CAUTION
Danger
of explosion
if battery
is incorrectly
re-
placed. Replace only with the same
or equivalent
type recommended by the equipment manufacturer.
Discard used batteries according to manufacturer's
instructions.
ADVARSEL
!
Lithiumbatteri-Eksplosionsfare ved fejlagtig handtering.
Udskiftning ma kun ske med batteri
af samme fabrikat og type.
Lever det brugte batteri tilbage til leverandcren.
ADVARSEL
Lithiumbatteri-Eksplosjonsfare.
Ved utskifting benyttes kun batteri som
anbefalt av apparatfabrikanten.
Brukt batteri returneres apparatleverand¢ren.
VARNING
Explosionsfara
vid felaktigt
batteribyte.
Anvand
samma
batterityp eller en likvardig typ som
rekommenderas
av
apparattillverkaren. Kassera anvant batteri enligt gallande
foreskrifter.
VAROITUS
Paristo voi rdjahtad, jos se on virheellisesti asennettu. Vaihda
paristo ainoastaan laitevalmistajan suosittelemaan tyyppiin.
Havita kaytetty paristo valmistajan ohjeiden mukaisesti.
SERVICING NOTES
FLEXIBLE CIRCUIT BOARD REPAIRING
e Keep the temperature of the soldering iron around 270°C
during repairing.
@ Do not touch the soldering iron on the same conductor of
the circuit board (within 3 times).
e Be careful not to apply force on the conductor when solder-
ing or unsoldering.
NOTES ON CHIP COMPONENT
REPLACEMENT
e Never reuse a disconnected chip component.
@ Notice that the minus side of a tantalum capacitor may be
damaged by heat.
TABLE OF CONTENTS
Section
Title
Page
1.
GENERAL
@ What is the Non-Tracking (NT) Format?
.......... 4
@ Parts [dentincation:.
s5s5 meus east
see
kaoess 5
@ Display:
tsps twat sb whee ise
nV
eee es 6
@ Power Sources:
4. 2545.6 ca ketu iwi chvcaceans bacaeecevs 6
@ Setting the Date and Time..............-
0c cee eee 8
@ RECOrdING
ie
FS Ba
ao 89s ROR
ees
9
@ Listening to a tape .........
ccc eee
eee ee ee eee 12
2.
DISASEMBLY
2-1,-."
Case GipperVAssy:
'26iccewdarni«
vad on aeevedinas 14
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« Wiann Assy i caoS een sian o a
eletoawelw
Bedstead 14
Qos
MD ASSY Los
ostacraiae ein
tie asset ea s8 15
gd,
AUD RSSy Oe
oe 5 eo
eee ee
eh, Oise et peat ae
ees 15
Bos. . VED PAGSY 13 ote gs ad nctle ace vente tare ces auEt eNIe iat eaallD
3.
ASSEMBLY
3-1.
How to Assembly of Main Flexible Board ........ 16
4.
DIAGRAMS
At ° (Pin: FMnctions:
-scndelaswcdaeicacisee
or ee es 18
4-2.
Semiconductor Load Layouts
Mains Section: (N fl)"
esos
wltevvate rida. 22
4-3,
Printed Wiring Boards —Main Section (NT-1)—
..23
4-4,
Schematic Diagram —Main Section (NT-1)—_
....27
4-5.
Printed Wiring Board —Connection Adaptor
Séction (NTU 2)
sdetnsa
hawk
etn os Sede 31
4-6.
Semiconductor Lead Layouts —Connection
Adaptor Section (NTU-2)—
........
2... cece eee 31
4-7.
Schematic Diagram —Connection Adaptor
Section (NTU)
s..2c.aen
teu gasnes doves 33
5.
EXPLODED VIEWS
Hel - Cabinet Section
20.4e 005 a4c04 4 a wenwre aera
tects 37
5-2.
Mechanism Deck Section 1 ..................0.-- 38
5-3.
Mechanism Deck Section 2 .............:0 eevee 39
5-4.
Mechanism Deck Section 3 ..................--45 40
5-0.
Connection Adaptor (NTU-2)
................005. 4]
6.
ELECTRICAL
PARTS LIST
...................... 42
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