Motorola iDEN i930 Field Service Manual page 106

5. Get the new component ready by placing it over a thin film of flux.
6. Protect any heat-sensitive component by placing appropriate Heat Shield over (If necessary)
7. Lower the nozzle and evenly apply heat until reflow of all solder joints is observed.
8. Immediately remove component before solder joints re-solidifies.
9. Release faulty component onto a heat resistant surface.
10. Check for component disturbance before proceed and fix it if necessary.
9.7.2 Land Preparation Procedure
11. Swing out the top heater and maintain the board over the bottom heater.
12. Apply flux to the lands.
13. Remove all remaining solder with a Chisel tip and braided solder wicking material without
pressing down to avoid solder mask removal.
14. Clean lands of flux residue.
9.7.3 Component Installation Procedure
15. Lower air pressure to Minimal specification.
16. Pick the new component and place it over the lands as per overlay or Pedro.
17. Swing in microscope to aid on component alignment.
18. Align component and swing microscope out.
19. Lower the nozzle and evenly apply heat
20. Gradually increase air pressure up to Maximum specification until part self-alignment is
observed.
21. Raise nozzle and stop heat cycle.
22. Allow solder to re-solidify.
23. Cool off PC board using bench fan.
24. Inspect solder joints and adjacent components under Microscope.
Do not bump or knock the part during or after re-flow.
NOTE:
68P80401P03-O
MECHANICAL PARTS REWORK AND REPAIR: BGA Rework/Repair Procedure
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