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TA-H6800E
Semiconductor Location
3-4.
PRINTED WIRING BOARDS—DSP/PIN JACK SECTION—
Refer to page 7 for Semiconductor Lead Layouts.
Ref. No. | Location | Ref. No. | Location
4
2
3
l
4
5
6
10
1
l
2
3
14
|
15
16
|
17
18
D105
Eg
1503
0501
E16
IC551
D502
E16
Ic601
[DSP BOARD] (COMPONENT SIDE)
D503
G16
Ic602
A
ma
D601
H6
1C603
D602
HS
1c604
0603
G5
Ic605
D604
G5
D605,
G3
Q301
D607
H3
302
D608
Ha
Q303
Q304
B
1C101
FQ
Q305
Ic102.
| F8
9306
1c103
| £8
Q307
Ic104
| £8
Q308
—
C201
BS
Q309
MONITOR BOAR]
Ic202
| G8
Q310
1301
| F7
Q313
1c302
| F-6
Q314
Cc
1c303
| G4
Q401
Ic304
| F4
Q402
1C305
F3
Q501
E17
1c306
| F3
Q503
F.13
1c310 | F7
Q504
F.13
Ic311 | GS
Q505
F.16
Ic401
| G2
Q506
G16
ic402
| G2
0551
| H10
D
Zl
Ic403.
| G1
Q553
G10
le
Tere -aeTe
(e501
| F15
Q601
G8
(cHAssis)
1c502__
| HIS
Q602
H5
Note:
E
©
o-——:
parts extracted from the component side.
.
@
= : Through hole.
{PIN JACK BOARD)
.
: Pattern on the side which is seen.
®
+ Pattern of the raer side. (PIN JACK Board)
@ Abbreviations
G : German model
IT: Italian model
F
G
H
(oHASSIS)
'CHS
'TO MICON
BOARD
ENT
|
=g=
—9—
—10—
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