET_N 1.8V GPIO_98 B-PD SDC2_DAT3 1.8/2.95V SDC2_DAT2 1.8/2.95 V SDC2_DAT1 1.8/2.95 V SDC2_DAT0 1.8/2.95 V SDC2_CMD 1.8/2.95 V SDC2_CLK 1.8/2.95 V PM6125_GPIO PM_GPIO_01 1.8V PM6125_GPIO...
  • Page 21 SIM8070 Hardware Design UIM2_DATA 1.8/2.95 V GPIO_72 B-PD UIM2_CLK 1.8/2.95 V GPIO_73 B-PD UIM2_RESET 1.8/2.95 V GPIO_74 B-PD √ UIM2_DETECT 1.8V GPIO_75 B-PD GPIO_24_UART_TX 1.8V GPIO_24 B-PD √ GPIO_25_UART_RX 1.8V GPIO_25 B-PD GNSS_LNA_CTRL 1.8V B-PD √ GPIO_83 1.8V GPIO_83 B-PD √...
  • Page 22 SIM8070 Hardware Design 233 NC 234 GND 235 MIC_BIAS3 1.6~2.85V 236 MIC3_N 237 GND 238 MIPI_CSI1_CLK_P 239 MIPI_CSI1_CLK_N 240 MIPI_CSI1_LANE1_P 241 MIPI_CSI1_LANE1_N 242 MIPI_CSI1_LANE0_P 243 MIPI_CSI1_LANE0_N 244 MIPI_CSI1_LANE2_P 245 MIPI_CSI1_LANE2_N 246 MIPI_CSI1_LANE3_P 247 MIPI_CSI1_LANE3_N 248 GND 249 LCD_VSN -6.0~-4.0V 250 LCD_VSP 4.0~6.0V √...
  • Page 23 SIM8070 Hardware Design 253 GRFC_8 1.8V GPIO_58 B-PD PMI632_GPIO_ 254 PMI_GPIO_01 1.8V B-PD 255 GND √ 256 CAM_MCLK2 1.8V GPIO_36 B-PD 257 GND √ 258 CAM_MCLK3 1.8V GPIO_44 B-PD 259 GND √ 260 CAM2_RST_N 1.8V GPIO_42 B-PD √ 261 GPIO_123 1.8V GPIO_123 B-PD...
  • Page 24 SIM8070 Hardware Design PMI632_GPIO_ 291 PMI_GPIO_06 1.8V B-PD PMI632_GPIO_ 292 PMI_GPIO_02 1.8V B-PD √ 293 GPIO_130 1.8V GPIO_130 B-PD √ 294 GPIO_86 1.8V GPIO_86 B-PD 295 RED_LED 296 GREEN_LED 297 BLUE_LED 298 GND 299 GND 300 NC 301 RESERVED 302 MIC4_N 303 MIC4_P 304 TP_A 305 FLASH_LED1...
  • Page 25 SIM8070 Hardware Design 329 RESERVED 330 CBL_PWR_N 331 VREG_L14A_1P8 1.8V 332 BATT_ID 333 BATT_THERM 334 NC 335 GND 336 GND 337 VIB_DRV_P 338 GND 339 VBATT_SNS_P 340 VBATT_SNS_M 341 GND 342 RESERVED 343 RESERVED 344 GND 345 VREG_L15A_3P128 346 NC 347 GND 348 GND NOTE...
  • Page 26 SIM8070 Hardware Design If unused, keep it open. Power supply for external circuit. A parallel 2.2uF~ Mainly for the Audio Codec Power VREG_L14A_1P8 4.7uf capacitance is requi Supply red. If unused, keep it open.. 3V Secondary Power Supply Input VRTC PI/PO If unused, keep it open.
  • Page 27 SIM8070 Hardware Design USB Super-Speed Receiver M, USB0_SS_RX0_M or DP_LANE3_M for DP USB Super-Speed Transmitter P, USB0_SS_TX0_P or DP_LANE2_P for DP USB Super-Speed Transmitter M, USB0_SS_TX0_M or DP_LANE2_M for DP USB Super-Speed Receiver M, USB0_SS_RX1_M or DP_LANE0_M for DP USB Super-Speed Receiver P, USB0_SS_RX1_P or DP_LANE0_P for DP USB Super-Speed Transmitter P,...
  • Page 28 SIM8070 Hardware Design as configurable GPIO UIM1_CLK SIM Card1 Clock Signal UIM1_DATA DI/DO SIM Card1 Data Signal VREG_L19A_UIM LDO L19A Output for SIM Highly recommend Card1 Power Supply, external capacitor 1.8V/2.95V Dual Voltage 220nF parallel connection SDIO/SD Card Interface VREG_L5A_SDC2 Power Output, Only for pulling up the SD...
  • Page 29 SIM8070 Hardware Design MIPI_DSI0_LANE1_N AI/AO MIPI_DSI0_LANE2_P AI/AO MIPI_DSI0_LANE2_N AI/AO MIPI_DSI0_LANE3_P AI/AO MIPI_DSI0_LANE3_N AI/AO The MIPI data line MIPI_DSI1_CLK_P traces should have a LCD1 MIPI Signals 85Ω ± 15% differential MIPI_DSI1_CLK_N impedance. LCD0_RST_N LCD0 Reset Signal GPIO_89 LCD0 TE Signal GPIO_83 LCD0 ID PIN Power Domain: -6V ~ LCD_VSN...
  • Page 30 SIM8070 Hardware Design Default 2 Rear Camera, MIPI_CSI1_LANE2_N AI/AO MIPI CSI1 Data2 Negaitve The MIPI data line traces MIPI_CSI1_LANE2_P AI/AO MIPI CSI1 Data2 Positive should have a 85Ω ± 15% MIPI_CSI1_LANE1_N AI/AO MIPI CSI1 Data1 Negative differential impedance. MIPI_CSI1_LANE1_P AI/AO MIPI CSI1 Data1 Positive MIPI_ CSI1_LANE0_N AI/AO...
  • Page 31 SIM8070 Hardware Design Camera AFVDD LDO Enable GPIO_45 GPIO_131_CAM_AVD Camera AVDD LDO Enable Pin D1_2_2P85_EN VPH_OUT Camera AVDD/AFVDD LDO Power Domain: 3.0 ~ Power Supply, Highly 4.4V recommend an external capacitor of 2.2-4.7nF parallel connection. VREG_S6A_1P352 Camera DVDD(1.1V/1.2V) Typical value: 1.352V LDO Power Supply, Highly recommend an external capacitor of 2.2-4.7nF parallel...
  • Page 32 SIM8070 Hardware Design Negative Headphone Output EAR_P Positive Differential Pair Routing, Stereo Headphone Output ground plane EAR_N Negative Headphone Left- HPH_L Channel Isolate the Left- and the Right- Headphone Main HPH_REF Channel by the Main HPH_REF Reference Ground Ground, Stereo ground plane Headphone Right- HPH_R...
  • Page 33 SIM8070 Hardware Design Debugging DEBUG_UART_T Debug UART Data Transmitter ADC Interface ADC1 ADC Detection 1 Input Power Domain: 0 ~ 1.875V ADC2 ADC Detection 2 Input Power Domain: 0 ~ 1.875V MOTOR Interface VIB_DRV_P Motor Drive Positive Available for Linear Motor Flash LED Interface FLASH_LED1 Flash LED1 Channel...
  • Page 34 SIM8070 Hardware Design GPIO_15 DI/DO GPIO_15 GPIO_14 DI/DO GPIO_14 GPIO_33 DI/DO GPIO_33 Avoid an external pull up due to GPIO_101 120 DI/DO GPIO_101 the BOOT function GPIO_49 122 DI/DO GPIO_49 GPIO_24 182 DI/DO GPIO_24 UART_TX GPIO_25 183 DI/DO GPIO_25 UART_RX Avoid an external pull up due to GPIO_100 187 DI/DO...
  • Page 35 SIM8070 Hardware Design PMI_GPIO_02 292 DI/DO PMI_GPIO_02 PMI632 GPIO_02 Other Interface CBL_PWR_N Pull down for power on Internal GNSS LNA Control Signal If unused, keep it GNSS_LNA_CTRL Output open. Testing Pin, Connect to TP_A on the If unused, keep it TP_B module for security design open.
  • Page 36 SIM8070 Hardware Design 3 Interface Applications 3.1 Power Supply The VBAT Input power range of the SIM8070 module is 3.5V to 4.4V, and the typical voltage is 3.9V. The instantaneous peak current of the SIM8070 module could reach 3A. So, to enable the module is running smoothly, the power supply should be able to provide the peak current up to 3A.
  • Page 37 SIM8070 Hardware Design Highly recommend selecting a relative high efficiency switching power supply for hardware design when the difference between the input (DC Input) and the output (VBAT) is too large. The reference design is showing in Figure 4. U101 LM2596- ADJ DC INPUT L101 FB101...
  • Page 38 SIM8070 Hardware Design In Figure 5, C101 and C102 are two Low-ESR 100Uf tantalum capacitors. C103 is a 1uF to 10uF ceramic capacitor. The function of C104 and C105 is to decrease the high frequency interference. D101 is a 5V/1600W transient voltage suppression diode, preventing the chip from being damaged by surge. For PCB wiring, the capacitors and the diodes should be close to the VBAT Pin as far as possible, and the VBAT wiring should be as short as possible with the width at least 3mm.
  • Page 39 SIM8070 Hardware Design 1.8V KPD_PWR_N 4.7K 脉冲 SIM8070 Module Figure 7: Power On/Off Design with an OC Gate Highly recommend the customers consider the KPD_PWR_N Pin’s electrical characteristics when designing. The electrical characteristics are showing in Table 7. Table 7: KPD_PWR_N Features Parameters Description Minimum Typical...
  • Page 40 SIM8070 Hardware Design 3.2.3 Power Off Pull down the KPD_PWR_N Pin with at least 1s to power off the module. There is a pop up prompt window confirming the action of shutting down the device when the module detects the control instructions. Apart from that, pulling down the KPD_PWR_N Pin with over 8s would be forced restart the module.
  • Page 41 SIM8070 Hardware Design The reference designs for VRTC are showing below. ⚫ External Capacitor Power Supply for RTC Module VRTC Circuit Large Capacitor Figure 9: External Capacitor Power Supply for RTC ⚫ Non Rechargeable Battery Power Supply for RTC Module VRTC Circuit Rechargeable...
  • Page 42 SIM8070 Hardware Design The typical voltage of the VRTC is 3.0V. And the average current consumption is 20uA when disconnecting the VBAT and connecting the RTC only. The VRTC characteristics are showing in Table 8. Table 8: VRTC Features Parameters Description Typical Minimum Maximum Unit...
  • Page 43 SIM8070 Hardware Design level conversion Mainly for External VREG_L14A_1P8 Audio Codec Power VREG_L19A_UIM1 1.8/2.95 SIM Card1 Power VREG_L20A_UIM2 1.8/2.95 SIM Card2 Power VREG_L5A_SDC2 1.8/2.95 SDIO Pull up Power VREG_L21A_2P70 TP AVDD and LCD 2.704 AVDD2.8V Power VREG_L22A_2P96 2.96 SD Card Power VREG_L15A_3P12 3.128 DP Switching Power...
  • Page 44 SIM8070 Hardware Design ≥ 18 W Type-C Adopts INOV Micro-USB Algorithm, Adjustable with 200mV for Continuo Charging, Higher QC3.0 0.6V 3.3V us Mode charging efficiency, 3.6-12V Higher charging speed, Lower charging heat. SIM8070x series module could charge the battery. It supports several charging modes, including the trickle charging mode, the pre-charging mode, the constant current charging mode, and the other charging modes.
  • Page 45 SIM8070 Hardware Design SIM8070x series module has the function of battery detection. Generally, there is a BATT_ID Pin in the battery. Highly recommend an external 100KR resistor (R2) connecting to the ground when the battery has no BATT_ID. Avoid float. SIM8070x series module has the function of battery temperature detection.
  • Page 46 SIM8070 Hardware Design USB OTG. The speed for the USB3.1 is up to 10Gbps, and for the USB 2.0 is up to 480Mbps. It is downward compatible with full speed (12Mbps) mode. USB_HS interface supports the function of the AT command transmission, of the data transmission, of the software debugging, and of the software upgrading.
  • Page 47 SIM8070 Hardware Design SIM8070 Micro-USB Interface Micro-USB Module Connector USB_PHY_PS Float USB_PHY_PS CPU_USB_PHY_PS connects 10K CPU_USB_PHY_PS USB_VBUS_IN VBUS Highly Recommend USB_ID GPIO_43 USB_DP USB_DP USB_DM USB_DN <1pF Figure 14: USB Micro-USB Connection Reference Design 3.6.2 Micro-USB Interface and Type-C Interface Feature Table 13: DP and USB3.1 Type-C Compatible Pin Definition PIN Name PIN Num...
  • Page 48 SIM8070 Hardware Design the USB0_DP_AUX_P pin and the USB0_DP_AUX_M pin are needed in addition to the USB3.1 compatible pins. Highly recommend disconnect the Type-C interface and the DP_AUX_P/N signals when running with the USB function. A switch is needed in this case. The switch is closing by default. The DP_EN_N output is active low when switching into the DP interface.
  • Page 49 SIM8070 Hardware Design ⚫ Do not wiring the USB signals under the crystal oscillator, the oscillator, the magnetic devices, and the RF signals. Highly recommend routing in the inner layer and stereo ground plane. ⚫ Highly recommend the USB2.0 signals, the USB3.1 TX signals, and the USB 3.1 RX signals are wiring as differential pairs separately.
  • Page 50 SIM8070 Hardware Design GPIO_30 GPIO_30 SPI4_MISO UART5_CTS I2C5_SDA GPIO_31 GPIO_31 SPI4_MOSI UART5_RTS I2C5_SCL GPIO_32 GPIO_32 SPI4_CLK UART5_TX GPIO_33 GPIO_33 SPI4_CS_N UART5_RX GPIO_37 CCI_I2C_SDA0 CAM_I2C0_SDA GPIO_38 CCI_I2C_SCL0 CAM_I2C0_SCL GPIO_39 CCI_I2C_SDA1 CAM_I2C1_SDA GPIO_40 CCI_I2C_SCL1 CAM_I2C1_SCL ⚫ SIM8070x series module defines the default configuration for these pins highlighting in green. Please consult SIMCom staff to review the reference design and functions for these pins.
  • Page 51 SIM8070 Hardware Design VREG_L9A_1P8 SIM8070 Module 4.7K VREG_L9A_1P8 4.7K Figure 17: TX Voltage Level Shift Reference Design VREG_L9A_1P8 SIM8070 Module VREG_L9A_1P8 4.7K 4.7K Figure 18: RX Voltage Level Shift Reference Design 3.7.3 SPI Interface SIM8070x series module supports up to 4 sets of the SPI interfaces. They only support the host mode, and the highest working frequency is 50MHz.
  • Page 52 SIM8070 Hardware Design 3.7.4 I2C Interface SIM8070x series module supports up to 8 sets of the I2C interfaces, but only open the following 6 sets of the I2C interfaces by default. They only support the host mode, and the highest speed is 400Kbps. Highly recommend an external 2.2KR resister pulling up to the 1.8V power supply for I2C.
  • Page 53 SIM8070 Hardware Design GPIO_113_PRI_MI2S_SCK PRI_MI2S_SCK DI/DO PRI_MI2S Clock GPIO_114_PRI_MI2S_WS PRI_MI2S_WS DI/DO PRI_MI2S Word Select GPIO_115_PRI_MI2S_DATA0 PRI_MI2S_DATA0 DI/DO PRI_MI2S Data0 GPIO_116_PRI_MI2S_DATA1 PRI_MI2S_DATA1 DI/DO PRI_MI2S Data1 3.8 SD Card Interface SIM8070x series module supports SD 3.0/MMC cards with 4-Bit data interface or SDIO 3.0 devices. The SD cards comply with the following protocols.
  • Page 54 SIM8070 Hardware Design 3.9 TP Interface SIM8070x series module provides an I2C interface, an interruption function pin, and a reset pin, connecting the touching panel to operate. VREG_L9A_1P8 VREG_L9A_1P8 SIM8070 Module 2.2K TP Interface 2.2K 1 GND TP_RST_N 2 TP_RST_N TP_I2C_SCL 3 TP_I2C_SCL TP_I2C_SDA...
  • Page 55 SIM8070 Hardware Design SIM8070 GPIO_83 1 LCD_ID Module GPIO_89 2 DSI_TE LCD0_RST_N 3 LCD_RST 4 GND MIPI_DSI0_LANE2_P 5 TDP2 MIPI_DSI0_LANE2_N 6 TDN2 7 GND MIPI_DSI0_LANE1_P 8 TDP1 MIPI_DSI0_LANE1_N 9 TDN1 10 GND MIPI_DSI0_CLK_P 11 TCP MIPI_DSI0_CLK_N 12 TCN 13 GND MIPI_DSI0_LANE0_P 14 TDP0 MIPI_DSI0_LANE0_N...
  • Page 56 SIM8070 Hardware Design 3.11.1 CPHY & DPHY Interface of the Cameras SIM8070x series module supports CPHY 1.0. The difference between the CPHY and the DPHY are the different effective transmission mode. CPHY enables the data transmission speed faster through the following technical improvements.
  • Page 57 SIM8070 Hardware Design Lane2 MIPI_CSIx_DLN1_P MIPI_CSIx_TLN1_A MIPI_CSIx_DLN1_N MIPI_CSIx_TLN1_B Lane3 MIPI_CSIx_DLN2_P MIPI_CSIx_TLN1_C MIPI_CSIx_DLN2_N MIPI_CSIx_TLN2_A Lane4 MIPI_CSIx_DLN3_P MIPI_CSIx_TLN2_B MIPI_CSIx_DLN3_N MIPI_CSIx_TLN2_C 3.11.2 DPHY Applications SIM8070X eLDO VPH_PWR AVDD_0 Clock 2.8V GPIO_41 LANE#0 LANE#1 eLDO LANE#2 VREG_S6A_1P352 DVDD_0 LANE#3 1.05V GPIO_44 CSI0 GPIO_52 CAM0_PWD_N eLDO VPH_PWR AFVDD_0/1/2...
  • Page 58 SIM8070 Hardware Design 3.12 Audio Interface SIM8070x series module supports three analog audio inputs, including the MIC1 differential pair interface for the master microphone, the MIC3 differential pair interface for the denoising microphone, and the MIC2 single ended interface for the audio jack. ⚫...
  • Page 59 SIM8070 Hardware Design SIM8070 BIAS DMIC1 Module DATA 0.1uF MIC_BIAS1 BIAS DMIC2 DMIC1_CLK DATA DMIC1_DATA BIAS DMIC3 DATA 0.1uF BIAS MIC_BIAS3 DMIC4 DMIC2_CLK DATA DMIC2_DATA Figure 26: Digital Microphone Reference Design 3.12.2 Headphone Interface Place close to the headset jack. Reserved magnetic beads or 0R resistor for debugging.
  • Page 60 SIM8070 Hardware Design Table 19: Headphone Output Feature Parameter Testing Condition Minimum Typical Maximum Unit Output Power Input = 0 dBFS Output Voltage Input = 0 dBFS 0.94 0.99 Vrms Ω Loads Ω Off Impedance 3.12.3 Speaker Interface SIM8070x series module integrates a Class-D Type audio power amplifier (PA) internally. The PA integrates an internal SPKR_BOOST (Maximum Output Voltage 5.5V) circuit.
  • Page 61 SIM8070 Hardware Design 3.12.4 Handset Interface Place close to the Handset Differential Pair Wiring SIM8070 & Stereo ground plane Module 33pF 10pF 33pF 10pF EAR_P 33pF 10pF 33pF 10pF EAR_N 33pF 10pF 33pF 10pF Figure 29: Handset Reference Design Table 21: Handset Output Feature Parameter Testing Condition Minimum Typical...
  • Page 62 SIM8070 Hardware Design SIM8070 UIM_DET Default Configuration is low active: UIM Card Module UIM Card no DET Pin: Connect R1, R3, Disconnect R2 R1/100K/NC UIM Card with DET Pin: Disconnect R1, R3, Connect R2 VREG_L9A_1P8 VREG_UIM UIM_RESET UIM_CLK R3/0R/NC UIM_DET UIM_DATA 22pF 100nF...
  • Page 63 SIM8070 Hardware Design 1/3 channel end-to-end Calibrated data result accuracy kΩ 100 K pull-up Trimmed value 99.5 100.5 kΩ 400 K pull-up Trimmed value kΩ 30 K pull-up Trimmed value 29.7 30.3 1/1 channel AMUX input MΩ resistance 1/3 channel AMUX input MΩ...
  • Page 64 SIM8070 Hardware Design 3.16 Motor Interface VIB_DRV_P SIM8070 Motor Module Figure 31: Motor Interface Reference Design 3.17 LED Interface SIM8070x series module supports RGB tri-color indicator. Selecting a LED chip with the common cathode is needed. The maximum current on each channel is 12mA, and it supports PWM debugging. SIM8070 Module RED_LED 100nF...
  • Page 65 SIM8070 Hardware Design SIM8070x series module offers two channels of efficient FLASH_LED interface. The maximum current on each channel is 1.5A. SIM8070 Module FLASH_LED1 100nF FLASH_LED2 100nF 1.5A 1.5A Figure 33: Flash LED Interface Reference Design 3.19 Forced Emergency Download Interface SIM8070x series module offers a FORCED_USB_BOOT Pin, which is an emergency download interface.
  • Page 66 SIM8070 Hardware Design 4 WIFI & BT SIM8070x series module offers a common antenna interface combining the WIFI and the BT function. The customers could connect the external WIFI and BT two in one antenna via this interface. In the TDD mode, the WIFI and the BT coexist.
  • Page 67 SIM8070 Hardware Design 802.11n HT20 MCS7 14dBm± 2dB 802.11n HT40 MCS0 15dBm± 2dB 802.11n HT40 MCS7 14dBm± 2dB 802.11ac VHT20 MCS0 15dBm± 2dB 802.11ac VHT20 MCS8 13dBm± 2dB 802.11ac VHT40 MCS0 15dBm± 2dB 802.11ac VHT40 MCS9 10dBm± 2dB 802.11a OFDM 6Mbps 16dBm±...
  • Page 68 SIM8070 Hardware Design 802.11a OFDM 6Mbps < -85dBm OFDM 802.11a < -68dBm 54Mbps 802.11n HT20 MCS0 < -85dBm 802.11n HT20 MCS7 < -67dBm 802.11n HT40 MCS0 < -82dBm 802.11n HT40 MCS7 < -64dBm 802.11n HT80 MCS0 < -79dBm 5GHz 802.11n HT80 MCS7 <...
  • Page 69 SIM8070 Hardware Design 5 Antenna Interface SIM8070x series module has the WIFI/BT antenna. To ensure the well RF performance of the products, the RF lines wiring through the antenna pin to the antenna interfaces must meet the following requirements. ⚫ Ensure the RF lines are wiring with the 50Ω...
  • Page 70 SIM8070 Hardware Design WIFI/BT Antenna RF Testing Interface (Optional) Antenna Matching Circuit ANT_WIFI/BT SIM8070 Module Figure 35: WIFI/BT Antenna Reference Design In Figure 35, R1, C1 and C2 are the antenna matching components. All these three components are adjustable to match the efficient and effective communication quality based on the interface debugging result. Selecting R1 with 0R resistor by default, and reserved C1 and C2 with disconnection by default.
  • Page 71 SIM8070 Hardware Design Table 29: Two Layers PCB Microstrip-slot Line Structure Impedance Control Feature Thickness Signal Thickness Signal Layer Reference Layer Impedance Width 0.035mm Layer1 Layer2 50 ohm 1.7mm（67 mil） 3mm（118 mil） 1.6mm 0.035mm Layer1 Layer2 50 ohm ⚫ Coplanar Waveguide-slot Line Layer1 Prepreg Layer2...
  • Page 72 SIM8070 Hardware Design Layer1 Prepreg Layer2 Prepreg Layer3 Prepreg Layer4 Figure 39: Four Layers PCB Coplanar Waveguide-slot Line Structure (Reference Layer Four) To ensure the well RF performance of the products, the RF lines wiring through the antenna pin to the antenna interfaces must meet the following requirements.
  • Page 73 SIM8070 Hardware Design 5.3 Antenna Installation 5.3.1 Passive Antenna Reference Design SIM8070x series module’s antenna interface installation requirements are showing as follows. Table 31: Antenna Installation Requirements Parameters’ Requirements Antenna Standing wave ratio: ≤ 2 Gain (dBi): (2.4G:4.01dBi; 5G:4.32dBi) Maximum Input Power (W): 50 Wi-Fi/BT Input Impedance (Ω): 50 Polarization Type: Vertical...
  • Page 74 SIM8070 Hardware Design 5.3.2 RF Connector Highly recommend pick the Hirose U.FL-R-SMT’s RF connector. Figure 40: Hirose U.FL-R-SMT Connector’s Size and Package www.simcom.com 74 / 103...
  • Page 75 SIM8070 Hardware Design 6 PCB Wiring This chapter mainly introduces the requirements in PCB layout wiring. The purpose is to minimize the interference issue, to optimize the product performance, and to shorten the Research and Development (R&D) cycle. 6.1 Stack Selection Highly recommend at least a four-layer through holes PCB layout design to facilitate impedance control and signal line shielding.
  • Page 76 SIM8070 Hardware Design 6.2.2 Power Supply & Ground Highly recommend wiring the VBAT positive electrode as short and thick as possible. Highly recommend wiring through large capacitors and zener diodes before connecting to the power supply pin of the module. Considering the backflow ground of the power supply is necessary when routing.
  • Page 77 SIM8070 Hardware Design MIPI_DSI0_LANE0_N 22.62487 MIPI_DSI0_LANE1_P 24.58209 0.05437 MIPI_DSI0_LANE1_N 24.52772 MIPI_DSI0_LANE2_P 23.8138 -0.00801 MIPI_DSI0_LANE2_N 23.82181 MIPI_DSI0_LANE3_P 26.20781 0.10733 MIPI_DSI0_LANE3_N 26.10048 MIPI_DSI1_CLK_P 38.36899 -0.022 MIPI_DSI1_CLK_N 38.39099 MIPI_CSI0_CLK_P 43.49614 0.03677 MIPI_CSI0_CLK_N 43.45937 MIPI_CSI0_LANE0_P 43.19501 -0.02627 MIPI_CSI0_LANE0_N 43.22128 MIPI_CSI0_LANE1_P 41.48986 0.09991 MIPI_CSI0_LANE1_N 41.38995 MIPI_CSI0_LANE2_P 40.84356 -0.06422...
  • Page 78 SIM8070 Hardware Design Table 33: SIM8070EU EMMC Memory MIPI Lane Wiring Difference PIN Num PIN Name Length (mm) Difference (mm) MIPI_DSI0_CLK_P 22.09228 -0.04413 MIPI_DSI0_CLK_N 22.13641 MIPI_DSI0_LANE0_P 22.60134 -0.02353 MIPI_DSI0_LANE0_N 22.62487 MIPI_DSI0_LANE1_P 24.58209 0.05437 MIPI_DSI0_LANE1_N 24.52772 MIPI_DSI0_LANE2_P 23.8138 -0.00801 MIPI_DSI0_LANE2_N 23.82181 MIPI_DSI0_LANE3_P 26.20781 0.10733...
  • Page 79 SIM8070 Hardware Design MIPI_CSI2_LANE2_P 38.24629 -0.52278 MIPI_CSI2_LANE2_N 38.76907 MIPI_CSI2_LANE3_P 36.58696 0.02569 MIPI_CSI2_LANE3_N 36.56127 Table 34: SIM8070EU UFS Memory MIPI Lane Wiring Difference PIN Num PIN Name Length (mm) Difference (mm) MIPI_DSI0_CLK_P 22.09228 -0.04413 MIPI_DSI0_CLK_N 22.13641 MIPI_DSI0_LANE0_P 22.60134 -0.02353 MIPI_DSI0_LANE0_N 22.62487 MIPI_DSI0_LANE1_P 24.5562 0.01613...
  • Page 80 SIM8070 Hardware Design MIPI_CSI2_CLK_N 37.15631 MIPI_CSI2_LANE0_P 37.7103 0.23511 MIPI_CSI2_LANE0_N 37.47519 MIPI_CSI2_LANE1_P 35.21007 -0.09983 MIPI_CSI2_LANE1_N 35.3099 MIPI_CSI2_LANE2_P 38.24629 -0.52278 MIPI_CSI2_LANE2_N 38.76907 MIPI_CSI2_LANE3_P 36.58696 0.02569 MIPI_CSI2_LANE3_N 36.56127 6.2.5 USB The requirements for the USB signal are showing as follows. ⚫ Highly recommend place the common mode inductance close to the USB connector. ⚫...
  • Page 81 SIM8070 Hardware Design USB0_SS_RX1_M 13.81935 USB0_SS_TX1_P 17.5102 0.01076 USB0_SS_TX1_M 17.49944 USB0_DP_AUX_P 8.99155 0.02566 USB0_DP_AUX_M 8.96589 Notice that the SIM8070CE module and the SIM8070EU module has different USB wiring routes. Table 36: SIM8070EU EMMC Memory USB Wiring Length PIN Num Length (mm) Difference (mm) PIN Name USB_DP...
  • Page 82 SIM8070 Hardware Design 6.2.6 SD Card The requirements for the SD card signal are showing as follows. ⚫ Highly recommend a complete stereo ground plane and the full reference ground. Differential pair routings with 50Ω differential impedance and the error at ± 10%. ⚫...
  • Page 83 SIM8070 Hardware Design 57.87381 SDC2_DAT2 57.70412 SDC2_DAT1 56.87189 SDC2_DAT0 55.6423 SDC2_CMD 53.32648 SDC2_CLK 6.2.7 Audio The requirements for the audio signal are showing as follows. ⚫ Highly recommend wiring the audio signal lines away from the antennas, the RF signal lines, and other high-speed signal lines.
  • Page 84 SIM8070 Hardware Design 7 Electrical & Reliability 7.1 Absolute Maximum Value Table 41: Absolute Maximum Value Parameter Minimum Description Maximum Unit VBAT -0.3 DC Supply Voltage VBUS -0.3 USB 5V Supply Voltage VRTC Backup Battery Supply Voltage 7.2 Temperature Range Table 42: Temperature Range Parameter Minimum...
  • Page 85 SIM8070 Hardware Design 7.4 Digital Interface Feature Table 44: SDC2 Interface Electrical Feature (1.8V) Parameter Description Minimum Typical Maximum Unit High Level Input Voltage 1.27 Low Level Input Voltage -0.3 0.58 High Level Output Voltage Low Level Output Voltage 0.45 Table 45: SDC2 Interface Electrical Feature (2.96V) Parameter Description...
  • Page 86 SIM8070 Hardware Design 7.5 Current Consumption (VBAT = 3.9V) Table 48: Current Consumption Parameter Condition Minimum Typical Maximum Unit Shutdown Leakage Shutdown Leakage Current Current Flight Mode Flight Mode GSM/GPRS BS-PA-MFRMS=2 4.10 BS-PA-MFRMS=5 3.87 Standby BS-PA-MFRMS=9 3.78 Current 3.305 WCDMA, 2.56sec,DRX=8 3.56 LTE-FDD, standby 2.56s, DRX=8 3.598...
  • Page 87 SIM8070 Hardware Design 8 Manufacture & Production 8.1 Top- and Bottom-View of the Module Figure 41: Top- and Bottom-View of the Module NOTE This picture is the effect drawing of the module design. www.simcom.com 86 / 103...
  • Page 88 SIM8070 Hardware Design 8.2 Mechanical Dimensional Size Figure 42: Three-Dimensional Size (Unit: mm) www.simcom.com 87 / 103...
  • Page 89 SIM8070 Hardware Design 8.3 Recommend Physical Outline Drawing Figure 43: Recommend Physical Outline Drawing (Unit: mm) www.simcom.com 88 / 103...
  • Page 90 SIM8070 Hardware Design 8.4 Recommend Physical SMT Stencil Drawing Figure 44: Recommend Physical SMT Stencil Drawing (Unit: mm) www.simcom.com 89 / 103...
  • Page 91 SIM8070 Hardware Design 8.5 Recommend Temperature Curve of Reflow Furnace Figure 45: Recommend Temperature Curve of Reflow Furnace NOTE Please review the “Module Secondary-SMT-UGD” for detailed information on the module transmission, manufacture, and production. 8.6 Moisture Sensitivity Level (MSL) Modules are shipped in vacuum-sealed aluminum foil bag bags, vacuum-packed according to IPC/JEDEC www.simcom.com 90 / 103...
  • Page 92 SIM8070 Hardware Design specification J-STD-020C ⚫ Recommended storage Range: temperature of 23±5 ° C, and the relative humidity is 35% ~ 60% ⚫ Storage period (vacuum-sealed packed) : The recommended storage period is 12 months The SIM8070x module meets the Moisture sensitivity level 3. The following table lists the shelf life of the module after unpacking.
  • Page 93 SIM8070 Hardware Design Table 51: Baking Requirements Optional Baking Condition Baking Period 120° C± 5° C，<5% RH 8 Hours NOTE 1. It is not recommended to expose the module to the air for a long time after disassembling the vacuum packaging.
  • Page 94 SIM8070 Hardware Design Figure 47: Module Tray Size Table 52: Module Tray Size Length（± 3mm） Width（±3mm） Standard Packaging Num 242.0 161.0 The small carton size of the SIM8070x series module is showing as follows. Figure 48: Small Carton Size www.simcom.com 93 / 103...
  • Page 95 SIM8070 Hardware Design Table 53: Small Carton Size Length（± 10mm） Width（± 10mm） Height（± 10mm） Standard Packaging 8*19-2=150 The big carton size of the SIM8070x series module is showing as follows. Figure 49: Big Carton Size Table 54: Big Carton Size Length（±...
  • Page 96 SIM8070 Hardware Design 9 Recommend Devices Table 55: Recommend Cameras Lists Direction Resolution Model Vendor Front/Back 2M GC2145 GALAXYCORE OV5675 OmniVision OV5695 OmniVision Front S5K5E9 SAMSUNG OV8856 OmniVision OV12A OmniVision S5K2L7SA03 SAMSUNG IMX362 SONY MX486 SONY AR1337 ON Semiconductor OV13855 OmniVision Back OV13880...
  • Page 97 SIM8070 Hardware Design Table 57: Recommend Gyroscope Sensors Lists Part Number Vendor Accelerometer Gyroscope √ √ BMA222E Bosch √ √ BMA250E Bosch √ √ BMA253 Bosch √ √ BMA255 Bosch √ BMG160 Bosch √ √ BMI120 Bosch √ √ BMI160 Bosch √...
  • Page 98 SIM8070 Hardware Design AK09915D AK09916C AK09918C HSCDTD008A Alps BMM150 Bosch BMM160 Bosch GMC306 Globalmems IST8305 iSentek IST8306 iSentek IST8307 iSentek IST8310 iSentek MXG4300 MagnaChip MMC3530 MEMSIC MMC3630 MEMSIC MMC3630KJ MEMSIC MMC5603NJ MEMSIC STM350MC Senodia STM480MW Senodia LIS2MDL AF6133 Voltafield AF6133E Voltafield AF8133J Voltafield...
  • Page 99 SIM8070 Hardware Design √ √ STK3327 Sensortek √ √ STK3328 Sensortek √ √ STK3332 Sensortek √ √ STK3335 Sensortek √ √ STK3338 Sensortek √ √ V2000 Sensortek √ PA22401001 √ √ PA22A00001 Table 60: Recommend Pressure Sensors Lists Part Number Vendor BME680 Bosch...
  • Page 100 SIM8070 Hardware Design 10 Appendix 10.1 Relative Documents Table 61: Relative Documents Document Name Description Digital cellular telecommunications (Phase 2+); AT command GSM 07.07： set for GSM Mobile Equipment (ME) GSM 07.10： Support GSM 07.10 multiplexing protocol Digital cellular telecommunications (Phase 2+); Use of Data Terminal Equipment –...
  • Page 101 SIM8070 Hardware Design Electromagnetic compatibility and Radio spectrum Matters (ERM); Base Stations (BS) and User Equipment (UE) for IMT- 2000. Third Generation cellular networks; Part 2: Harmonized [13] EN 301 908-02 V2.2.1 EN for IMT-2000, CDMA Direct Spread (UTRA FDD) (UE) covering essential requirements of article 3.2 of the R&TTE Directive [14]...
  • Page 102 SIM8070 Hardware Design Discontinuous Transmission Enhanced Full Rate EGSM Enhanced GSM Electrostatic Discharge Effective series resistance European Telecommunication Standard EVDO Evolution data optimized Frequency division duplex Full Rate GNSS Global navigation satellite system GPIO General-purpose input/output GPRS General Packet Radio Service Graphics processing unit Global Standard for Mobile Communications Half Rate...
  • Page 103 SIM8070 Hardware Design Subscriber Identification Module Short Message Service Surface mount technology Serial peripheral interface Time Division Distortion Terminal Equipment, also referred to as DTE Transmit Direction UART Universal Asynchronous Receiver & Transmitter User identity module Unsolicited Result Code Universal serial bus USSD Unstructured Supplementary Service Data WCDMA...
  • Page 104 SIM8070 Hardware Design GSM cellular terminals or mobiles operate over radio frequency signals and cellular networks and cannot be guaranteed to connect in all conditions, especially with a mobile fee or an invalid SIM card. While you are in this condition and need emergent help, please remember to use emergency calls.
  • Page 105 SIM8070 Hardware Design CE Statement Extreme temperature: -30-75℃ This product can be used across EU member states. Declaration of Conformity Hereby, SIMCom Wireless Solutions Limited declares that this Wireless Data Module product is in compliance with essential requirements and other relevant provisions of RED 2014/53/EU. A copy of the Declaration of conformity can be found at www.simcom.com Declaration of Conformity Hereby, SIMCom Wireless Solutions Limited declares that the radio equipment type Wireless Data Module with...
  • Page 106 SIM8070 Hardware Design FCC Statement This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions: (1) this devi ce may not cause harmful interference, and (2) this device must accept any interference received, including inte rference that may cause undesired operation.
  • Page 107 SIM8070 Hardware Design Integration instructions for host product manufacturers according to KDB 996369 D03 OEM Manual v01 2.2 List of applicable FCC rules FCC Part 15 Subpart C 15.247 & 15.207 & 15.209 FCC Part 15, Subpart E 15.407& 15.207 & 15.209 2.3 Specific operational use conditions Wireless Data Module with BT Dual mode, 2.4G WiFi and 5G WiFi Frequency Range:...
  • Page 108 SIM8070 Hardware Design 2.8 Label and compliance information Host product manufacturers need to provide a physical or e-label stating “Contains FCC ID: ” with 2AJYU-8XK0002 their finished product. 2.9 Information on test modes and additional testing requirements Host manufacturer must perfom test of radiated & conducted emission and spurious emission, etc according to the actual test modes for a stand-alone modular transmitter in a host, as well as for multiple simultaneously transmitting modules or other transmitters in a host product.