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Realtek RTL8762D Hardware Instruction Manual

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RTL8762D Hardware Instruction
V1.1
2023/05/12
Realtek Semiconductor Corp.
No.2, Innovation Road II, Hsinchu Science Park, Hsinchu 300, Taiwan
Tel.: +886-3-578-0211. Fax: +886-3-577-6047
www.realtek.com

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  • Page 1 RTL8762D Hardware Instruction V1.1 2023/05/12 Realtek Semiconductor Corp. No.2, Innovation Road II, Hsinchu Science Park, Hsinchu 300, Taiwan Tel.: +886-3-578-0211. Fax: +886-3-577-6047 www.realtek.com...
  • Page 2 RTL8762D Hardware Instruction COPYRIGHT ©2023 Realtek Semiconductor Corp. All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language in any form or by any means without the written permission of Realtek Semiconductor Corp.

  • Page 3: Revision History

    RTL8762D Hardware Instruction Revision History Date Version Comment Author Reviewer 2021/11/10 V0.1 First Draft 2022/10/20 V1.0 Revise Format Oliver David 2023/05/12 V1.1 Add Disclaimer Oliver Copyright 2023 Realtek Semiconductor Corporation. All Rights Reserved.

  • Page 4: Table Of Contents

    13.3 RF trace impedance .......................... 21 14 PCB Layout Guide ..........................22 14.1 Component Layout Order ......................... 22 14.2 DC/DC Circuit Components Placement & Layout ................ 22 14.3 Power Bypass Capacitor Layout ...................... 24 Copyright 2023 Realtek Semiconductor Corporation. All Rights Reserved.
  • Page 5 14.9 MP Test Points ..........................33 15 Layout Rules for Two-layer Board ......................34 16 ESD Protection for MP ........................... 35 17 Debug Process ............................36 18 Differences between RTL8762C&RTL8762D ..................37 Copyright 2023 Realtek Semiconductor Corporation. All Rights Reserved.
  • Page 6 RTL8762D Hardware Instruction Table List Table 2-1 RTL8762D Series chip configuration table ..................2 Table 4-1 PBCFrequency offset example ......................5 Table 4-2 default value of Internal Cap setting (12pF) ..................8 Table 4-3 crystal datasheet ............................. 8 Table 14-1 MP Test Points ..........................33 Copyright 2023 Realtek Semiconductor Corporation.
  • Page 7 Figure 13-2 RF trace impedance .......................... 21 Figure 14-1 DC/DC Circuit ..........................22 Figure 14-2 RF impedance calculation tool ......................27 Figure 14-3 RF circuit ............................27 Figure 15-1 Layout of two-layer board routing ....................34 Copyright 2023 Realtek Semiconductor Corporation. All Rights Reserved.

  • Page 8: Special Instruction

    RTL8762D Hardware Instruction 1 Special Instruction RTL8762D is generally used to refer to all ICs without special marks. Copyright 2023 Realtek Semiconductor Corporation. All Rights Reserved.

  • Page 9: Chip Configuration

    RTL8762D Hardware Instruction 2 Chip configuration RTL8762D series chip configuration is shown below. Table 2-1 RTL8762D Series chip configuration table RTL8752DJF RTL8762DGF RTL8762DJF RTL8762DW RTL8762DK RTL8762DKF RTL8762DDF package QFN32 QFN40 QFN56 QFN48 QFN48 Flash type Internal internal external external internal VBAT range 1.8~3.3V...

  • Page 10: Reset

    (~100K ohm) resistance. It is recommended to add an external capacitor to this pin. If the IC reset function is not needed, it is required to add a 10K pull-up resistor externally. Copyright 2023 Realtek Semiconductor Corporation. All Rights Reserved.

  • Page 11: Crystal Requirements

    4 Crystal Requirements  40MHz crystal Clock source for MCU in active state. RTL8762D could use the 40M crystal with CL of 7 or 9 pf. Please refer to the rBom list in the HDK documentation for crystal oscillator specifications.

  • Page 12: Frequency Offset Calibration Instruction

    4. It is found that the frequency offset distribution obviously drifts in a certain direction, for example, the frequency offset is +XX KHz. 5. The proportion of products in the range of +25KHz ~ +30KHz or -25KHz ~ -30KHz begins to increase. Copyright 2023 Realtek Semiconductor Corporation. All Rights Reserved.

  • Page 13: Crystal Start-Up Waiting Time Settings

    In addition, the PCBA crystal start-up time can be measured by an oscilloscope. The crystal start-up time test procedure is as follows. Figure 4-3 crystal start-up time test platform Copyright 2023 Realtek Semiconductor Corporation. All Rights Reserved.
  • Page 14 3V. 1) When the RTL8762D chips are switched from the DLPS state to the active state, observe the waveform on the red DuPont line, which is coupled from the waveform of 40MHz XTAL xo pin on the gray DuPont line in the twisted pair.
  • Page 15 0.52*2 >1.04 TZ0308D （CL=9pF） 0.53*2 >1.06 -72.5 0.55*2 >1.1 Xtal CL was the parameter in crystal datasheet. Table 4-3 crystal datasheet 3.0 pF max Shunt Capacitance(Co) Load Capacitance(CL) 9 pF Aging +/-2ppm/year Copyright 2023 Realtek Semiconductor Corporation. All Rights Reserved.

  • Page 16: Pad

    RTL8762D Hardware Instruction 5 PAD RTL8762D has 3 types of IO PAD. 1. Digital IO Only used for digital signal, supports all function in pin mux table. 2. Analog/Digital IO Supports ADC (include AUXADC and Audio ADC) and all digital IO function.

  • Page 17: Flash

    RTL8752DJF, RTL8762DJF/DDF, RTL8762DKF contains internal Flash. 6.1 Bypass mode When RTL8762D power on or reset, if P0_3 is pulled low, the code in flash would be bypassed (not be erased) and IC would execute Rom code. Note: P0_3 will be changed to Log output after power-on. It is necessary to return P0_3 to the floating state as soon as possible after power-on or pull P0_3 down to GND with 500ohm series resistor.

  • Page 18: Special Notes

    5. GPIO to PAD mapping has multiplexing, for detailed information refer to RTL8762D_IOPin_Information. 6. SPI run@45MHz must use specified Pin, for detailed information refer to RTL8762D_IOPin_Information. 7. Some IO pins have default function while powered on, for detailed information refer to RTL8762D_I OPin_Information. Copyright 2023 Realtek Semiconductor Corporation. All Rights Reserved.

  • Page 19: Audio Microphone

    8.1 Analog MEMS MIC MEMS MIC differential connection to RTL8762D is shown in the following schematic. It is suggested to use differential connection from the MEMs to the BT chip to suppress common-mode noise on PCB. P2_7 is MIC_P, P2_ 6 is MIC_N, and these two signal ports could not be swapped.

  • Page 20: Digital Mic

    8.2 Digital MIC Digital MIC connection to RTL8762D is shown in Figure 8-2. Any IO can be used to connect to digital MIC CLK and DATA pin, because RTL8762D can use PINMUX function to switch DMIC interface to any IO pin in IC.

  • Page 21: Auxadc & Lpc

    VBAT and the IC may start unexpectedly. The RTL8762D has a built-in low-power comparator that can wakeup the chip when the voltage is greater or less than the setting value. It can be switched to either ADC Channel or VBAT Channel.
  • Page 22 Hence, divide mode is not suitable for the application which is connected to large external impedance. VBAT channel is only available in Divide mode. Power supply voltage of VBAT pin can be tested inside the chip. Figure 9-4 Divide mode Copyright 2023 Realtek Semiconductor Corporation. All Rights Reserved.

  • Page 23: Dc/Dc Buck Converter

    10 DC/DC Buck Converter RTL8762D integrates a DC/DC Buck converter. HVD pin is used as Buck input pin, while LX pin is used as Buck output pin. A 4.7uF cap must be attached to HVD pin, and LX pin must be connected to a 2.2uH power inductor.

  • Page 24: Efuse Programming

    RTL8762D Hardware Instruction 11 eFuse Programming RTL8762D has internal eFuse. The security mechanism requires to program the eFuse inside the IC during mass production. VBAT must be exactly 2.5V (±10%) when programming eFuse. eFuse area can only be written once.

  • Page 25: Antenna

    Small antennas and large bandwidth, high-quality performance is difficult to be achieved at the same time. Therefore, the clearance area of the antenna is an importance factor and is highly recommended to refer to the following pictures. Copyright 2023 Realtek Semiconductor Corporation. All Rights Reserved.

  • Page 26: Thimble Antenna

    PCB board should be greater than 10mm. In addition, for using a thimble antenna, the RF trace requires a DC block capacitor to prevent damage to the chip RF when soldering the thimble. Figure 12-2 Thimble antenna model Copyright 2023 Realtek Semiconductor Corporation. All Rights Reserved.

  • Page 27: Rf Circuit

    PCB antenna or chip antenna. The matching network in IC RF trace is also designed for harmonic suppression. It is strongly recommended to follow Realtek HDK instruction and choose the exact same products as those in QVL. Otherwise, the performance cannot be guaranteed.

  • Page 28: Rf Trace Impedance

    Different from other signal traces, the RF trace must be guarded with ground, so that it forms a CPWG guided wave structure. Any other traces must not be placed close to the RF trace. Otherwise, mutual coupling between traces will cause severe interference problem. Copyright 2023 Realtek Semiconductor Corporation. All Rights Reserved.

  • Page 29: Pcb Layout Guide

    4. The ground terminal of the 4.7uF capacitor should be close to the chip’s E-PAD to shorten the ground loop. If the space is sufficient, place more ground via around the ground pin of 4.7uF capacitor. Copyright 2023 Realtek Semiconductor Corporation. All Rights Reserved.
  • Page 30 There is no GND copper between the pads inductor body, which means keeping copper of wire wound inductor. 、 plane of the back layer (BOT) complete. (as yellow rectangular mark shown) Copyright 2023 Realtek Semiconductor Corporation. 、 All Rights Reserved.

  • Page 31: Power Bypass Capacitor Layout

    4. The bypass capacitor of the power supply should be placed close to the power pin. All of the power trace should go through capacitor first, then go into IC, and finally go outside for other branches. Capacitor Be sure to follow current flow direction Copyright 2023 Realtek Semiconductor Corporation. All Rights Reserved.

  • Page 32: External Flash & I8080

    14.4 External Flash & I8080 RTL8762D main clock is 90MHz maximum. The rate of Flash in QSPI mode is 45MHz, while the one of I8080 is 20MHz. These clock rates are relatively high. Hence, it is required to route matched length trace as much as possible when designing PCB.

  • Page 33: Rf Trace Layout

    Example: Select appropriate parameters according to the PCB maker’s capability and use the tool to calculate impedance (Zo). It is important to select all the parameters reasonably; otherwise, it may be necessary to seek a better PCB maker causing higher cost. Copyright 2023 Realtek Semiconductor Corporation. All Rights Reserved.
  • Page 34 4. The RF matching components must be as close to IC RFIO pin as possible. 5. The component and trace should be placed following the rules example below, and the RF trace should go straight forward and appropriately routed. It is shown below. Copyright 2023 Realtek Semiconductor Corporation. All Rights Reserved.
  • Page 35 10. The ground via of the RF components should be as close to the soldering pad as possible. GND Via should be connected to the GND layer directly instead of TOP layer. The copper grounding should be covered. Copyright 2023 Realtek Semiconductor Corporation. All Rights Reserved.

  • Page 36: 40Mhz Crystal Layout

    3. Crystal should be close to BT CHIP to keep a short routing path; the trace width should be at least 6mil. 4. If it is a 2-layer PCB, avoid tracing on the back layer of crystal, and try to keep a complete ground reference at the next reference layer (bottom side). Copyright 2023 Realtek Semiconductor Corporation. All Rights Reserved.

  • Page 37: Misc

    2. External Flash must be placed as close as possible to IC. CORRECT No copper between IC Pin PAD and EP PAD, and EP PAD should be connected to GND GND PAD must be directly connected to GND layer. layer by GND Via Copyright 2023 Realtek Semiconductor Corporation. All Rights Reserved.

  • Page 38: Esd Layout

    TVS tube and backflow GND. 2. When splitting the ground plane, pay attention to shortening the return path of signal trace, and wire with star topology to realize grounding in parallel. Copyright 2023 Realtek Semiconductor Corporation. All Rights Reserved.
  • Page 39 For layout, all connectors and board-edge wiring could be placed on one side of the PCB board edge, while ESD sensitive components could be placed in the center of PCB. Copyright 2023 Realtek Semiconductor Corporation. All Rights Reserved.

  • Page 40: Mp Test Points

    To match the mass production test platform, designers need to reserve the following test points during designing PCB. Table 14-1 MP Test Points Test point Source & Signal Description VBAT Power Ground LOG(P0_3) Debug and erase program TX/RX(P3_0/P3_1) Debug IC/Download port Copyright 2023 Realtek Semiconductor Corporation. All Rights Reserved.

  • Page 41: Layout Rules For Two-Layer Board

    5. Other layout guide is mentioned above (Just for reference, VDD1V2 might be short to ground if the PCB manufacturing technique is not good). 3.6mm RF_IQM Figure 15-1 Layout of two-layer board routing Copyright 2023 Realtek Semiconductor Corporation. All Rights Reserved.

  • Page 42: Esd Protection For Mp

    12. Apply antistatic liquid on loading board regularly. 13. PCBA semi-finished products must be placed on an insulating tray with separate grids. Only one PCBA per grid. In order to avoid CDM collision, it is prohibited to stack PCBA. Copyright 2023 Realtek Semiconductor Corporation. All Rights Reserved.

  • Page 43: Debug Process

    5. Check whether the log UART has an output or not. 6. Check whether the UART is available or not. 7. Check whether the external flash is working properly or not. (for the IC using external flash) Copyright 2023 Realtek Semiconductor Corporation. All Rights Reserved.

  • Page 44: Differences Between Rtl8762C&Rtl8762D

    RTL8762D Hardware Instruction 18 Differences between RTL8762C&RTL8762D 1. 40MHz Crystal request is changed, RTL8762D can only use crystal with CL=7/9pF. 2. Support 3 sets of SPIC interfaces, and the speed is faster. 3. RTL8762D RAM is greater than RTL8762C. 4. RTL8762D Maximum Clock 90MHz, while RTL8762C only 40MHz.

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