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TA-H6800E
3-7.
PRINTED WIRING BOARDS—POWER/MICON/PANEL SECTION—
© Refer to page 7 for Semiconductor Lead Layouts.
© Semiconductor
1
2
l
3
4
5
6
id
8
9
10
11
2
B
14
15
5 —
Ll
*8
Location
Ref. No. | Location
D701
H4
A
0702
| 39
EXCEPT FOR CND MODEL,
CND_ MODEL
D754
115
[POWER BOARD]
LINLET BOARD)
I
[INLET BOARD)
D755
115,
a
7
D771
«| G3
D772)—s«|
:H2
D773——«|
1-2
oss)
p77a
| 2
B
D775
| 4
D776
J5
0777
8
0778
| 48
0779
| 37
0780
| J6
D901
C9
-
p902
| c9
D903
C9
p904
| C9
D905
| C8
p906
| C8
p90s_
| C8
D
(REG BOARD] _
pace,
| ka
ee
0910
B3
a
D911
B3
p912—|:
BS
D971
El
Ic701_
| H8
i
1702
| H7
10703
| HS
IC751 | H14
Ic901 | C10
e971,
| El
Q701
4
F
go01.
| Cl
Q902
| A10
Q903
| 09
4
|
Q904.
| 09
TPANEL BOARD]
i
mE
fecal]
905
| Ant
A
Q906
B4
6
(MICOM BOARD)
Q951
Bll
i$)
f
Note:
fs
zy
@
© ~o-—— : parts extracted from the component side
ie
cs
°
@
=: Through hole.
HY
aaca
pa,
.
Pattern on the side which is seen.
'MENU
iS
e
: Pattern of the rear side.
© Abbreviations
10 os
G — : German model
eo
IT: Italian model
EA: Saudi Arabia model
|
2
AUS : Australian model
JE:
Tourist model
MY : Malaysia model
Ea
i
@
SP: Singapore model
/
:
cS
=
;
.
CND: Canadian model
s
=
2
J
:
Tae
a
i
ot
Lee
—21—
—22—
—23—
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