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A P P E N D I X B
Specifications
Table B-1. QLA2xxx Board Operating Environment
Environment
Operating temperature
Storage temperature
Relative humidity (noncondensing)
Storage humidity (noncondensing)
Table B-2. QLA2xxx Board Specifications
Type
Specification
Host bus
Conforms to PCI Local Bus Specification, revision 2.1
PCI signaling
3.3 V and 5.0 V busses supported
environment
PCI transfer rate
264 Mbytes/sec maximum burst rate for 33 MHz operation
(ISP2200 chip)
528 Mbytes/sec maximum burst rate for 66 MHz operation
(ISP2200A chip)
Fibre Channel
Bus type:
specifications
Bus transfer rate:
Central process-
Single-chip design that includes a Reduced Instruction Set Com-
ing unit (CPU)
puter (RISC) processor, Fibre Channel protocol manager, Periph-
eral Component Interconnect Direct Memory Access (PCI DMA)
controller, and 1-gigabit transceivers
Host data trans-
64-bit, bus master DMA data transfers to 264 Mbytes/sec
fer
RAM
128K bytes of something Random Access Memory (SRAM),
optionally expandable to 256K bytes
BIOS ROM
128K bytes of flash Read-Only Memory (ROM) in two 64K-byte,
software selectable banks. The flash is field programmable.
Minimum
0 C/32 F
-20 C/-4 F
10%
5%
copper media, twisted pair (QLA2200)
fibre optic media (QLA2200F)
100 Mbytes/sec maximum
Maximum
55 C/131 F
70 C/158 F
90%
95%
Specifications
B-1
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